JPH01255233A - 複合ボンディングワイヤ - Google Patents

複合ボンディングワイヤ

Info

Publication number
JPH01255233A
JPH01255233A JP63083584A JP8358488A JPH01255233A JP H01255233 A JPH01255233 A JP H01255233A JP 63083584 A JP63083584 A JP 63083584A JP 8358488 A JP8358488 A JP 8358488A JP H01255233 A JPH01255233 A JP H01255233A
Authority
JP
Japan
Prior art keywords
wire
alloy
metallic layer
noble metal
metal layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63083584A
Other languages
English (en)
Inventor
Akiyasu Morita
森田　章靖
Shigeo Hattori
重夫 服部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kobe Steel Ltd
Original Assignee
Kobe Steel Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kobe Steel Ltd filed Critical Kobe Steel Ltd
Priority to JP63083584A priority Critical patent/JPH01255233A/ja
Publication of JPH01255233A publication Critical patent/JPH01255233A/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、ボンティングワイヤ芯材の外面に特定の金属
層を二重に形成することによって、優れた耐食性及び接
合性を発揮することができる複合ボンディングワイヤに
関するものである。
［従来の技術］ トランジスタ、ＩＣ或はＬＳＩ等の半導体装置において
は、半導体素子と外部端子を接続する手段としてボンデ
ィングワイヤ（以下単にワイヤということがある）が使
用されている。
例えばＩＣ等のモールド型半導体装置の製作に当っては
、まず、基板上に半導体素子を取り付け、該半導体素子
上のチップ電極のＡＩ蒸着パッドと、外部リードに連ら
なるリードフレームを、ワイヤで接続した後基板とリー
ドフレーム先端部をモールド成形して形成される。
この場合、製品コストを抑制することが大切な課題とな
っており、モールド成形については樹脂モールドが汎用
され、又ワイヤとしてはＡＩ。
Ａ１合金、Ｃｕ或はＣｕ合金等のワイヤが汎用されてい
た。しかしながらこの様な樹脂モールド型装置において
は、樹脂自体或は樹脂と基板との界面から水分が浸入す
る。この為耐食性が必ずしも十分でない上記の様なワイ
ヤは簡単に腐食されることがあり、断線を招くおそれが
あった［後述する実験（ａ）（第１図参照）コ、これを
防止するには、耐食性が優れているＡｕ又はＡｕ合金ワ
イヤを用いればよいのであるが、Ａｕは高価でありしか
も価格の変動が激しい為、半導体製品の価格が高く且つ
一定しないという問題があった。この為ＡＩ或はＣｕ材
を芯材として使用することによりコストの低減をはかり
、且つその表面にＡｕ等の貴金属層を形成することによ
って外部からの腐食を防止する提案もなされている［特
開昭６１−２８５７４３］。
［発明が解決しようとする課題］ しかしながらこの様なワイヤであっても、チップ電極の
ＡＩ蒸着パッドとの確実な接合を行なうことに関しては
次の様な問題点がある。
（イ）貴金属層材料としてＡｕ又はｐｔを用いる場合は
、後述する実験例（第３図）において示す様に、Ａｕ或
はｐｔと、ＡＩ蒸着パッドの接合強度が必ずしも十分で
なく、またＡｕとＡ１は金属間化合物を生成して脆化す
