JPH01286491A - Both-side patterned board circuit - Google Patents

Abstract

PURPOSE:To enable conductive patterns formed on both the top and rear faces of a substrate to be connected with each other very efficiently at a low cost while utilizing the area of the substrate with high efficiency by inserting a conductive wire through a through hole formed in the substrate close to a land for surface packaging component, so that one end of the conductive wire is soldered to a short-circuiting land while the other end is connected to a conducting end of a surface packaging component. CONSTITUTION:A through hole 16 is formed through a substrate 11 close to a land 15 on which a surface packaging component is to be packaged. A short- circuiting land 17 is provided on the periphery of the through hole 16 on the rear face of the substrate 11. Further, a conductive wire 18 is welded or fusion bonded to the end 13a of a surface packaging component 13 serving as an I/O terminal. The conductive wire 18 is inserted through the through hole 16 when the surface packaging component 13 is disposed on the land 15. The conductive wire 18 inserted through the through hole 16 is soldered to the short- circuiting land 17 formed on the periphery of the through hole 16, while the conducting terminal 13a of the surface packaging component is soldered to the land 15.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a double-sided pattern board circuit in which conductive patterns formed on both the front and back surfaces of a board are connected to each other by component lead wires without using through-hole plating.

BACKGROUND ART When electrically connecting the conductive pattern on the front side and the conductive pattern on the back side of a substrate with conductive patterns formed on both the front and back sides, conventionally, a through hole reaching from the front side to the back side of the substrate is used. Alternatively, as shown in FIG. Insert the shorting conductive wire 3 into the through hole 2 from the surface side.
The conductive pattern 5 formed on both the front and back surfaces of the board is soldered to the land portion 6 of the conductive pattern 5 formed on the periphery of the board and the shorting conductive wire 3 on both the front and back surfaces of the board.
were connecting them.

However, as mentioned above, when plating the through holes with metal,
It required a complicated plating process, making it difficult to reduce costs. In addition, when shorting conductive wires are used, the through holes and the lands around them, which are provided only for connecting the conductive patterns formed on both the front and back surfaces, reduce the efficiency of using the board area.
In order to connect conductive patterns to each other, a shorting conductive wire had to be inserted through a through hole and soldered to the shorting conductive wire, resulting in low work efficiency.

SUMMARY OF THE INVENTION Therefore, in view of the above-mentioned circumstances, the present invention provides a double-sided patterned substrate that can connect conductive patterns formed on both the front and back surfaces of the substrate with high utilization efficiency of a large substrate area, low cost, and high work efficiency. The purpose is to provide circuits.

In order to achieve the above-mentioned object, the double-sided pattern board circuit according to the present invention includes a surface mount component land in which the conductive end of the surface mount component is soldered to the front or back surface of the board having conductive patterns on both the front and back surfaces. A through hole is formed in the board near the surface mount component land, reaching from the front surface to the back surface, and a short circuit land is provided around the through hole on the surface opposite to the surface on which the surface mount component is mounted. A conductive wire is connected to the conductive end of the surface mount component, and at the same time as the surface mount component is placed on the surface mount component land, the conductive wire is inserted into the through hole to connect the conductive end of the surface mount component to the surface mount component. It is characterized by soldering the parts land, the conductive wire, and the short circuit land.

EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIG.

As shown in FIG. 1, in the double-sided pattern board circuit according to the present invention, a conductive pattern 12 is formed on both the front and back surfaces of a board 1, and a surface called a chip component is formed on the front surface of the board 11. A surface mount component land 15 is formed to which a conductive end 13a functioning as an input/output terminal of the mount component 13 is soldered. A through hole 16 extending from the front surface to the back surface of the board 11 is bored in the vicinity of the surface mount component land 15, and a shorting land 17 is provided around the periphery of the through hole 16 on the back surface of the board 11.

On the other hand, a conductive wire 18 is welded or welded to a conductive end portion 13a functioning as an input/output terminal of the surface mount component 13. The conductive wire 18 is inserted into the through hole 16 at the same time that the surface mount component 13 is placed on the land 15 for surface mount component.

The conductive wire 18 inserted into the through hole 16 is soldered to a shorting land 17 formed on the periphery of the through hole 16.
The conductive end portion 13a of the surface mount component 13 is soldered to the surface mount component land 15.

Therefore, the conductive patterns 12 formed on both the front and back surfaces of the substrate 11 are connected to each other via the conductive wire 18 and the conductive end portion 13a of the surface-mounted component 13.

As described in detail, the double-sided pattern board circuit according to the present invention is suitable for surface mount components in which the conductive ends of the surface mount components are soldered to the front or back surface of a board having conductive patterns on both the front and back surfaces. forming a land, providing a through hole reaching from the front surface to the back surface of the board near the land for the surface mount component, and providing a land for short circuiting at the periphery of the through hole on the surface opposite to the surface on which the surface mount component is mounted; A conductive wire is connected to the conductive end of the surface mount component, and at the same time as the surface mount component is placed on the surface mount component land, the conductive wire is inserted into the through hole to connect the conductive end of the surface mount component to the surface. Since the land for mounted components, the conductive wire, and the land for shorting are soldered, it is easy to connect the conductive patterns formed on both the front and back surfaces of the board. This can be done by using a conductive wire inserted into one insertion hole at the same time as the component is mounted, and unlike conventional methods, a through hole is provided in the board and the through hole is plated with metal, or a conductive wire for shorting is inserted. With two through holes for insertion, it is no longer necessary to insert shorting conductive wires through the holes separately from the electronic components mounted on the board, improving the efficiency of board area utilization, reducing costs, and improving work efficiency. is achieved.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an embodiment of a double-sided pattern board circuit according to the present invention, and FIG. 2 is a sectional view showing a conventional double-sided pattern board circuit. Explanation of symbols of main parts 1, 11...Substrate 2...Through hole 3...Short-circuiting conductive wire 5,]2...Conductive pattern 6 ... Land portion 13 ... Surface mount component 13a ... Conductive end portion 15 ... Land for surface mount component 16 ... Through hole 17 ...Short circuit land 18...Conductive wire Applicant: Pioneer Corporation

Claims (1)

[Claims] A double-sided pattern board that has a conductive pattern on both the front and back surfaces and includes a land for surface mount components in the pattern on at least one of the front and back surfaces, and the conductive end of the board is soldered to the land for surface mount components. A double-sided pattern board circuit including a surface mount component and a surface mount component land, wherein a through hole without through-hole plating reaching from the front surface to the back surface is provided in the vicinity of the land for the surface mount component, and the through hole is provided in the pattern on the other surface. A shorting land surrounding the periphery is provided, a conductive wire is inserted into the through hole, one end of which is soldered to the shorting land, and the other end is connected to the conductive end of the surface mount component. Features a double-sided pattern board circuit.