JPH0358464A - Semiconductor device - Google Patents

Abstract

PURPOSE:To enable the use of a package proportional to a semiconductor chip in size without any limitation due to the dimension of the package by a method wherein a lead is composed of two or more layers insulated from each other through an insulating layer. CONSTITUTION:An insulating layer 3 is interposed between lead 2a and 2b which are led out from a sealing part of the side face of an sealing part 1 to electrically insulate them from each other, whereby two systems of signal can be transmitted through a single lead. A semiconductor device of this design is constituted in a structure that the laminated two or more leads 2a and 2b electrically insulated from each other through the intermediary of the insulating layer 3 are led out through the side face of the sealing part 1, whereby it can easily deal with many signals by increasing leads in number without any limitation due to the dimension of a package. By this setup, a package proportional to a semiconductor chip in size can be used.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a semiconductor device. [Prior Art] In a conventional semiconductor device, as shown in FIG.
It was constructed by being derived from the aspects of , and was used for transmitting signals with external circuits. [Problems to be Solved by the Invention] In the conventional semiconductor device described above, only one type of electrical signal can be transmitted by one lead, so the number of leads must be increased as the number of types of electrical signals to be transmitted increases. In this case, there are disadvantages such as being limited by the size of the package or having to prepare a package that is unnecessarily large in size compared to the size of the semiconductor chip. [Means for Solving the Problems] A semiconductor device of the present invention includes a sealing portion that seals a semiconductor chip, and a lead electrically connected to the semiconductor chip and led out from the sealing portion. In the semiconductor device having the above-mentioned semiconductor device, the lead is composed of a plurality of layers insulated from each other via an insulating layer.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a perspective view showing an embodiment of the present invention. An insulating layer 3 is sandwiched between the leads 2a and 2b led out from the side surface of the sealing part 1 in which the semiconductor chip is sealed, and the leads 2a and 2b are electrically insulated. Signals can be transmitted.

2 and 3 are perspective views showing second and third embodiments of the present invention. As shown in FIG. 2, the leads 2a and 2b led out through the insulating layer 3 are shaped into a ■ shape, and as shown in FIG. 3, one lead 2a led out with the insulating layer 3 in between. It has the same structure as the first embodiment except that the lead 2b is shaped into a gull wing shape and the other lead 2b is shaped into a J shape.

FIG. 4 is a perspective view showing a fourth embodiment of the present invention.

As shown in FIG. 4, the insulating layers 3
This embodiment has the same ellipse as the first embodiment except that the leads 2a, 2b, and 2c are led out insulated by the ellipse. [Effects of the Invention] As explained above, the present invention has a configuration in which a plurality of leads are electrically separated via an insulating layer and are stacked and led out from the side of the sealing part, so that the types of electrical signals to be transmitted can be easily transmitted. increases, without being limited by package dimensions.
This has the effect that it is possible to realize a semiconductor device that can easily handle many signals by increasing the number of leads.

Furthermore, since it becomes possible to use a package proportional to the size of the semiconductor chip, it is possible to reduce the mounting area when mounting a semiconductor integrated circuit on a substrate.

[Brief explanation of drawings]

1 to 4 are perspective views showing first to fourth embodiments of the present invention, and FIG. 5 is a perspective view of a conventional semiconductor device. 1... Sealing part, 2. 2 a, 2 b, 2
c ・-Lead, 3... Insulating layer.

Claims (1)

[Claims] In a semiconductor device having a sealing part that seals a semiconductor chip, and leads electrically connected to the semiconductor chip and led out from the sealing part, the leads are insulated from each other via an insulating layer. A semiconductor device comprising a plurality of layers.