るおそれがある。この為高度の信頼性が要求される半導
体デバイスには使用できない。
（ロ）貴金属層材としてＡｇ或はＰｄを用いる場合は、
モールド樹脂を通して水分が混入する。この為、後述す
る実験例（第２表）で示す様にエレクトロマイグレーシ
ョンが起こり、半導体装置にとって致命的な回路の短絡
を招く。
以上の様な理由からＡＩやＣｕ等のワイヤ表面を貴金属
でめっきするだけでは半導体ワイヤとして使えない。
本発明はこの様な事情に鑑みてなされたものであって、
芯材外面に貴金属めっき層を形成し、更にその外面に金
属層を形成して三重クラッドの複合ワイヤとすることに
よって、上記した従来技術の問題点をことごとく解消し
、ワイヤの耐食性を向上すると共にワイヤとＡ１蒸着パ
ッドの接合性を極めて優れたものとして、半導体装置に
優れた信頼性を与えることができる様なワイヤを提供し
ようとするものである。
し課題を解決する為の手段］ 本発明は半導体素子と外部端子を接続するボンディング
ワイヤにおいて、導電仏性芯材の外面に貴金属層が形成
されており、更に該貴金属層の外面にはＡＩ、Ａ１合金
、Ｃｕ、Ｃｕ合金よりなる群から選ばれた金属層が形成
されていることを要旨とするものである。
［作用及び実施例］ 要するに本発明は、ワイヤの材料コストを抑制する目的
でワイヤ芯材に安価な金属材を使用し、その表面に貴金
属をめっきして耐食性を具有せしめると共に、該貴金属
めっき層表面に更にＡＩ。
Ａ１合金、Ｃｕ或はＣｕ合金何れかよりなる金属層を形
成することによって、ワイヤと半導体素子及び外部端子
の良好な接合性を確保したものである。本発明のワイヤ
芯材は、ワイヤの材料コストを抑制する目的でとして高
価なＡｕに代替して使用されるものである。従って電気
伝導性が良好な金属であって安価に得られるものであれ
ば、特に種類は限定されず、ＡＩ、Ａ１合金、Ｃｕ或は
Ｃｕ合金等が例示される。
次に本発明の貴金属層は芯材の腐食防止を目的とするも
のであってＡｕ、Ａｇ、Ｐｄ、或はｐｔの単一金属或は
合金層が例示される。また単層および複層の如何を問わ
ない。尚後述する実験例（第２図）に示す様に貴金属層
の耐食性を十分なものとするには、貴金属層の不純物量
をｔ　ｏｏ。
ｐｐｍ以下とすることが望ましい。
この様に芯材外面に貴金属層を形成すれば、貴金属層外
面に形成された外皮層が一部腐食しても、貴金属層の存
在によって、ワイヤ内部に対してそれ以上の腐食が進行
することは防止される。
その結果、ワイヤの耐食性は長期間に亘って十分に保持
される。尚貴金属層の形成方法としては、めっき等の適
宜手段によればよい。
本発明においては、貴金属層の外面に更にＡｌ、Ａ１合
金、Ｃｕ、Ｃｕ合金のいずれかの金属層よりなる外皮層
が形成される。これらの金属はＡＩ蒸着パッドとの接合
性が優れているから、芯材周囲に貴金属層を形成しただ
けのワイヤに比べてワイヤとチップ電極の接合性は潰れ
たものとなる。
この様な本発明の特性を示すため以下の実験（ａ）〜（
ｄ）を行なった。
（ａ）耐食性評価実験 本発明のワイヤの耐食性を調べることを目的として、耐
湿信頼性試験としては最も一般的なプレッシャークツカ
ーテスト（ＰＣＴ）を行なフた。即ちワイヤを樹脂モー
ルドで固め、一定期間保持した後、樹脂を除去しワイヤ
強度の変化を測定した。
本発明に係る実施例として、９９．９重量％Ｃｕ［以下
３　ｎ　（ｔｈｒｅｅ　ｎ１ｎｅ）　Ｃｕということが
ある］を芯材に使用し、９９．９９重量％Ａｕ［以下４
ｎ（ｆｏｕｒ　ｎｆｎｅ）　Ａ　ｕということがある］
を貴金属層材として使用し、又９９．９９　重量％Ｃｕ
［以下４ｎ（ｆｏｕｒ　ｎ１ｎｅ）　Ｃｕということが
ある］を外皮材として使用した。尚比較材としてＡｕ、
４ｎＡ１゜３　ｎＣｕ及び４ｎＡ１＋１瓜量％Ｓｉをそ
れぞれ素材とするワイヤも用意した。ワイヤの線径いず
れも３０μｍφとした。
測定結果を第１図に示す。
第１図においてＰＣＴを行なったときの強度が経時的影
響を殆んど受けなくなる３００時間経過後のワイヤ表面
を観察した。
その結果、本発明例については外皮層のＡ１層には腐食
がみられたが、Ａｕ中間層の介在により腐食はそれ以上
進行せず、Ａｕワイヤに比べても強度が大きく劣化する
