JPH01320809A - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH01320809A JPH01320809A JP15556388A JP15556388A JPH01320809A JP H01320809 A JPH01320809 A JP H01320809A JP 15556388 A JP15556388 A JP 15556388A JP 15556388 A JP15556388 A JP 15556388A JP H01320809 A JPH01320809 A JP H01320809A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- circuit board
- wave element
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 34
- 230000002093 peripheral effect Effects 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 8
- 239000003990 capacitor Substances 0.000 abstract description 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 125000003700 epoxy group Chemical group 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は量産性に優れ複合化された弾性表面波装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a composite surface acoustic wave device that is highly mass-producible.
一般に、弾性表面波装置は、圧電材料である弾性体の表
面を伝播する波動を利用した装置であり、表面波の伝播
を妨害しないように圧電材料の表面を保つことと、気密
性を守る構造とする事が最も重要な課題である。In general, a surface acoustic wave device is a device that uses waves that propagate on the surface of an elastic body, which is a piezoelectric material, and has a structure that maintains the surface of the piezoelectric material so as not to interfere with the propagation of the surface waves and protects the airtightness. The most important issue is to do so.
このため、従来の弾性表面波装置は、金属ケース又はセ
ラミックケースに弾性表面波チップをボンディングし、
Ａ、Ｒ又はＡｕのボンディングワイヤーで外部電極に接
続し、これをシール封止して形成される。For this reason, conventional surface acoustic wave devices bond a surface acoustic wave chip to a metal case or a ceramic case.
It is formed by connecting to an external electrode with an A, R or Au bonding wire and sealing this.
しかし上述した弾性表面波装置の製造設備としては、金
属ケースあるいはセラミックケースの構造に合せて開発
し、実用に供している。従って、パッケージ寸法が変更
されるたびに設備の改造あるいは治工具の変更が必要と
なり、製造効率が悪いという問題があった。However, manufacturing equipment for the above-mentioned surface acoustic wave device has been developed and put into practical use in accordance with the structure of a metal case or a ceramic case. Therefore, each time the package dimensions are changed, it is necessary to modify the equipment or change the jigs and tools, resulting in a problem of poor manufacturing efficiency.
本発明の目的は、このような問題を解決し、容易にパッ
ケージ寸法変更に対応できると共に、周辺回路も付加で
きるようにした弾性表面波装置を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide a surface acoustic wave device that solves these problems, can easily accommodate changes in package dimensions, and can also be equipped with peripheral circuits.
本発明の構成は、交差指状電極からなる弾性表面波素子
を形成した第１の回路基板と、前記弾性表面波素子の周
辺回路を形成した第２の回路基板とをリードフレーム上
で接続し外装用樹脂で被覆した弾性表面波装置において
、前記第１の回路基板と前記第２の回路基板との間に支
持枠を設け、この支持枠で密閉した空間に前記弾性表面
波素子が収納されるようにしたことを特徴とする。The structure of the present invention is such that a first circuit board on which a surface acoustic wave element made of interdigital electrodes is formed and a second circuit board on which a peripheral circuit of the surface acoustic wave element is formed are connected on a lead frame. In the surface acoustic wave device coated with exterior resin, a support frame is provided between the first circuit board and the second circuit board, and the surface acoustic wave element is housed in a space sealed by the support frame. It is characterized in that it is made to look like this.
次に本発明を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図、第２図は本発明の一実施例を示す分解斜視図及
びその組立時の斜視図である。本実施例において、周辺
回路基板１はアルミナ基板２上に導体回路３を形成し、
その上に集積回路素子４゜チップ抵抗、コンデンサ等の
受動素子５を搭載している。また、集積回路素子４はボ
ンディングワイヤー６により導体回路３に接続される。FIGS. 1 and 2 are an exploded perspective view and an assembled perspective view showing one embodiment of the present invention. In this embodiment, the peripheral circuit board 1 has a conductor circuit 3 formed on an alumina substrate 2,
On top of this, passive elements 5 such as integrated circuit elements 4° chip resistors and capacitors are mounted. Further, the integrated circuit element 4 is connected to the conductive circuit 3 by a bonding wire 6.
支持枠７はアルミナ基板から形成され、また弾性表面波
素子を搭載する回路基板８はアルミナ基板９上に導体回
路１０を設は弾性表面波素子１１を搭載、固定し、電極
パターン部１２と導体回路１０とをボンディングワイヤ
ー１３で接続している。The support frame 7 is formed from an alumina substrate, and the circuit board 8 on which the surface acoustic wave device is mounted has a conductor circuit 10 on the alumina substrate 9, a surface acoustic wave device 11 is mounted and fixed, and the electrode pattern portion 12 and the conductor circuit 10 are mounted on the alumina substrate 9. It is connected to the circuit 10 by a bonding wire 13.
