JPH0127565Y2 - - Google Patents

Info

Publication number
JPH0127565Y2
JPH0127565Y2 JP4833984U JP4833984U JPH0127565Y2 JP H0127565 Y2 JPH0127565 Y2 JP H0127565Y2 JP 4833984 U JP4833984 U JP 4833984U JP 4833984 U JP4833984 U JP 4833984U JP H0127565 Y2 JPH0127565 Y2 JP H0127565Y2
Authority
JP
Japan
Prior art keywords
core
enamel
exposed
metal
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP4833984U
Other languages
Japanese (ja)
Other versions
JPS60160472U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4833984U priority Critical patent/JPS60160472U/en
Publication of JPS60160472U publication Critical patent/JPS60160472U/en
Application granted granted Critical
Publication of JPH0127565Y2 publication Critical patent/JPH0127565Y2/ja
Granted legal-status Critical Current

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  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Description

【考案の詳細な説明】 「産業上の利用分野」 本考案は、ほうろう基板の接地構造に係り、特
にほうろう基板を接地する作業と機構部材の取り
付け作業とを同時に行なう場合に好適な接地構造
に関するものである。
[Detailed description of the invention] "Field of industrial application" The present invention relates to a grounding structure for an enamel substrate, and particularly to a grounding structure suitable for the case where the work of grounding the enamel board and the work of attaching mechanical members are performed simultaneously. It is something.

「従来技術」 いわゆるほうろう基板は、第1図例に示すよう
に、金属コア(通常はほうろう用鋼板)1の表面
をほうろうエナメル層2で覆つた構造であり、ほ
うろうエナメル層2の上に厚膜回路技術等により
印刷、焼成した電気回路導体3等を搭載して、耐
熱性、耐薬品性に優れたプリント回路板として使
用されるものである。この場合、電気回路の安定
性、低ノイズ特性等の点で、金属コア1を接地す
ることが有効である。すなわち、第1図例である
と、ほうろうエナメル層2をサンドブラスト等の
方法で除去し、金属コア1の一部を露出させると
ともに、この露出面4にニツケルめつき等を施し
た後、さらに、接地用リード線5をはんだ6等に
より接続した接地構造である。
``Prior Art'' As shown in the example in Figure 1, a so-called enamel substrate has a structure in which the surface of a metal core (usually a steel plate for enamel) 1 is covered with an enamel layer 2. It is used as a printed circuit board with excellent heat resistance and chemical resistance by mounting electric circuit conductors 3 etc. printed and fired using film circuit technology or the like. In this case, it is effective to ground the metal core 1 in terms of stability of the electric circuit, low noise characteristics, etc. That is, in the example shown in FIG. 1, the enamel layer 2 is removed by a method such as sandblasting, a part of the metal core 1 is exposed, and the exposed surface 4 is plated with nickel, and then, This is a grounding structure in which a grounding lead wire 5 is connected with solder 6 or the like.

しかしながら、このような構造であると、サン
ドブラスト処理をする際に、電気回路導体3の損
傷を防止するためのマスキング作業が必要となる
とともに、ほうろう基板を機構部品等に取り付け
るときは、接地用リード線5を機構部品に接続す
る作業が伴い、工程数が増加してコストアツプを
招くという等の問題点があつた。
However, with this structure, masking work is required to prevent damage to the electric circuit conductor 3 during sandblasting, and when attaching the enamel board to mechanical parts, etc., it is necessary to use a grounding lead. There were problems such as the work involved in connecting the wire 5 to the mechanical parts, which increased the number of steps and increased costs.

「考案の目的」 本考案は前記事情に鑑みてなされたもので、ほ
うろう基板の取り付け作業と接地作業とを同時に
実施して作業性を高めるとともに、ほうろうエナ
メル層にクラツチが発生する等の現象を有効に防
止することを目的とするものである。
``Purpose of the invention'' The present invention was developed in view of the above circumstances, and it improves work efficiency by simultaneously carrying out the work of attaching the enamel board and the grounding work, and also prevents phenomena such as clutches occurring in the enamel enamel layer. The purpose is to effectively prevent this.

「考案の構成」 これらの目的を達成するため本考案は、貫通孔
を有する金属コアの少なくとも片面に貫通孔に連
続するコア露出部を設け、このコア露出部の反対
面に金属構成部材を緊密な接触状態に配設すると
ともに、金属構成部材と一体にコア露出部を圧接
する電気接続部を設けるごとくしたものである。
"Structure of the invention" In order to achieve these objects, the present invention provides a core exposed portion continuous to the through hole on at least one side of a metal core having a through hole, and a metal component is tightly attached to the opposite side of the exposed core portion. In addition, an electrical connection portion is provided that presses the exposed core portion integrally with the metal component.

