JPH01253929A - Film carrier tape for manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To check thermal contraction of a film carrier tape at the time of mounting a semiconductor chip by setting up metal patterns for radiation made of a metal foil around the openings for mounting semiconductor chips of an insulating film. CONSTITUTION:Broad metal patterns 5 for radiation formed in the integrated shape with lead conductor pieces on a film tape 1 and wirings 4 for plating are formed in the integrated shape with these broad metal patterns 5 for radiation on the film tape 1 are formed being respectively connected with an outer lead bonding(OLB) part 6 of the lead conductor pieces so as to surround the peripheries of the openings for placing semiconductor chips. Further, the substrates of a plurality of lead conductor pieces, metal patterns 5 for radiation and wirings 4 are all made, for instance, of copper foils and their surfaces are coated with gold plating. Thereby, thermal contraction of the film tape 1 in an inner lead bonding(ILB) can be suppressed by a heat radiation effect of the metal patterns 5 for radiation.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a film carrier tape for manufacturing semiconductor devices, and particularly to a film carrier tape that requires high-density packaging.

[Conventional technology]

Conventional film carrier tape for semiconductor device manufacturing has sprocket holes for transportation and positioning on its surface, openings for mounting semiconductor chips, and bump electrodes of semiconductor chips that are bonded by thermocompression bonding or eutectic bonding. A pad for electrical selection is formed from an insulating film such as a polyimide resin that forms a lead and an electrical selection pad that are electrically connected to each other, and a plating wiring that supplies a gold plating current to the surface of the lead and electrical selection pad. It is formed by integrating 7.

Normally, this film carrier tape is made by carrying out electrical selection and bias testing with the semiconductor chip mounted thereon, and then cutting the leads to the desired length to create the outer leads.
Form a bonding part.

At this time, in the case of multiple bottles with a large number of leads, in order to prevent the outer lead bonding part of the leads from coming apart, there is a method of leaving the insulating film that makes up the film carrier tape on the outer edge of the outer lead. is often used. The outer wire is then applied to bonding pads on, for example, a printed circuit board or a typical lead frame.
The lead bonding section is bonded and connected.

In this way, film carrier tape requires only one bonding operation regardless of the number of leads, so the process speed is fast, and assembly work such as bonding and electrical sorting work can be automated, making it excellent for mass production. It has the following advantages.

[Problem to be solved by the invention]

However, using the conventional film carrier described above, the inner lead
Inner lead bonding (
(hereinafter referred to as ILB), approximately 400" C to 5
High heat of 00-C is required. At this time, the high heat is transmitted to the insulating film of the film carrier through the leads, causing thermal contraction of the insulating film. For example, in the case of a polyimide resin film, the shrinkage property of this material is approximately 0.3% at a temperature of 250°C and a heating time of 30 minutes, as is generally known1. Although it only takes a few seconds, the temperature in summer is around 400℃~
Because it is extremely high at 500"C, it also has a temperature of about 0.
．． A heating shrinkage of 3% occurs. That is, the tape length is 101
Shrinkage of approximately 30 μm occurs per serving. Therefore, the outer
If the number of leads in the lead bonding part is 200 to 300 or more and the pitch is 150 μm or less, the terminal lead part will shrink by 225 μm to 33.8 μm, causing outer lead bonding (hereinafter referred to as OLB). When this is done, an undesirable problem arises in that short circuits occur with adjacent OLB pads.

In view of the above-mentioned problems, the object of the invention is to provide a film/carrier for semiconductor device manufacturing that alleviates thermal shrinkage in inner lead bonding between semiconductor chips and leads.
The purpose is to provide tapes.

[Failure to solve the problem]

According to the present invention, a film carrier tape for semiconductor device manufacturing includes an insulating film tape and the film carrier tape.
A sprocket hole and a semiconductor chip mounting opening are formed at the side edges and the center of the tape, respectively;
Inner leads are placed inside the semiconductor chip mounting opening.
A plurality of lead conductor pieces formed with protruding bonding portions are connected to the outer lead bonding portions of the plurality of lead conductor pieces, respectively, and leads are formed so as to surround the semiconductor chip mounting opening. The present invention includes a wide metal pattern for heat radiation formed integrally with the conductor piece, and a wiring for plating formed integrally with the metal pattern for heat radiation.

