JPH01258497A - Electronic equipment - Google Patents
Electronic equipmentInfo
- Publication number
- JPH01258497A JPH01258497A JP8634288A JP8634288A JPH01258497A JP H01258497 A JPH01258497 A JP H01258497A JP 8634288 A JP8634288 A JP 8634288A JP 8634288 A JP8634288 A JP 8634288A JP H01258497 A JPH01258497 A JP H01258497A
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- wiring board
- grounded
- electronic device
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229910002480 Cu-O Inorganic materials 0.000 claims 1
- 229910009203 Y-Ba-Cu-O Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 abstract description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000843 powder Substances 0.000 abstract description 2
- 239000011347 resin Substances 0.000 abstract description 2
- 229920005989 resin Polymers 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は電子機器における電波ノイズによる悪影響を
防止するための手段に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to means for preventing the adverse effects of radio noise on electronic equipment.
第６図はキーボード装置を例とした従来の電子機器の垂
直断面図であり１図において、（１）は上部ケース、（
２）は下部ケース、（３）は内装のスイッチ等の電子部
品、（４）はこれを固定する金属板から成るシャーシ、
（５）は上記各電子部品を取付けた配線板。FIG. 6 is a vertical cross-sectional view of a conventional electronic device, taking a keyboard device as an example. In FIG. 1, (1) is an upper case, (
2) is the lower case, (3) is the internal electronic parts such as switches, (4) is the chassis consisting of the metal plate that fixes it,
(5) is a wiring board with each of the above electronic components attached.
（６）はこの配線板上のコネクタ一部（力に接続された
ケーブル、（８）はこのケーブルに接続されたコネクタ
ー、（９）は上記配線板上に設けた制御部、αＱは各電
子部品のリード端子、Ｑυは上記配線板（５）の下面を
覆う金属製プレート、α２はこのプレートと上記シャー
シ（４）の支持枠である。(6) is a part of the connector on this wiring board (the cable connected to the power), (8) is the connector connected to this cable, (9) is the control section provided on the wiring board, αQ is each electronic Component lead terminals Qυ are a metal plate covering the lower surface of the wiring board (5), and α2 is a support frame for this plate and the chassis (4).
上記構成の電子機器を例えばコンピュータシステムのデ
ータ入力装置として使用した場合、各電子部品（３）で
データを入力し、配線板（５）上の制御部（９）で入力
位置信号を検出し、これをコンピュータ本体に転送する
。この場合、出力信号データがノイズ信号で乱されない
ようにするために、鉄またはアルミニウム等の金属製の
シャーシ（４）およびプレートαυで上記配線板（５）
の上下両面がカバーされ。When the electronic device having the above configuration is used, for example, as a data input device for a computer system, data is inputted using each electronic component (3), and an input position signal is detected using a control section (9) on a wiring board (5). Transfer this to the computer itself. In this case, in order to prevent the output signal data from being disturbed by noise signals, the wiring board (5) is connected to the chassis (4) made of metal such as iron or aluminum and the plate αυ.
Both top and bottom sides are covered.
これにより電波ノイズが遮蔽されている。This blocks radio noise.
以上のように従来の電子機器では、配線板（５）の上下
両面を金属製のシャーシ（４）とプレートαυとでカバ
ーして電波ノイズを遮蔽しているので、成子機器の重１
が増すばかりでなく、これらで実装スペースを取ること
になり、ために全体が大型になりコストも高価になると
いう問題点がめった。As described above, in conventional electronic equipment, the upper and lower surfaces of the wiring board (5) are covered with the metal chassis (4) and the plate αυ to shield radio noise.
Not only does this increase the number of components, but they also take up mounting space, which increases the overall size and costs, which is a problem.
この発明は上記の問題点を解消するように配線板を改良
し、従来のシャーシおよびプレートを使用しないように
することを目的とする。An object of the present invention is to improve a wiring board so as to solve the above-mentioned problems, and to avoid using the conventional chassis and plate.
この発明の場合は、配線板の回路パターンを。 In the case of this invention, the circuit pattern of the wiring board.
電気絶縁層を介して電波ノイズ遮蔽用導電層でオーバー
コートしている。It is overcoated with a conductive layer for shielding radio wave noise via an electrically insulating layer.
また、この発明の他の場合は、配線板の回路パターンあ
るいは配線板を収納するケースの内表面を、 ′、を波
ノイズ遮蔽用導電性テープで覆っている。Further, in another case of the present invention, the circuit pattern of the wiring board or the inner surface of the case housing the wiring board is covered with a conductive tape for shielding wave noise.
この発明のさらに他の実施例では上記導電層および導電
性テープをＹ −Ｂａ −Ｃｕ −０系、Ｌａ−Ｓｒ−
Ｏｕ −０系等の超電導材料で構成している。In still another embodiment of the present invention, the conductive layer and the conductive tape are Y-Ba-Cu-0 based, La-Sr-
It is made of superconducting material such as Ou-0 series.
