JPH0125207B2 - - Google Patents
Info
- Publication number
- JPH0125207B2 JPH0125207B2 JP58012336A JP1233683A JPH0125207B2 JP H0125207 B2 JPH0125207 B2 JP H0125207B2 JP 58012336 A JP58012336 A JP 58012336A JP 1233683 A JP1233683 A JP 1233683A JP H0125207 B2 JPH0125207 B2 JP H0125207B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone resin
- resistor
- inorganic powder
- film
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002050 silicone resin Polymers 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 13
- 239000003566 sealing material Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 4
- 239000000779 smoke Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- -1 methylsiloxane Chemical class 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 238000004534 enameling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233683A JPS59138301A (ja) | 1983-01-28 | 1983-01-28 | 抵抗器の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233683A JPS59138301A (ja) | 1983-01-28 | 1983-01-28 | 抵抗器の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59138301A JPS59138301A (ja) | 1984-08-08 |
| JPH0125207B2 true JPH0125207B2 (US20030204162A1-20031030-M00001.png) | 1989-05-16 |
Family
ID=11802452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1233683A Granted JPS59138301A (ja) | 1983-01-28 | 1983-01-28 | 抵抗器の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138301A (US20030204162A1-20031030-M00001.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531B2 (US20030204162A1-20031030-M00001.png) * | 1975-09-18 | 1981-04-10 | ||
| JPS57561U (US20030204162A1-20031030-M00001.png) * | 1980-05-30 | 1982-01-05 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531U (US20030204162A1-20031030-M00001.png) * | 1979-07-16 | 1981-02-10 |
-
1983
- 1983-01-28 JP JP1233683A patent/JPS59138301A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531B2 (US20030204162A1-20031030-M00001.png) * | 1975-09-18 | 1981-04-10 | ||
| JPS57561U (US20030204162A1-20031030-M00001.png) * | 1980-05-30 | 1982-01-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59138301A (ja) | 1984-08-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3496427A (en) | Semiconductor device with composite encapsulation | |
| US5572181A (en) | Overcurrent protection device | |
| US3505571A (en) | Glass covered semiconductor device | |
| US4396666A (en) | Solderable conductive employing an organic binder | |
| JPH0125207B2 (US20030204162A1-20031030-M00001.png) | ||
| US3903494A (en) | Metal oxide varistor with coating that enhances contact adhesion | |
| GB2035289A (en) | Glass for encapsulation of semiconductor devices | |
| US3447975A (en) | Bilayer protective coating for exposed p-n junction surfaces | |
| US4581279A (en) | Thick film circuit board | |
| JPS6347901A (ja) | 電子部品 | |
| US3278813A (en) | Transistor housing containing packed, earthy, nonmetallic, electrically insulating material | |
| JP3634899B2 (ja) | 固定抵抗器 | |
| JP3099864B2 (ja) | 半導体素子を有する回路装置及びその製造方法 | |
| US3021233A (en) | Method of applying an electrically conductive contact material and resulting coated article | |
| JP3645014B2 (ja) | 固定抵抗器の製造方法 | |
| JPH0536559A (ja) | 外装形電子部品及びその外装形成方法 | |
| JP3048650B2 (ja) | 電子部品用封止材及びそれを用いた電子部品 | |
| JP3171743B2 (ja) | バリスタの製造法 | |
| JP3157915B2 (ja) | 回路保護用素子 | |
| JPH01304701A (ja) | 電子部品 | |
| US3474301A (en) | Semiconductor devices having insulating protective films and sealed with resinous materials | |
| JP6299372B2 (ja) | 半導体装置およびその製造方法 | |
| JPH09186005A (ja) | 限流素子およびその製造方法 | |
| JPH0441558Y2 (US20030204162A1-20031030-M00001.png) | ||
| JP4513938B2 (ja) | 電子部品 |
