JPH01262692A - Electric component - Google Patents

Electric component

Info

Publication number
JPH01262692A
JPH01262692A JP9206788A JP9206788A JPH01262692A JP H01262692 A JPH01262692 A JP H01262692A JP 9206788 A JP9206788 A JP 9206788A JP 9206788 A JP9206788 A JP 9206788A JP H01262692 A JPH01262692 A JP H01262692A
Authority
JP
Japan
Prior art keywords
adhesive tape
wiring board
printed wiring
electronic component
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9206788A
Other languages
Japanese (ja)
Inventor
Nobutaka Nagai
長井　信孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP9206788A priority Critical patent/JPH01262692A/en
Publication of JPH01262692A publication Critical patent/JPH01262692A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To enable a printed wiring board to be bonded reliably with an electronic component sealed with resin or ceramics, by applying an adhesive tape on the surface of the electronic component on which an electronic component is to be bonded, for fixing the printed wiring board securely. CONSTITUTION:A pair of external leads 2 are led out from one side of a molded resin body 1 while an external lead 2 is led out from the opposite side of the molded resin body 1. An adhesive tape 3 is applied to the bottom of the molded resin body 1 while remaining the margins of the four edges exposed. The adhesive tape 3 has such a thickness that the external bonding face of the tape 3 is flush with the bonding face of the external leads 2 or is projected slightly outwards therefrom. According to such arrangement, a printed circuit board can be packaged reliably only by peeling off a protective paper protecting the adhesive face of the adhesive tape and by pressing the adhesive tape on a predetermined place in the printed wiring board.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、樹脂、セラミック等で封止された電子部品に
関し、特にプリント配線板に実装する際固定のために接
着が必要な電子部品に関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to electronic components sealed with resin, ceramic, etc., and particularly relates to electronic components that require adhesive for fixation when mounted on a printed wiring board. .

〔従来の技術〕[Conventional technology]

従来、この種の電子部品は、プリント配線板へ実装する
際、プリント配線板へペースト状エポキシ樹脂等の接着
材をプリント配線板の電子部品装着部に塗布し、電子部
品をプリント配線板に固定しくペースト状エポキシ樹脂
使用の場合、紫外線と加熱により硬化させ装着）、その
後はんだデイツプによってリード部品の実装を行なって
いる。Conventionally, when this type of electronic component is mounted on a printed wiring board, an adhesive such as a paste epoxy resin is applied to the electronic component mounting area of the printed wiring board to fix the electronic component to the printed wiring board. If a paste-like epoxy resin is used, it is cured using ultraviolet light and heat, and then the lead components are mounted using solder dips.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来の電子部品は、プリント配線板への実装を
行なう際、電子部品を固定するために接着材を用いてい
るので、接着材の量によって電子部品の接着強度が左右
される。工程数が増える。Since the above-described conventional electronic components use an adhesive to fix the electronic components when mounted on a printed wiring board, the adhesive strength of the electronic components depends on the amount of adhesive. The number of processes increases.

接着材のリード接触によりショート等の電気特性に影響
を与える恐れがあるという欠点がある。There is a drawback that electrical characteristics such as short circuits may be affected due to lead contact of the adhesive material.

〔課題を解決するための手段〕[Means to solve the problem]

本発明の樹脂、セラミック等で封止され、プリント配線
板に実装される電子部品は、プリント配線板に固定する
面に接着テープが貼り付けられている。An electronic component sealed with the resin, ceramic, etc. of the present invention and mounted on a printed wiring board has an adhesive tape affixed to the surface to be fixed to the printed wiring board.

〔実施例〕〔Example〕

つぎに本発明を実施例により説明する。 Next, the present invention will be explained by examples.

第１図（ａ）は本発明の一実施例の下面図、同図（ｂ）
は側面図である。第１図（ａ）　、　（ｂ）において、
一対の対向する側面から、２本と１本の外部リード２が
引出されている外装のモールド樹脂体１の底面には、こ
の底面の四周より少し内側に入った面積範囲の部分に接
着テープ３が貼付けられている。接着テープ３の厚みは
、テープ３の外部接着面が、外部リード２の接続面にほ
ぼ等しい平面上、またはそれよりも僅か外側に来るよう
な厚みをもたせである。FIG. 1(a) is a bottom view of an embodiment of the present invention, and FIG. 1(b) is a bottom view of an embodiment of the present invention.
is a side view. In Figures 1(a) and (b),
On the bottom surface of the exterior molded resin body 1 from which two and one external leads 2 are drawn out from a pair of opposing sides, an adhesive tape 3 is applied to an area slightly inside the four circumferences of the bottom surface. is pasted. The thickness of the adhesive tape 3 is such that the external adhesive surface of the tape 3 is on a plane approximately equal to the connection surface of the external lead 2, or slightly outside of it.