この発明の場合は、配線板の最外表面またはこれを収納
するケースの内表面が導′這体となっているので、″Ｉ
Ｌ波ノイズはこの導電体でアースされ。In the case of this invention, since the outermost surface of the wiring board or the inner surface of the case housing it is a conductive body,
L wave noise is grounded through this conductor.
しかもその被着による機器の重量増加や大型化もない。Furthermore, there is no increase in the weight or size of the equipment due to its adhesion.
以下、この発明の一実施例について説明する。 An embodiment of the present invention will be described below.
すなわち、第１図ないし第３図において、第６図のもの
と同一または相当個所は同一符号を付してその重複説明
は省略することにするが９図中の■はこの発明になる配
線板、 （２０ａ）は電子部品（３）が取付けられた
中心部の回路基板、 （２ｏｂ）はその表面の回路パ
ターンを覆う樹脂等の電気絶縁層。That is, in FIGS. 1 to 3, parts that are the same as or corresponding to those in FIG. 6 are given the same reference numerals, and redundant explanation thereof will be omitted. , (20a) is the central circuit board on which the electronic component (3) is attached, and (2ob) is an electrically insulating layer made of resin or the like that covers the circuit pattern on its surface.
（２０ｃ）はこの電気絶縁層上にアルミニュームやカー
ボン等の粉末導電性材料をコーティングして成る最外表
面の導電層であり、第３図で示すように高周波インピー
ダンス２で例えば下部ケース（２）にアースされている
点に特徴を有するものである。(20c) is the outermost conductive layer formed by coating this electrically insulating layer with a powder conductive material such as aluminum or carbon.As shown in FIG. ) is unique in that it is grounded to
なお上記実施例では９回路基板（２０ａ）の全体を電気
絶縁層（２０ｂ）と導電層（２０ｃ）で包み込んでいる
が、これら電気絶縁層および導電層は、その周面部にお
いて上下に分割されたものであってもよい。In the above embodiment, the entirety of the 9 circuit board (20a) is wrapped in an electrically insulating layer (20b) and a conductive layer (20c), but these electrically insulating layer and conductive layer are divided into upper and lower parts at the peripheral surface. It may be something.
次に第４図はこの発明の他の場合であシ、第６図のもの
と同一または相当個所は同一符号で示してその重複説明
は省略することにするが２図中の（至）は表面に回路パ
ターンを有するこの発明の配線板、０υはその下面の電
気絶縁性接着剤（３１ａ）を介して上記の回路パターン
を覆う電波ノイズ遮蔽用導電性テープ、（至）はその下
面の接着剤で下部ケース（２）および上部ケース（１）
の内表面に貼着された電波ノイズ遮蔽用導電性テープで
、この導電性テープＣ３には接着剤（！＋２ａ）を予め
充填させるための凹部（３２ｂ）が第５図（ａ）のよう
に形成されており、導電性テープ（至）の下面は例えば
下部ケース（２）の内表面に図示のようにＡ面で直接接
触し、アースされている。Next, FIG. 4 shows another case of this invention, and the same or corresponding parts as those in FIG. The wiring board of the present invention has a circuit pattern on its surface, 0υ is a conductive tape for shielding radio noise that covers the above circuit pattern via an electrically insulating adhesive (31a) on its lower surface, and (to) is an adhesive on its lower surface. Lower case (2) and upper case (1) with agent
A conductive tape for shielding radio wave noise is attached to the inner surface of the conductive tape C3, and the conductive tape C3 has a recess (32b) for filling the adhesive (!+2a) in advance as shown in Fig. 5(a). The lower surface of the conductive tape is in direct contact with, for example, the inner surface of the lower case (2) at surface A as shown in the figure, and is grounded.
また第５図（ｂ）は上記導電性テープ（至）の下面に接
着剤（３２ａ ）を直線状に塗布させている他の実施例
であυ、この場合の導電性テープ（至）はアースねじ（
至）で例えば下部ケース（２）にアースされている。Furthermore, FIG. 5(b) shows another embodiment in which the adhesive (32a) is applied linearly to the lower surface of the conductive tape (to), and in this case the conductive tape (to) is grounded. screw(
) and is grounded, for example, to the lower case (2).
以上のように構成しているので、電子機器内部で発生し
た電波ノイズあるいは電子機器外部から侵入した電波ノ
イズは、配線板表面の導電体やケース内表面を覆う導電
体によってアースされるため１回路パターンには影響を
与えることはない。With the above configuration, radio wave noise generated inside the electronic device or radio wave noise that enters from outside the electronic device is grounded by the conductor on the surface of the wiring board or the conductor covering the inner surface of the case. It has no effect on the pattern.
なお、上記第２図における配線板（至）の電波ノイズ遮
蔽用導電層（２０ｃ）および第４図の電波ノイズ遮蔽用
導電性テープＧυ（至）を１例えばＹ−Ｂａ−Ｇｕ−０
系またはＬａ −Ｓｒ −Ｏｕ−○系等の超電導材料に
してもよいことはもちろんである。The conductive layer for shielding radio noise (20c) of the wiring board (to) in FIG. 2 and the conductive tape for shielding radio noise Gυ (to) in FIG.
Of course, a superconducting material such as a La-Sr-Ou-○ system or the like may be used.
