JPH01266753A - Semiconductor device module package - Google Patents

Abstract

PURPOSE:To prevent contact between adjacent leads by providing an insulation separating body between semiconductor devices mounted on a circuit substrate. CONSTITUTION:An insulation separator body 2 is formed on a circuit substrate 1 between a lead 4 of a semiconductor device 3 mounted on the circuit substrate 1 and a lead 6 of an adjacent semiconductor device 5, or the insulation separator body 2 is formed between the semiconductor device 3 mounted on the circuit substrate 1 and the adjacent semiconductor device 5. As a result, even if the mounted semiconductor devices 3 and 5 deviate from each other, the gap between the adjacent leads 4 and 6 can be maintained or the gap between the mounted semiconductor devices 3 and 5 can be maintained constantly. It prevents contact of leads of adjacent semiconductor devices.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a semiconductor device module package, and more particularly to a package having an insulating separator between semiconductor devices.

[Conventional technology]

Conventionally, in this type of semiconductor device module package, since the semiconductor device is mounted on a circuit board with a flat mounting surface, it has been extremely difficult to maintain a distance from the leads of other adjacent semiconductor devices.

[Problem to be solved by the invention]

In the conventional semiconductor device module package described above, the mounting surface on the circuit board on which the semiconductor devices are mounted is flat, so when the semiconductor devices are mounted on the circuit board at high density, the leads of the semiconductor devices are close together. There is a drawback that it comes into contact with the leads of other semiconductor devices.

[Means to solve the problem]

The semiconductor device module package of the present invention has an insulating separator between semiconductor devices mounted on a circuit board.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1(a) is a sectional view of one embodiment of the present invention, and the first
Figure (b) is a plan view thereof. In this semiconductor device module package, an insulating separator 2 is formed on a circuit board 1 between leads 4 of a semiconductor device 3 mounted on the circuit board 1 and leads 6 of an adjacent semiconductor device 5. By forming this insulating separator 2, even if the mounted semiconductor devices are shifted, the leads of adjacent semiconductor devices will not come into contact with each other.

FIG. 2(a) is a sectional view of Embodiment 2 of the present invention.
Figure (b) is a plan view thereof.

This semiconductor device module package forms an insulating separator 2 between a semiconductor device 3 mounted on a circuit board 1 and an adjacent semiconductor device 5. By forming the insulating separator 2, the distance between the mounted semiconductor devices is always kept constant, so that the leads of adjacent semiconductor devices do not come into contact with each other.

〔Effect of the invention〕

As explained above, the present invention prevents positional deviation between the circuit board and the semiconductor device mounted on the circuit board by forming an insulating separator between the semiconductor devices on the circuit board, and prevents positional deviation between the circuit board and the semiconductor device mounted on the circuit board. Even if misalignment occurs, there is an effect that the leads of other adjacent semiconductor devices will not come into contact with each other.

[Brief explanation of the drawing]

FIG. 1(a) is a sectional view of a semiconductor device module package according to a first embodiment of the present invention, and FIG. 1(b) is a plan view thereof. FIG. 2(a) is a sectional view of Example 2, and FIG. 2(b) is a plan view thereof. 1... Circuit board, 2... Insulator protrusion,
3゜5...Semiconductor device, 4,6...Lead. Agent Patent Attorney Oto Hara (b) Figure 1 Figure 2

Claims (1)

[Claims] A semiconductor device module package characterized by having an insulating separator between semiconductor devices mounted on a circuit board.