JPH01268183A - Metal base printed circuit board with radiation fin - Google Patents
Metal base printed circuit board with radiation finInfo
- Publication number
- JPH01268183A JPH01268183A JP9717588A JP9717588A JPH01268183A JP H01268183 A JPH01268183 A JP H01268183A JP 9717588 A JP9717588 A JP 9717588A JP 9717588 A JP9717588 A JP 9717588A JP H01268183 A JPH01268183 A JP H01268183A
- Authority
- JP
- Japan
- Prior art keywords
- fin
- metal
- printed circuit
- circuit board
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 title claims abstract description 27
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 27
- 230000005855 radiation Effects 0.000 title claims abstract description 12
- 239000010953 base metal Substances 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 abstract description 3
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 21
- 239000000758 substrate Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、放熱フィン付金属ベースプリント配線板に
関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal-based printed wiring board with radiation fins.
従来の金属ベースプリント配線板は、第２図にその一例
を示すような断面形状をしており、使用時の組合せ構成
として放熱フィンを接合した状態の一例の破断断面図を
第３図に示す。両図において、１は金属ベースプリント
配線板（基板）で、ベース金属２の片面に、絶縁層３を
介して導電体４が固着されて一体化されている。A conventional metal-based printed wiring board has a cross-sectional shape as shown in Fig. 2, and Fig. 3 shows a cutaway cross-sectional view of an example of the combined configuration in use with heat dissipation fins joined. . In both figures, 1 is a metal base printed wiring board (substrate), and a conductor 4 is fixed to one side of a base metal 2 with an insulating layer 3 interposed therebetween.
従来の使用時の構成としては、第３図に示すように金属
ベース基板１に熱伝導ペースト５を放熱フィン６との接
合面に塗布することにより、微小な空隙部を埋め、複数
の接合ねじ７により固定している。As shown in FIG. 3, the conventional configuration for use is to apply thermally conductive paste 5 to the joint surface of the metal base substrate 1 with the heat dissipation fins 6 to fill minute gaps and connect a plurality of joint screws. It is fixed by 7.
一般に、金属ベースプリント配線板１は、導電体４上に
電子部品を搭載（表面実装）するため、ベース金属２と
の電気的絶縁を絶縁層３で行う。Generally, in the metal base printed wiring board 1, since electronic components are mounted on the conductor 4 (surface mounting), electrical insulation from the base metal 2 is provided by the insulating layer 3.
また、電子部品の発熱は、導電体４．絶縁層３゜ベース
金属２．熱伝導ペースト５．放熱フィン６の順に伝導さ
せ、大気中に放熱させることにより、熱による部品の劣
化損傷を防止している。In addition, heat generated by electronic components is caused by conductors 4. Insulating layer 3° Base metal 2. Thermal conductive paste5. By conducting the heat in the order of the heat dissipating fins 6 and dissipating the heat into the atmosphere, deterioration and damage to components due to heat is prevented.
（発明が解決しようとする課題〕
しかしながら、上記のような従来例の使用時の構成にあ
っては、次のような問題点があった。すなわち、
１）熱伝導ペースト５の塗布、放熱フィン６の接合及び
接合ねじ７の締結等、作業工程が多い。(Problems to be Solved by the Invention) However, the configuration of the conventional example described above during use had the following problems: 1) Application of the thermally conductive paste 5, heat dissipation fins, etc. There are many work steps such as joining 6 and fastening the joining screw 7.
２）熱伝導ペースト５の塗布の際の厚みの不拘−及びピ
ンホール等による接触熱抵抗の増大及び熱伝導ペースト
５自体の熱伝導率が約０．４６Ｋｃａｌ／ｍｈ”Ｃとベ
ース金属２や放熱フィン６に比へ約３８０倍も小さいた
め放熱フィン６の放熱効果を十分に生かすことかできな
い。2) Increase in contact thermal resistance due to unrestricted thickness and pinholes when applying the thermally conductive paste 5, and the thermal conductivity of the thermally conductive paste 5 itself is approximately 0.46 Kcal/mh"C, which is due to the base metal 2 and heat dissipation. Since it is about 380 times smaller than the fins 6, the heat radiation effect of the radiation fins 6 cannot be fully utilized.
３）金属ベース基板１の反り、ねじれ等を接合ねし７の
締結のみでは十分に較正できず、放熱フィン６との間に
微小な空隙を生じ、接触熱抵抗が増大して放熱フィン６
の放熱効果を十分に生かすことができないなど。3) Warping, twisting, etc. of the metal base substrate 1 cannot be sufficiently calibrated by simply tightening the joint screws 7, and a minute gap is created between the metal base substrate 1 and the heat dissipating fins 6, increasing the contact thermal resistance and causing the heat dissipating fins 6 to
For example, the heat dissipation effect cannot be fully utilized.
この発明は、以上のような、従来例の問題点を解決する
ためになされたもので、熱伝導ペースト５の塗布、放熱
フィン６の接合及び接合ねし７の締結等の作業工程を不
要とし、また、熱伝導ベースト５の塗布厚みや金属ベー
ス基板１と放熱フィン６との接合等による接触熱抵抗を
ずへて排除し得る高熱伝導の放熱フィン付金属ベースプ
リント配線板の提供を目的としている。This invention was made in order to solve the problems of the conventional example as described above, and eliminates the need for work steps such as applying the thermally conductive paste 5, joining the radiation fins 6, and fastening the joining screws 7. In addition, the present invention aims to provide a metal base printed wiring board with heat dissipation fins having high thermal conductivity that can completely eliminate contact thermal resistance due to the coating thickness of the heat conduction base plate 5, the bonding between the metal base substrate 1 and the heat dissipation fins 6, etc. There is.