この発明の電子機器は以上のように構成しているので９
重量増加や大型化を伴う金属シャーシおよび金属プレー
トを使用しないで電波ノイズを防止でき、これによシ機
器の軽量、小型化およびコスト低減が可能になるという
効果がある。Since the electronic device of this invention is configured as described above,
Radio noise can be prevented without using a metal chassis and metal plate that increase weight and size, and this has the effect of making it possible to reduce the weight, size, and cost of the device.
第１図はこの発明の電子機器の一実施例を示す垂直断面
図、第２図はその配線板の拡大断面図。
第３図はそのアース状態を示す断面図、第４図および第
５図はこの発明の他の実施例を示す全体の垂直断面図お
よび部分拡大断面図、第６図は従来の電子機器を示す垂
直断面図である。
なお２図中、（１）は上部ケース、（２）は下部ケース
。
（３）は電子部品、（至）（至）は配線板、 （２０
ａ）は回路基板。
（２０ｂ）は電気絶縁層、 （２０ｃ）は導電層、Ｇ
υ（至）は導電性テープ、 （３１ａ） （３２ａ）
は接着剤である。
その他１図中同一符号は同一または相当部分を示すもの
とする。FIG. 1 is a vertical sectional view showing an embodiment of the electronic device of the present invention, and FIG. 2 is an enlarged sectional view of its wiring board. FIG. 3 is a sectional view showing its grounding state, FIGS. 4 and 5 are overall vertical sectional views and partially enlarged sectional views showing other embodiments of the present invention, and FIG. 6 is a conventional electronic device. FIG. In Figure 2, (1) is the upper case and (2) is the lower case. (3) is an electronic component, (to) (to) is a wiring board, (20
a) is a circuit board. (20b) is an electrically insulating layer, (20c) is a conductive layer, G
υ (to) is conductive tape, (31a) (32a)
is an adhesive. The same reference numerals in the other figures indicate the same or corresponding parts.
Claims (5)
波ノイズ遮蔽用導電層で覆つたことを特徴とする電子機
器。(1) An electronic device characterized in that a circuit pattern on a wiring board is covered with a conductive layer for shielding radio noise via an electrical insulating layer.
回路基板の両面を覆う内層の絶縁層およびこれを覆う外
層の電波ノイズ遮蔽用導電層とで構成した特許請求の範
囲第１項記載の電子機器。(2) Claim 1, wherein the wiring board is composed of a circuit board on which electronic components are attached, an inner insulating layer covering both sides of the circuit board, and an outer conductive layer covering the same for shielding radio noise. Electronic equipment listed.
の表面に接着された電波ノイズ遮蔽用導電性テープで覆
うようにしたことを特徴とする電子機器。(3) An electronic device characterized in that a circuit pattern on a wiring board is covered with a conductive tape for shielding radio wave noises that is adhered to the surface with an electrically insulating adhesive.
着された電波ノイズ遮蔽用導電性テープで覆うようにし
たことを特徴とする電子機器。(4) An electronic device characterized in that the inner surface of a case that houses a wiring board is covered with a conductive tape for shielding radio wave noise that is bonded with an adhesive.
，Ｙ−Ｂａ−Ｃｕ−Ｏ系，Ｌａ−Ｓｒ−Ｃｕ−Ｏ系等の
超電導材料で構成した特許請求の範囲第１項，第２項，
第３項および第４項のいずれかに記載された電子機器。(5) Claims 1 and 2 in which the conductive layer or conductive tape for shielding radio wave noise is made of a superconducting material such as Y-Ba-Cu-O system or La-Sr-Cu-O system. ，
The electronic device according to any one of paragraphs 3 and 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8634288A JPH01258497A (en) | 1988-04-08 | 1988-04-08 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8634288A JPH01258497A (en) | 1988-04-08 | 1988-04-08 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01258497A true JPH01258497A (en) | 1989-10-16 |
Family
ID=13884182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8634288A Pending JPH01258497A (en) | 1988-04-08 | 1988-04-08 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01258497A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0514101A (en) * | 1991-07-01 | 1993-01-22 | Murata Mfg Co Ltd | Lc resonator |
| US5409328A (en) * | 1992-06-15 | 1995-04-25 | Kabushiki Kaisha Yamazaki Haguruma Seisakusho | Drilling machine for railroad rail |
| US5486136A (en) * | 1992-06-15 | 1996-01-23 | Kabushiki Kaisha Yamazaki Haguruma Seisakusho | Cutting machine for railroad rail |
-
1988
- 1988-04-08 JP JP8634288A patent/JPH01258497A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0514101A (en) * | 1991-07-01 | 1993-01-22 | Murata Mfg Co Ltd | Lc resonator |
| US5409328A (en) * | 1992-06-15 | 1995-04-25 | Kabushiki Kaisha Yamazaki Haguruma Seisakusho | Drilling machine for railroad rail |
| US5486136A (en) * | 1992-06-15 | 1996-01-23 | Kabushiki Kaisha Yamazaki Haguruma Seisakusho | Cutting machine for railroad rail |
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