「実施例」 以下、本考案の一実施例を図面に基づいて説明
する。第2図に示すように、一実施例に係るほう
ろう基板にあつては、金属コア1に貫通孔11が
設けられるとともに、この貫通孔11の中、およ
び金属コア1の片面に、ほうろうエナメル層2で
覆つていない面、コア露出部12が設けられ、さ
らに、このコア露出部12が設けられていないほ
うろうエナメル層2の他の面(第2図例では下表
面)に、緊密接触状態の金属機構部材13が設け
られ、この金属機構部材13の一部が前記コア露
出部12を圧接する構造である。
“Embodiment” An embodiment of the present invention will be described below based on the drawings. As shown in FIG. 2, in the enamel substrate according to one embodiment, a through hole 11 is provided in the metal core 1, and an enamel enamel layer is formed inside the through hole 11 and on one side of the metal core 1. 2, the core exposed portion 12 is provided, and the other surface of the enamel enamel layer 2 where the core exposed portion 12 is not provided (the lower surface in the example in FIG. 2) is in close contact. A metal mechanism member 13 is provided, and a part of this metal mechanism member 13 is in pressure contact with the core exposed portion 12.

すなわち、前記貫通孔11は、予め金属コア1
に形成しておくものであるが、通常のほうろう掛
けの際に、貫通孔11の中にもほうろうエナメル
が付着して焼成されるため、コア露出部12の形
成作業と同時に、貫通孔11内のほうろうエナメ
ルの除去がなされる。つまり、コア露出部12の
形成作業は、ほうろう基板の少なくとも片面でか
つ貫通孔11の周囲に焼成されたほうろうエナメ
ル層2をダイアモンド研削砥石等により除去し
て、コア露出部12とするとともに、同様に貫通
孔11内のほうろうエナメルも除去して金属コア
1が露出した状態とし、これらがコア露出部12
に連続した状態とする。このような処理を施すこ
とにより、貫通孔11の内面等の機械的精度を向
上させることができる。
That is, the through hole 11 is formed in advance by the metal core 1.
However, during normal enameling, the enamel adheres to the inside of the through hole 11 and is fired, so the inside of the through hole 11 is heated at the same time as the core exposed portion 12 is formed. Removal of the enamel is done. In other words, the core exposed portion 12 is formed by removing the fired enamel enamel layer 2 on at least one side of the enamel substrate and around the through hole 11 using a diamond grinding wheel or the like to form the core exposed portion 12, and The enamel in the through hole 11 is also removed to expose the metal core 1, and these are exposed as the core exposed portion 12.
The state is continuous. By performing such processing, the mechanical precision of the inner surface of the through hole 11, etc. can be improved.

一方、金属構成部材13は、フランジ部14
に、コア露出部12が設けられていない方のほう
ろう基板の他の面(第2図例の下面)に緊密に接
触してこれを支持するフランジ面等の支持部15
が設けられるとともに、支持部15から突出して
貫通孔11に挿入される円筒部16が設けられ、
この円筒部16の外径は貫通孔11と精密な嵌合
をする程度とされるとともに、その長さ寸法は貫
通孔11の深さより若干大きく設定される。さら
に、円筒部16の外周部をかしめる等により、コ
ア露出部12に密接状態の電気接続部17が設け
られて、支持部15と電気接続部17とによりほ
うろう基板を挟持した構造である。なお、円筒部
16の中心には、金属構成部材13がモータの軸
受である場合、軸受孔18が設けられる。
On the other hand, the metal component 13 has a flange portion 14
A support portion 15 such as a flange surface that closely contacts and supports the other surface of the enamel substrate on which the exposed core portion 12 is not provided (the lower surface in the example of FIG. 2).
is provided, and a cylindrical portion 16 that protrudes from the support portion 15 and is inserted into the through hole 11 is provided,
The outer diameter of the cylindrical portion 16 is set to such an extent that it can be precisely fitted into the through hole 11, and its length is set to be slightly larger than the depth of the through hole 11. Furthermore, by caulking the outer periphery of the cylindrical portion 16 or the like, an electrical connection portion 17 is provided in the exposed core portion 12 in a close state, and the enamel substrate is sandwiched between the support portion 15 and the electrical connection portion 17. Note that a bearing hole 18 is provided at the center of the cylindrical portion 16 when the metal component 13 is a bearing for a motor.

また、コア露出部12および金属構成部材13
の上には、これらにまたがつて、導電または防錆
用処理被膜19が設けられる。このような処理被
膜19は、導電、防錆兼用である場合、例えば高
温焼成タイプの導電ペースト、常温乾燥タイプの
導電ペースト、ニツケルめつき等であり、防錆を
主目的とする場合は、防錆塗料、防錆油等が使用
される。
In addition, the core exposed portion 12 and the metal component 13
A conductive or rust-preventing treated film 19 is provided on and across these. When such a treated film 19 is used for both conductivity and rust prevention, for example, it is a high temperature firing type conductive paste, room temperature drying type conductive paste, nickel plating, etc., and when the main purpose is rust prevention, it is Rust paint, anti-rust oil, etc. are used.