ことはなかった。
これに対して、４ｎＡ１，３ｎＣｕ及び４ｎＡｌ＋１重
量％Ｓｔよりなるワイヤは、ＰＣＴにおいて強度比が経
時的に劣化し、腐食が経時的に進行することがわかった
。
尚上記実施例において貴金属材としてＡｕを使用する代
りにＰｔ、Ａｇ、Ｐｄをそれぞれ使用した場合について
も同様の実験をし、更にこれらの実施例において外皮材
として４ｎＡ１を使用する代りにＣｕを使用した場合に
ついても同様の実験を行なった。その結果、前記実施例
の場合と同様に、外皮層は腐食し始めているものの、貴
金属層の存在により、それ以上の腐食は抑制されること
がわかった（図示せず）。
（ｂ）貴金属層の耐食評価実験 この様に中間層としての貴金属層の存在が耐食性を向上
させることがわかったので、次に貴金属層の不純物含有
量とワイヤの耐食性の関係を調べる実験を行なフた。
３　ｎＣｕ芯材の外表面に第１表の各組成よりなる貴金
属めっき層をそれぞれ形成し外径；３０μｍφとした１
０ｆ！の試料を用意し、これらについて５００時間のＰ
ＣＴを行ないＰＣＴ前後の強度比を調べた。
第　　　１　　　表 結果を第２図に示す（図中グラフの番号は第１表におけ
る試料番号と対応する）。
第２図の結果から明らかな様に、不純物含有量が１１０
００ｐｐ未満であるＮｏ、１．３，５．７及び９は、い
ずれもＰＣＴによる強度の低下は全くみられず、耐食性
が良好であることがわがフな。
一方不純物含有量が１１０００ｐｐを超えるＮｏ、２．
４，６．８及び１０はＰＣＴにおいて強度が経時的に低
下することがわかった。
（ｃ）ＡＩ蒸着パッドの接合性試験 更にワイヤとＡＩ蒸着パッドとの接合性を調べることを
目的として、第２表左欄に示すワイヤをＡＩ蒸着パッド
にウェッジボンディングした場合の圧着率を測定した。
圧着率は１００回ボンディングした場合の圧着回数とし
て示す。
第　　　２　　　表 結果を第３図にグラフで示す。
グラフより明らかな様に、（Ａ）及び（Ｃ）のワイヤは
貴金属層としてＡｕ及びｐｔを使用し、しかもその外面
に更に外皮層を設けたものではないので圧着率が５０％
未満であって著しく劣った。
これに対して（Ｂ）　、　（Ｄ）及び（Ｅ）〜（Ｌ）の
ワイヤは、貴金属層としてＡｇ、Ｐｄを使用するか、或
は貴金属層としてＡｕ及びｐｔを使用したものでも外皮
層に更にＡ１層又はＣｕ層を設けてＡＩ蒸着パッドの接
合性の改善をはかった為に、ワイヤとＡＩ蒸着パッドと
の接合性は何れも極めて良好であった。
（ｄ）エレクトロマイグレーション試験第２表左欄のワ
イヤに、１０分間Ｘ５Ｖの条件で電圧をかけてエレクト
ロマイグレーションの有無を調べた。
結果を第２表右欄に示す。
第２表右欄より明らかな様に、芯材表面にＡ３成はＰｄ
よりなる貴金属層を形成しただけの（Ｂ）及び（Ｄ）は
、エレクトロマイグレーションを起した。しかしその他
のワイヤは、貴金属層としてＡｇ、Ｐｄのいずれも使用
しないか、或は使用した場合であフても貴金属層の外面
に更にＡＩ若しくはＣｕ層を形成した為ワイヤとＡＩ蒸
着パッドを接合した場合のＡｇ或はＰｄの影響が抑制さ
れエレクトロマイグレーションを生じなかった。
上記（Ｃ）及び（ｄ）の試験結果から明らかな様に、比
較例の（Ａ）〜（ＤＪはＡＩ蒸着パッドの接合性或はエ
レクトロマイグレーションの何れかに問題を生じたが、
本発明の実施例（Ｅ）〜（Ｌ）は上記（Ｃ）及び（ｄ）
の何れの試験においても優れた結果が得られた。
［発明の効果］ 本発明は以上の様に、芯材外面に形成された貴金属層の
外面に更にＡＩ又はＣｕ或はこれらの合金よりなる外皮
層を形成した三重クラッド複合ワイヤとしたので、ワイ
ヤの耐食性及びワイヤとＡ１蒸着パッドの接合性が極め
て優れており、半導体装置の信頼性が非常に良好なもの
となる複合ボンディングワイヤを提供することができる
。
【図面の簡単な説明】
第１図及び第２図は、本発明例及び比較例についてプレ
ッシャークツカーテストを行なった場合の強度の経時的
変化を示すグラフ、第３図は、本発明例及び比較例にお
けるワイヤとＡＩ蒸着パッドの接合性を示すグラフであ
る。 第１図 ＰＣＴ時間　［ｈｒｌ 第２図 ＰＣＴ時間　Ｈｕｒｌ 第３図 試料記号

