JPH0127572B2 - - Google Patents

Info

Publication number
JPH0127572B2
JPH0127572B2 JP53104353A JP10435378A JPH0127572B2 JP H0127572 B2 JPH0127572 B2 JP H0127572B2 JP 53104353 A JP53104353 A JP 53104353A JP 10435378 A JP10435378 A JP 10435378A JP H0127572 B2 JPH0127572 B2 JP H0127572B2
Authority
JP
Japan
Prior art keywords
etching
conductive layer
substrate
electrical wiring
pole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP53104353A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5531639A (en
Inventor
Kunihiko Kanda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP10435378A priority Critical patent/JPS5531639A/ja
Publication of JPS5531639A publication Critical patent/JPS5531639A/ja
Publication of JPH0127572B2 publication Critical patent/JPH0127572B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP10435378A 1978-08-29 1978-08-29 Forming method for electric wiring Granted JPS5531639A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10435378A JPS5531639A (en) 1978-08-29 1978-08-29 Forming method for electric wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10435378A JPS5531639A (en) 1978-08-29 1978-08-29 Forming method for electric wiring

Publications (2)

Publication Number Publication Date
JPS5531639A JPS5531639A (en) 1980-03-06
JPH0127572B2 true JPH0127572B2 (enrdf_load_stackoverflow) 1989-05-30

Family

ID=14378507

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10435378A Granted JPS5531639A (en) 1978-08-29 1978-08-29 Forming method for electric wiring

Country Status (1)

Country Link
JP (1) JPS5531639A (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58141531A (ja) * 1982-02-18 1983-08-22 Toshiba Corp 半導体素子用金属薄膜エツチング装置
EP0171195B1 (en) * 1984-07-09 1991-01-02 Sigma Corporation Method for detecting endpoint of development
JP2509572B2 (ja) * 1985-08-19 1996-06-19 株式会社東芝 パタ−ン形成方法及び装置
US6378199B1 (en) 1994-05-13 2002-04-30 Dai Nippon Printing Co., Ltd. Multi-layer printed-wiring board process for producing
JP5544997B2 (ja) * 2010-04-12 2014-07-09 富士電機株式会社 半導体装置の製造方法および半導体装置の製造装置。

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5387667A (en) * 1977-01-12 1978-08-02 Hitachi Ltd Detecting method for etching end point of non-conductive film

Also Published As

Publication number Publication date
JPS5531639A (en) 1980-03-06

Similar Documents

Publication Publication Date Title
US3949275A (en) Electric thin-film circuit and method for its production
JPH0127572B2 (enrdf_load_stackoverflow)
KR100316987B1 (ko) 땜납과주석을인쇄회로기판으로부터제거하는조성물및방법
JPS5546568A (en) Method of fabricating semicondcuctor device
JP3473063B2 (ja) シリコン基板の洗浄方法
JPS6326537B2 (enrdf_load_stackoverflow)
US3042593A (en) Electrochemical method for cleansing semiconductive devices
US3388047A (en) Controlled electrolytic treatment of materials
JPS6326538B2 (enrdf_load_stackoverflow)
JPS58141531A (ja) 半導体素子用金属薄膜エツチング装置
US2958633A (en) Manufacture of semi-conductor devices
JPH08241882A (ja) 溶液の質をモニターする方法
US3531378A (en) Process for oxidizing tellurium
GB1232126A (enrdf_load_stackoverflow)
JPS5562737A (en) Wiring method for semiconductor element
US3716428A (en) Method of etching a metal which can be passivated
JPH0144014B2 (enrdf_load_stackoverflow)
CA1042773A (en) Method of etching a surface of a substrate comprising linbo3
US3531377A (en) Process for the oxidation of gallium-arsenide
US3357902A (en) Use of anodizing to reduce channelling on semiconductor material
JPS58118115A (ja) パタ−ンの形成方法
JPS59123235A (ja) 金属配線形成用エツチング装置
KR950000848B1 (ko) 초고집적 회로의 배리어 금속 형성방법
JPS5832498B2 (ja) ハンドウタイソウチ ノ セイゾウホウホウ
Miwa et al. New Method in Fabrication of Tantalum Thin-Film Integrated Circuits