また、金属構成部材13が接地部品である場合
は、コア露出部12と電気接続部17との接触と
同時に、鎖線で示すごとく金属コア1の接地がな
されることになる。
Further, when the metal component 13 is a grounding component, the metal core 1 is grounded as shown by the chain line at the same time as the exposed core portion 12 and the electrical connection portion 17 come into contact.

なお、コア露出部12の形成作業の後に、電気
回路導体3を設ける工程がある場合、コア露出部
12に導電ペーストを印刷、焼成するようにして
もよい。
Note that if there is a step of providing the electric circuit conductor 3 after forming the core exposed portion 12, a conductive paste may be printed and fired on the core exposed portion 12.

「考案の効果」 以上説明したように本考案によれば、次のよう
な効果を奏することができる。
"Effects of the Invention" As explained above, according to the present invention, the following effects can be achieved.

(a) 金属コアに金属構成部材の電気的接続が圧接
状態に配設された構造となるため、構成部材の
取り付け作業と同時に電気的接続を行ない得
て、作業性を向上させ、また、広い範囲の分野
に適用することができる。
(a) Since the electrical connections of the metal components are placed in pressure contact with the metal core, electrical connections can be made at the same time as the installation of the components, improving work efficiency and Can be applied to a range of fields.

(b) コア露出部を電気的接続によつて圧接する構
造であり、ほうろうエナメル層と分離されるか
ら、ほうろうエナメル層のクラツク発生を防止
することができる。
(b) It has a structure in which the exposed core portion is pressed into contact with the core through electrical connection, and is separated from the enamel layer, thereby preventing the occurrence of cracks in the enamel layer.

(c) 貫通孔およびコア露出部を利用して組み立て
られているため、組立精度を向上させることが
できる。
(c) Assembly accuracy can be improved because the through-hole and core exposed portion are used for assembly.

【図面の簡単な説明】[Brief explanation of drawings]

第1図はほうろう基板の接地構造の従来例を示
す一部を省略した正断面図、第2図は本考案の一
実施例を示す一部を省略した正断面図である。 1……金属コア、2……ほうろう基板、3……
電気回路導体、11……貫通孔、12……コア露
出部、13……金属構成部材、15……支持部、
17……電気接続部、19……処理被膜。
FIG. 1 is a partially omitted front sectional view showing a conventional example of a grounding structure for an enamel substrate, and FIG. 2 is a partially omitted front sectional view showing an embodiment of the present invention. 1... Metal core, 2... Enamel substrate, 3...
Electric circuit conductor, 11... Through hole, 12... Core exposed part, 13... Metal component, 15... Support part,
17...Electrical connection portion, 19...Treatment film.

Claims (1)

【実用新案登録請求の範囲】 (1) 金属コア1の表面をほうろうエナメル層2で
覆つてなるほうろう基板において、金属コアの
少なくとも片面に貫通孔11に連続するコア露
出部12を設け、このコア露出部の反対面に金
属構成部材13を緊密接触状態に配設するとと
もに、該金属構成部材と一体にコア露出部を圧
接状態に支持する電気接続部17を設けたこと
を特徴とするほうろう基板の接地構造。 (2) コア露出部12および電気接続部13の上
に、導電または防錆用処理被膜19を設けたこ
とを特徴とする実用新案登録請求の範囲第1項
記載のほうろう基板の接地構造。
[Claims for Utility Model Registration] (1) In an enamel substrate formed by covering the surface of a metal core 1 with an enamel layer 2, a core exposed portion 12 continuous to a through hole 11 is provided on at least one side of the metal core, and the core An enamel substrate characterized in that a metal component 13 is disposed in close contact with the opposite surface of the exposed portion, and an electrical connection portion 17 is provided integrally with the metal component to support the exposed core portion in pressure contact. grounding structure. (2) The grounding structure for an enamel substrate according to claim 1, which is characterized in that a conductive or rust-preventing treated coating 19 is provided on the exposed core portion 12 and the electrical connection portion 13.
JP4833984U 1984-04-02 1984-04-02 Grounding structure of enamel board Granted JPS60160472U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4833984U JPS60160472U (en) 1984-04-02 1984-04-02 Grounding structure of enamel board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4833984U JPS60160472U (en) 1984-04-02 1984-04-02 Grounding structure of enamel board

Publications (2)

Publication Number Publication Date
JPS60160472U JPS60160472U (en) 1985-10-25
JPH0127565Y2 true JPH0127565Y2 (en) 1989-08-18

Family

ID=30564501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4833984U Granted JPS60160472U (en) 1984-04-02 1984-04-02 Grounding structure of enamel board

Country Status (1)

Country Link
JP (1) JPS60160472U (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0648900Y2 (en) * 1988-04-05 1994-12-12 本田技研工業株式会社 Circuit board

Also Published As

Publication number Publication date
JPS60160472U (en) 1985-10-25

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