Claims (1)

    【特許請求の範囲】
  1. 　半導体素子と外部端子を接続するボンディングワイヤ
    において、導電性芯材の外面に貴金属層が形成されてお
    り、更に該貴金属層の外面にＡｌ、Ａｌ合金、Ｃｕ、Ｃ
    ｕ合金よりなる群から選ばれた金属層が形成されている
    ことを特徴とする複合ボンディングワイヤ。
JP63083584A 1988-04-05 1988-04-05 複合ボンディングワイヤ Pending JPH01255233A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63083584A JPH01255233A (ja) 1988-04-05 1988-04-05 複合ボンディングワイヤ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63083584A JPH01255233A (ja) 1988-04-05 1988-04-05 複合ボンディングワイヤ

Publications (1)

Publication Number Publication Date
JPH01255233A true JPH01255233A (ja) 1989-10-12

Family

ID=13806546

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63083584A Pending JPH01255233A (ja) 1988-04-05 1988-04-05 複合ボンディングワイヤ

Country Status (1)

Country Link
JP (1) JPH01255233A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000015429A1 (en) * 1998-09-16 2000-03-23 Kulicke & Soffa Investments, Inc. Composite wire with noble metal cladding
JP2014082369A (ja) * 2012-10-17 2014-05-08 Nippon Micrometal Corp ボンディングワイヤ
JP2014082368A (ja) * 2012-10-17 2014-05-08 Nippon Micrometal Corp ボンディングワイヤ

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2000015429A1 (en) * 1998-09-16 2000-03-23 Kulicke & Soffa Investments, Inc. Composite wire with noble metal cladding
US6610930B1 (en) 1998-09-16 2003-08-26 Kulicke & Soffa Investments, Inc. Composite noble metal wire
KR100706885B1 (ko) * 1998-09-16 2007-04-11 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 귀금속이 피복된 복합 와이어, 와이어의 제조방법 및 이를 이용한 반도체 패키지
JP2014082369A (ja) * 2012-10-17 2014-05-08 Nippon Micrometal Corp ボンディングワイヤ
JP2014082368A (ja) * 2012-10-17 2014-05-08 Nippon Micrometal Corp ボンディングワイヤ

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