〔Example〕

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is a partial plan view of a film carrier tape for manufacturing semiconductor devices showing an embodiment of the present invention. According to this embodiment, only the first quadrant of the film carrier tape is shown, and there is an insulating film tape 1 made of polyimide resin and openings at the side edges and center of the film tape 1, respectively. A sprocket hole 2 and a semiconductor chip mounting opening 10 are formed, and an inner lead bonding (ILB) portion 3 is protruded into the semiconductor chip mounting opening 10 to form a film tape 1.
A plurality of lead conductor pieces formed above and an outer lead punch ink (OLB) portion 6 of this lead conductor piece.
a wide metal pattern 5 for heat dissipation formed integrally with the lead conductor piece on the film tape 1 so as to surround the opening for mounting the semiconductor chip, and
This width is wide. Here, 7 and 8 indicate the respective edges of the semiconductor chip mounting opening and the heat dissipation metal pattern 5, and also the plurality of lead conductor pieces and the heat dissipation metal pattern 5.
The base of the plating wiring 4 is made of copper foil,
Its surface is coated with gold plating through the plating wiring 4 in a plating process. According to this Φ example, the line width l of the plating wiring is 0.4 to 1,
01111, the pattern width L1. of the heat dissipation metal pattern 5 is When L2 is set between 20 and 4.0, the thermal shrinkage of the film/tape 1 in FILB is reduced from the conventional 0.3% to 0.1% or less due to the heat dissipation effect of the heat dissipation metal pattern 5. It can be suppressed. In other words, the OLB pad of the printed circuit board etc. and the OL of the lead conductor piece
Positioning with the B section 6 can now be performed accurately.

Note that if the metal pattern 5 for heat dissipation is placed side by side with the back surface of the film/tape 1, an even greater effect can be achieved.

FIG. 2 is a partial plan view of a film carrier tape for manufacturing semiconductor devices showing another embodiment of the present invention. According to this embodiment, only the first quadrant of the film carrier tape is shown, and unlike the previous embodiment, the edge of the metal pattern 5 for heat dissipation is placed within the semiconductor chip mounting opening 10 with a width of 1. ．． , 12 are formed to protrude. According to this embodiment, the heat dissipation effect of the heat dissipation metal pattern 5 is further increased by setting the line width l of the plating wiring 4 to 0.4 to 1.
0), the width of the heat dissipation pattern, L, is 2.
0-4.0%, protrusion width 1x, lz 1.0-201
When set to , it is possible to suppress the thermal shrinkage of the insulating film/tape 1 to a very small level of approximately α05% or less.

The dimensions of the OLB portion 6 of the lead can be made almost unchanged before and after ILB is performed.

This effect allows accurate alignment between the OLB pad on the printed circuit board and the OLB portion 6 of the lead conductor piece, which eliminates the conventional problem of short circuits between adjacent OLE pads during the OLB process. problem is solved.

〔Effect of the invention〕

As explained in detail above, according to the present invention, a heat dissipation metal pattern made of metal foil such as copper is set around the semiconductor chip mounting opening of the insulating film constituting the film carrier tape. In particular, thermal shrinkage of the film carrier tape when mounting a semiconductor chip can be almost completely suppressed, and the OLB part pad on the printed circuit board etc. and the OLB part of the IC lead can be accurately aligned. Therefore, film carrier tapes that require high-density packaging, for example, the number of lead OLBs is 200 to 30.
If applied to a long film carrier tape with a lead pitch of 0 or more and a lead pitch of 150 μm or less, it can have a remarkable effect on improving production yield.

[Brief explanation of the drawing]

FIG. 1 is a partial plan view of a film carrier tape for manufacturing semiconductor devices showing one embodiment of the present invention, and FIG. 2 is a partial plan view of a film carrier tape for manufacturing semiconductor devices showing another embodiment of the invention. FIG. DESCRIPTION OF SYMBOLS 1... Insulating film/tape, 2... Sprocket hole, 3... ILB part of lead, 4... Wiring for plating, 5... Metal pattern for heat radiation, 6... OLB of lead Section 7...Edge of opening for semiconductor chip placement;
8... Edge of metal pattern for heat dissipation, 10... Opening for semiconductor chip placement. Agent: Patent Attorney Uchihara Otoki l 呵茅 2-rM

Claims (1)

[Claims] An insulating film tape and a sprocket with holes formed in the side edges and center of the film tape, respectively.
a hole and an opening for placing a semiconductor chip, and a plurality of lead conductor pieces formed by protruding an inner lead bonding part into the opening for placing a semiconductor chip;
a wide metal pattern for heat dissipation that is connected to the outer lead bonding portions of the plurality of lead conductor pieces and formed integrally with the lead conductor pieces so as to surround the semiconductor chip mounting opening; A film carrier tape for manufacturing semiconductor devices, comprising a plating wiring formed integrally with the heat dissipation metal pattern.