JPH0127565Y2 - - Google Patents
Info
- Publication number
- JPH0127565Y2 JPH0127565Y2 JP4833984U JP4833984U JPH0127565Y2 JP H0127565 Y2 JPH0127565 Y2 JP H0127565Y2 JP 4833984 U JP4833984 U JP 4833984U JP 4833984 U JP4833984 U JP 4833984U JP H0127565 Y2 JPH0127565 Y2 JP H0127565Y2
- Authority
- JP
- Japan
- Prior art keywords
- core
- enamel
- exposed
- metal
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4833984U JPS60160472U (ja) | 1984-04-02 | 1984-04-02 | ほうろう基板の接地構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4833984U JPS60160472U (ja) | 1984-04-02 | 1984-04-02 | ほうろう基板の接地構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60160472U JPS60160472U (ja) | 1985-10-25 |
| JPH0127565Y2 true JPH0127565Y2 (cs) | 1989-08-18 |
Family
ID=30564501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4833984U Granted JPS60160472U (ja) | 1984-04-02 | 1984-04-02 | ほうろう基板の接地構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60160472U (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0648900Y2 (ja) * | 1988-04-05 | 1994-12-12 | 本田技研工業株式会社 | 回路基板 |
-
1984
- 1984-04-02 JP JP4833984U patent/JPS60160472U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60160472U (ja) | 1985-10-25 |
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