JPH0128680Y2 - - Google Patents
Info
- Publication number
- JPH0128680Y2 JPH0128680Y2 JP1982052872U JP5287282U JPH0128680Y2 JP H0128680 Y2 JPH0128680 Y2 JP H0128680Y2 JP 1982052872 U JP1982052872 U JP 1982052872U JP 5287282 U JP5287282 U JP 5287282U JP H0128680 Y2 JPH0128680 Y2 JP H0128680Y2
- Authority
- JP
- Japan
- Prior art keywords
- spool
- wire
- winding
- flange
- holder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
Landscapes
- Manufacturing Of Electric Cables (AREA)
- Winding Filamentary Materials (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5287282U JPS58155837U (ja) | 1982-04-12 | 1982-04-12 | 半導体用ボンデイングワイヤ−スプ−ル |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5287282U JPS58155837U (ja) | 1982-04-12 | 1982-04-12 | 半導体用ボンデイングワイヤ−スプ−ル |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58155837U JPS58155837U (ja) | 1983-10-18 |
| JPH0128680Y2 true JPH0128680Y2 (cs) | 1989-08-31 |
Family
ID=30063565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5287282U Granted JPS58155837U (ja) | 1982-04-12 | 1982-04-12 | 半導体用ボンデイングワイヤ−スプ−ル |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58155837U (cs) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5554941U (cs) * | 1978-10-11 | 1980-04-14 | ||
| JPS55151346A (en) * | 1979-05-16 | 1980-11-25 | Toshiba Corp | Container for winding metallic fine wire |
-
1982
- 1982-04-12 JP JP5287282U patent/JPS58155837U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58155837U (ja) | 1983-10-18 |
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