これら周辺回路基板１．支持枠７６弾性表面波素子搭載
基板８は、第２図のようにリードフレーム１４上に組立
てられる。これは表面弾性波素子搭載基板８上に支持枠
７をエポキシ系接着剤で固定し、更に周辺回路基板１を
接着し固定する。この後、−像化した回路基板をリード
フレーム１４上に接着、固定・し、表面弾性波素子搭載
基板８上に設けた外部接続用電極１７とリードフレーム
電極１４をホンディングワイヤーで接続している。These peripheral circuit boards1. The support frame 76 and the surface acoustic wave element mounting board 8 are assembled on the lead frame 14 as shown in FIG. In this case, the support frame 7 is fixed onto the surface acoustic wave element mounting board 8 using an epoxy adhesive, and the peripheral circuit board 1 is further fixed by bonding. After that, the imaged circuit board is glued and fixed on the lead frame 14, and the external connection electrode 17 provided on the surface acoustic wave element mounting board 8 and the lead frame electrode 14 are connected with a bonding wire. There is.
この組立完了後、エポキシ樹脂１５により封入成形が行
なわれる。これにはトランスファーモールド成型法が多
く用いられる。このようにして完成された複合化弾性表
面波装置は、第３図のリード端子方向の断面図および第
４図の斜視図のように示される。After this assembly is completed, encapsulation molding is performed using the epoxy resin 15. Transfer molding is often used for this purpose. The composite surface acoustic wave device thus completed is shown in a cross-sectional view in the direction of the lead terminals in FIG. 3 and a perspective view in FIG. 4.
以上説明したように本発明は、支持枠と周辺回路基板を
弾性表面波素子搭載基板上に重ねて、弾性表面波装置の
動作に必要な密閉空間を設けるこにより、容易に設計変
更に対応できる構造とすると共に、周辺回路まで含んだ
複合化された表面弾性波装置を得ることができるという
効果がある。As explained above, the present invention can easily accommodate design changes by stacking the support frame and the peripheral circuit board on the surface acoustic wave element mounting board to provide a sealed space necessary for the operation of the surface acoustic wave device. This has the advantage that it is possible to obtain a complex surface acoustic wave device that includes not only the structure but also peripheral circuits.
第１図、第２図は本発明の一実施例における分解斜視図
およびその組立時の斜視図、第３図、第４図は第１図の
外装時の断面図および斜視図である。
１・・・周辺回路基板、２．９・・・アルミナ基板、３
．１０・・・導体回路、４・・・集積回路素子、５・・
・受動素子、６，１３・・・ボンディングワイヤー、７
・・・支持枠、８・・・弾性表面波素子搭載基板、１１
・・・表面弾性波素子、］２・・・電極パターン部、１
４・・・リードフレーム、１５・・・エポキシ樹脂、１
６・・・シリコン接着剤、１７・・・外部接続用電極。1 and 2 are an exploded perspective view and an assembled perspective view of an embodiment of the present invention, and FIGS. 3 and 4 are a sectional view and a perspective view of the exterior of FIG. 1. 1... Peripheral circuit board, 2.9... Alumina board, 3
．． 10... Conductor circuit, 4... Integrated circuit element, 5...
・Passive element, 6, 13... Bonding wire, 7
...Support frame, 8...Surface acoustic wave element mounting board, 11
... surface acoustic wave element, ]2 ... electrode pattern part, 1
4...Lead frame, 15...Epoxy resin, 1
6... Silicone adhesive, 17... External connection electrode.
Claims (1)
回路基板と、前記弾性表面波素子の周辺回路を形成した
第２の回路基板とをリードフレーム上で接続し外装用樹
脂で被覆した弾性表面波装置において、前記第１の回路
基板と前記第２の回路基板との間に支持枠を設け、この
支持枠で密閉した空間に前記弾性表面波素子が収納され
るようにしたことを特徴とする弾性表面波装置。A first circuit board on which a surface acoustic wave element consisting of interdigital electrodes was formed and a second circuit board on which a peripheral circuit of the surface acoustic wave element was formed were connected on a lead frame and covered with an exterior resin. In the surface acoustic wave device, a support frame is provided between the first circuit board and the second circuit board, and the surface acoustic wave element is housed in a space sealed by the support frame. Features of surface acoustic wave device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15556388A JPH01320809A (en) | 1988-06-22 | 1988-06-22 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15556388A JPH01320809A (en) | 1988-06-22 | 1988-06-22 | Surface acoustic wave device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01320809A true JPH01320809A (en) | 1989-12-26 |
Family
ID=15608791
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15556388A Pending JPH01320809A (en) | 1988-06-22 | 1988-06-22 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01320809A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8395247B1 (en) * | 2009-06-29 | 2013-03-12 | Integrated Device Technology, Inc. | Method and apparatus for placing quartz SAW devices together with clock/oscillator |
-
1988
- 1988-06-22 JP JP15556388A patent/JPH01320809A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8395247B1 (en) * | 2009-06-29 | 2013-03-12 | Integrated Device Technology, Inc. | Method and apparatus for placing quartz SAW devices together with clock/oscillator |
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