このような本発明の電子部品は、接着テープの外面を保
護している保護紙を剥して、プリント配線板の所定の位
置に押し付けるだけで簡単に、しかも確実な実装が行な
われる。Such an electronic component of the present invention can be easily and reliably mounted by simply peeling off the protective paper that protects the outer surface of the adhesive tape and pressing it onto a predetermined position on a printed wiring board.

第２図（ａ）　、　（ｂ）はそれぞれ本発明の他の実施
例の下面図と側面図である。第２図（ａ）　、　（ｂ）
において、モールド樹脂体２の底面に貼り付けられてい
る接着テープ４は、この電子部品を接着テープ４の接着
でプリント配線板に実装した場合、異物が接着テープ４
に付着し、端子間のショートが起らぬように外側の接着
面を中央部の接続面４ａとその外周の非接着面４ｂとに
分けている。よって、このような接着テープを備えてい
る本実施例では、接着テープに異物が付着することによ
る電気特性の異常は起り難くなっている。FIGS. 2(a) and 2(b) are a bottom view and a side view of another embodiment of the present invention, respectively. Figure 2 (a), (b)
In this case, the adhesive tape 4 attached to the bottom surface of the molded resin body 2 is such that, when this electronic component is mounted on a printed wiring board by adhesion with the adhesive tape 4, foreign matter can be removed from the adhesive tape 4.
The outer adhesive surface is divided into a connecting surface 4a at the center and a non-adhesive surface 4b at the outer periphery to prevent short-circuiting between the terminals. Therefore, in this embodiment, which includes such an adhesive tape, abnormalities in electrical characteristics due to foreign matter adhering to the adhesive tape are less likely to occur.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、樹脂、セラミック等で封
止されたプリント配線板に実装される電子部品において
、プリント配線板と実装する面に接着テープを設けるこ
とにより、プリント配線板との接着が確実に行なわれ、
プリント配線板への実装のプロセスが短縮され、リード
間のショート等の電気特性の異常が低減されるという効
果がある。As explained above, the present invention provides an adhesive tape for electronic components mounted on a printed wiring board sealed with resin, ceramic, etc. by providing an adhesive tape on the surface to be mounted on the printed wiring board. is carried out reliably,
This has the effect of shortening the process of mounting on a printed wiring board and reducing abnormalities in electrical characteristics such as shorts between leads.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図（ａ）は本発明の一実施例の下面図、同図（ｂ）
は側面図、第２図は本発明の他の実施例の下面図である
。 １・・・・・・モールド樹脂体、２・・・・・・外部リ
ード、３．４・・・・・・接着テープ、４ａ・・・・・
・接着面、４ｂ・・・・・・非接着面。 代理人　弁理士　　内　原　　　音 給Ｚ図FIG. 1(a) is a bottom view of an embodiment of the present invention, and FIG. 1(b) is a bottom view of an embodiment of the present invention.
2 is a side view, and FIG. 2 is a bottom view of another embodiment of the invention. 1...Mold resin body, 2...External lead, 3.4...Adhesive tape, 4a...
・Adhesive surface, 4b...Non-adhesive surface. Agent Patent Attorney Hara Uchi

Claims (1)

【特許請求の範囲】[Claims] 　樹脂，セラミック等で封止され、プリント配線板に実
装される電子部品において、この電子部品のプリント配
線板への固定面に、プリント配線板に固定するための接
着テープが貼り付けられていることを特徴とする電子部
品。For electronic components that are sealed with resin, ceramic, etc. and mounted on a printed wiring board, an adhesive tape is pasted on the surface of the electronic component to be fixed to the printed wiring board. Electronic components featuring:
JP9206788A 1988-04-13 1988-04-13 Electric component Pending JPH01262692A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9206788A JPH01262692A (en) 1988-04-13 1988-04-13 Electric component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9206788A JPH01262692A (en) 1988-04-13 1988-04-13 Electric component

Publications (1)

Publication Number Publication Date
JPH01262692A true JPH01262692A (en) 1989-10-19

Family

ID=14044123

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9206788A Pending JPH01262692A (en) 1988-04-13 1988-04-13 Electric component

Country Status (1)

Country Link
JP (1) JPH01262692A (en)

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