〔課題を解決するだめの手段〕
このため、この発明による放熱フィンｆ＝ｉ金属ヘース
プリント配線板は、ベース金属自体に放熱フィンを設け
、放熱フィンとベース金属とを一体に形成することによ
り、前記目的を達成しようとするものである。[Means for Solving the Problem] Therefore, the heat dissipation fin f=i metal head printed wiring board according to the present invention provides the heat dissipation fin on the base metal itself and integrally forms the heat dissipation fin and the base metal. This aims to achieve the above objective.
以−」二のような構成によるこの発明の金属ベースプリ
ント配線板は、放熱フィンがベース金属と一体化し、基
板−１−に搭載した電子部品の発熱を直接的かつ効果的
に放熱フィンに伝導し、大気中に放熱させる。In the metal-based printed wiring board of the present invention having the configuration as described above, the heat dissipation fins are integrated with the base metal, and the heat generated by the electronic components mounted on the board -1- is directly and effectively conducted to the heat dissipation fins. and radiates heat into the atmosphere.
（実施例） 以下に、この発明を実施例に基づいて説明する。(Example) The present invention will be explained below based on examples.
第１図に、この発明の一実施例による放熱フィン何金属
ヘースプリント配線板の破断断面図を示す。図において
、１ａは放熱フィン（＝Ｊ金金属ヘススプリント配線板
基板）、２ａは、放熱フィン付金属ベースを示し、金属
ベース部２ａに放熱フィン部２ａを一体構成化しである
。３．４は第３図におけると同一構成要素を示す。FIG. 1 shows a cutaway sectional view of a printed wiring board with heat dissipation fins and metal head according to an embodiment of the present invention. In the figure, 1a indicates a heat dissipation fin (=J gold metal hess splint wiring board substrate), 2a indicates a metal base with a heat dissipation fin, and the heat dissipation fin portion 2a is integrated with the metal base portion 2a. 3.4 shows the same components as in FIG.
Ｃ発明の効果）
以上、説明したように、この発明によれば、放熱フィン
とベース金属とを一体化構成としたため、熱伝導性にす
ぐれ、さらに作業工程を簡易化し得るので生産性の高い
放熱フィン付金属ベースプリント配線板が得られる効果
がある。C) Effects of the Invention) As explained above, according to the present invention, the heat dissipation fins and the base metal are integrated, so it has excellent thermal conductivity, and furthermore, the work process can be simplified, resulting in highly productive heat dissipation. This has the effect of providing a metal base printed wiring board with fins.
第１図は、この発明による放熱フィンイ」金属ベースプ
リント配線板の一実施例の破断断面図、第２図は、従来
の金属ベースプリント配線板の一例の破断断面図、第３
図は、第２図の金属ベースプリント配線板の使用時の放
熱フィンを接合した状態の一例を示ず破断断面図である
。
１ａは放熱フィン付金属ベースプリント配線板（基板）
、２ａは放熱フィン付金属ベース、６ａは放熱フィンで
ある。
なお、各図中、同一符号は同一または相当構成要素を示
す。
代ｆｑｊ人 大 岩 ｋ（Ｑ 雄
句 ＩＴＪＱｊ
−へψFIG. 1 is a cutaway sectional view of an embodiment of a metal-based printed wiring board with heat dissipation fins according to the present invention, FIG. 2 is a broken sectional view of an example of a conventional metal-based printed wiring board, and FIG.
The figure is a cutaway sectional view showing an example of the state in which the metal base printed wiring board of FIG. 2 is used and the heat dissipation fins are joined. 1a is a metal base printed wiring board (substrate) with heat dissipation fins
, 2a is a metal base with radiation fins, and 6a is a radiation fin. Note that in each figure, the same reference numerals indicate the same or equivalent components. Daiwa k (Q Yuku ITJQj - to ψ
Claims (1)
ンを設け、該放熱フィンとベース金属とを一体に形成し
たことを特徴とする放熱フィン付金属ベースプリント配
線板。A metal base printed wiring board with heat radiation fins, characterized in that a heat radiation fin is provided on the base metal itself of the metal base printed wiring board, and the heat radiation fins and the base metal are integrally formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9717588A JPH01268183A (en) | 1988-04-20 | 1988-04-20 | Metal base printed circuit board with radiation fin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9717588A JPH01268183A (en) | 1988-04-20 | 1988-04-20 | Metal base printed circuit board with radiation fin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01268183A true JPH01268183A (en) | 1989-10-25 |
Family
ID=14185248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9717588A Pending JPH01268183A (en) | 1988-04-20 | 1988-04-20 | Metal base printed circuit board with radiation fin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01268183A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02148877A (en) * | 1988-11-30 | 1990-06-07 | Furukawa Electric Co Ltd:The | Printed wiring board having metal plate base |
-
1988
- 1988-04-20 JP JP9717588A patent/JPH01268183A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02148877A (en) * | 1988-11-30 | 1990-06-07 | Furukawa Electric Co Ltd:The | Printed wiring board having metal plate base |
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