JPH01275066A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH01275066A JPH01275066A JP10521888A JP10521888A JPH01275066A JP H01275066 A JPH01275066 A JP H01275066A JP 10521888 A JP10521888 A JP 10521888A JP 10521888 A JP10521888 A JP 10521888A JP H01275066 A JPH01275066 A JP H01275066A
- Authority
- JP
- Japan
- Prior art keywords
- cover
- release plate
- heat release
- substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 abstract description 4
- 230000007797 corrosion Effects 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
口産業上の利用分野〕
本発明はサーマルヘッドに関し、特に、サーマルヘッド
基板に搭載されているＩＣ保護用の金属カバーの固定方
法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a thermal head, and particularly to a method for fixing a metal cover for protecting an IC mounted on a thermal head substrate.
σ従来の技術〕
従来のサーマルヘラＦは、サーマルヘッドの基板に搭載
されている９ス動用ＩＣを外部の機械的外力から保護す
る金属のカバーを固定する際、放熱板へ導電性の金属ね
じを用いてねじ止めしており、放熱板とカバーは導通さ
れた状態となっていた。σConventional technology] The conventional thermal spatula F attaches a conductive metal screw to the heat sink when fixing the metal cover that protects the 9-slide IC mounted on the board of the thermal head from external mechanical force. The heat dissipation plate and cover were electrically connected.
上述した従来のサーマルヘッドは、基板上に設けられた
。ＴＣ保護用のカバーの電位は放熱板の電位（−数的に
はグラウンド電位）と等しくなって５・る。一方、基板
上の配線層の電位は、グラウンド電位からサーマルヘッ
ドの電源電圧程度まで変動する。この為、配線層がＡ１
１等の腐食しやすい物質である場合、電解腐食の発生す
る確率が極めて高くなるという欠点がある。The conventional thermal head described above was provided on a substrate. The potential of the TC protective cover is equal to the potential of the heat sink (-numerically ground potential), which is 5. On the other hand, the potential of the wiring layer on the substrate varies from the ground potential to about the power supply voltage of the thermal head. For this reason, the wiring layer is A1
If the material is a material that is easily corroded, such as No. 1, there is a drawback that the probability of electrolytic corrosion occurring is extremely high.
本発明のサーマルヘッドは、基板上のＩＣ保護用の金属
カバーを放熱板に固定する際、プラスチックねじて固定
したり、非導電性の両面テープ又は接着剤により接、管
固定している。In the thermal head of the present invention, when the metal cover for protecting the IC on the board is fixed to the heat sink, it is fixed with plastic screws, or it is fixed with a non-conductive double-sided tape or adhesive, or with a tube.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例の側面図である。FIG. 1 is a side view of a first embodiment of the invention.
第１図において、放熱板１上に、基板２及びプリント板
４が配置されており、また、基板２には発熱体（図示せ
ず）と発熱体を駆動する為のＩＣチップ３が搭載されて
いる。ＩＣチップ３を機械的な外力から保護するための
カバー５が、プリント板４をはさんでねじ６により放熱
板ｌにねじ止めされているが、ねじ６は、金属カバー５
と金属放熱板１とを電気的に絶縁するためにプラスチッ
クのねじとしている。In FIG. 1, a substrate 2 and a printed board 4 are arranged on a heat sink 1, and a heating element (not shown) and an IC chip 3 for driving the heating element are mounted on the substrate 2. ing. A cover 5 for protecting the IC chip 3 from mechanical external force is screwed to the heat sink l with screws 6 across the printed board 4.
Plastic screws are used to electrically insulate the heat sink and the metal heat sink 1.
第２図は本発明の第２の実施例の側面図で、カバー５は
接着層７（両面テープ又は接着剤）を介してプリント板
４に固定されており、第１の実施例と同じく、カバー５
は放熱板ｌと絶縁されている。FIG. 2 is a side view of the second embodiment of the present invention, in which the cover 5 is fixed to the printed board 4 via an adhesive layer 7 (double-sided tape or adhesive), and as in the first embodiment, cover 5
is insulated from the heat sink l.
以上説明したように本発明は、放熱板とカバーを電気的
に絶縁することにより、配線腐食を低減でき、サーマル
ヘッドの信頼性を向上できる効果がある。As described above, the present invention has the effect of reducing wiring corrosion and improving the reliability of the thermal head by electrically insulating the heat sink and the cover.
第１図は本発明の第１の実施例の側面図、第２図は本発
明の第２の実施例の側面図である。
１・・・・・・放熱板、２・・・・・・基板、３・・・
・・・ＩＣチップ、４・・・・・・プリント板、５・・
・・・・カバー、６・・・・・・プラスチックねじ、７
・・・・・・接着層。
代理人 弁理士 内 原 音FIG. 1 is a side view of a first embodiment of the invention, and FIG. 2 is a side view of a second embodiment of the invention. 1... Heat sink, 2... Board, 3...
...IC chip, 4...Printed board, 5...
...Cover, 6...Plastic screw, 7
...Adhesive layer. Agent Patent Attorney Oto Uchihara
Claims (1)
性のカバーによりはさみ込まれた構造のサーマルヘッド
において、前記放熱板と前記カバーが電気的に絶縁され
ていることを特徴とするサーマルヘッド。A thermal head having a structure in which a substrate on which a heating element is formed is sandwiched between a metal heat sink and a metal cover, characterized in that the heat sink and the cover are electrically insulated. head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10521888A JPH01275066A (en) | 1988-04-26 | 1988-04-26 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10521888A JPH01275066A (en) | 1988-04-26 | 1988-04-26 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01275066A true JPH01275066A (en) | 1989-11-02 |
Family
ID=14401529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10521888A Pending JPH01275066A (en) | 1988-04-26 | 1988-04-26 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01275066A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1052102A1 (en) * | 1998-01-30 | 2000-11-15 | Rohm Co., Ltd. | Thermal printing head and protective cover used for the same |
-
1988
- 1988-04-26 JP JP10521888A patent/JPH01275066A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1052102A1 (en) * | 1998-01-30 | 2000-11-15 | Rohm Co., Ltd. | Thermal printing head and protective cover used for the same |
| EP1052102A4 (en) * | 1998-01-30 | 2001-05-02 | Rohm Co Ltd | Thermal printing head and protective cover used for the same |
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