JPH0126177B2 - - Google Patents
Info
- Publication number
- JPH0126177B2 JPH0126177B2 JP59203009A JP20300984A JPH0126177B2 JP H0126177 B2 JPH0126177 B2 JP H0126177B2 JP 59203009 A JP59203009 A JP 59203009A JP 20300984 A JP20300984 A JP 20300984A JP H0126177 B2 JPH0126177 B2 JP H0126177B2
- Authority
- JP
- Japan
- Prior art keywords
- package
- leads
- jig
- sides
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 14
- 238000003672 processing method Methods 0.000 claims description 2
- 238000003825 pressing Methods 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20300984A JPS6182451A (ja) | 1984-09-29 | 1984-09-29 | Icパツケ−ジのリ−ド曲げ加工方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20300984A JPS6182451A (ja) | 1984-09-29 | 1984-09-29 | Icパツケ−ジのリ−ド曲げ加工方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6182451A JPS6182451A (ja) | 1986-04-26 |
JPH0126177B2 true JPH0126177B2 (US06299757-20011009-C00006.png) | 1989-05-22 |
Family
ID=16466820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20300984A Granted JPS6182451A (ja) | 1984-09-29 | 1984-09-29 | Icパツケ−ジのリ−ド曲げ加工方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6182451A (US06299757-20011009-C00006.png) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06204376A (ja) * | 1992-10-17 | 1994-07-22 | M Tex Matsumura Kk | 電子部品のリード修正方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509267A (US06299757-20011009-C00006.png) * | 1973-05-30 | 1975-01-30 | ||
JPS5612398A (en) * | 1979-07-11 | 1981-02-06 | Kumiai Chem Ind Co Ltd | Organic phosphate derivative, its preparation, and germicide, insecticide and acaricide containing it |
JPS5828740A (ja) * | 1981-08-13 | 1983-02-19 | Mitsubishi Paper Mills Ltd | ハロゲン化銀写真材料の製造方法 |
JPS6331408U (US06299757-20011009-C00006.png) * | 1986-08-18 | 1988-03-01 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6426177A (en) * | 1987-07-22 | 1989-01-27 | Furuno Electric Co | Measured position display device |
-
1984
- 1984-09-29 JP JP20300984A patent/JPS6182451A/ja active Granted
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS509267A (US06299757-20011009-C00006.png) * | 1973-05-30 | 1975-01-30 | ||
JPS5612398A (en) * | 1979-07-11 | 1981-02-06 | Kumiai Chem Ind Co Ltd | Organic phosphate derivative, its preparation, and germicide, insecticide and acaricide containing it |
JPS5828740A (ja) * | 1981-08-13 | 1983-02-19 | Mitsubishi Paper Mills Ltd | ハロゲン化銀写真材料の製造方法 |
JPS6331408U (US06299757-20011009-C00006.png) * | 1986-08-18 | 1988-03-01 |
Also Published As
Publication number | Publication date |
---|---|
JPS6182451A (ja) | 1986-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |