JPH0125207B2 - - Google Patents
Info
- Publication number
- JPH0125207B2 JPH0125207B2 JP58012336A JP1233683A JPH0125207B2 JP H0125207 B2 JPH0125207 B2 JP H0125207B2 JP 58012336 A JP58012336 A JP 58012336A JP 1233683 A JP1233683 A JP 1233683A JP H0125207 B2 JPH0125207 B2 JP H0125207B2
- Authority
- JP
- Japan
- Prior art keywords
- silicone resin
- resistor
- inorganic powder
- film
- sealing material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920002050 silicone resin Polymers 0.000 claims description 29
- 239000000919 ceramic Substances 0.000 claims description 16
- 239000000843 powder Substances 0.000 claims description 13
- 239000003566 sealing material Substances 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 11
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 238000000354 decomposition reaction Methods 0.000 claims description 4
- 239000000779 smoke Substances 0.000 description 10
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- -1 methylsiloxane Chemical class 0.000 description 4
- 230000002411 adverse Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000945 filler Substances 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000002320 enamel (paints) Substances 0.000 description 1
- 238000004534 enameling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910001120 nichrome Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
【発明の詳細な説明】
〔発明の目的〕
（産業上の利用分野）
本発明は、例えばオーデイオ機器用抵抗器等に
用いられる抵抗器の製造方法に係り、負荷荷状態
においても発煙しない抵抗器の製造方法に関す
る。[Detailed Description of the Invention] [Objective of the Invention] (Industrial Field of Application) The present invention relates to a method for manufacturing a resistor used, for example, in a resistor for audio equipment, and relates to a resistor that does not emit smoke even under load. Relating to a manufacturing method.
（従来の技術）
従来、カーボン皮膜抵抗器、金属皮膜抵抗器、
金属酸化物皮膜抵抗器等は抵抗皮膜の保護と外装
のために抵抗素子の表面をエポキシ樹脂塗料で被
覆したものがあるが、使用時に過負荷状態となつ
て温度が500℃〜600℃になると表面の塗料が燃え
て発煙しその回路やセツトに悪影響を及ぼすとい
う問題があつた。このため塗料を用いない無煙抵
抗器として抵抗素子をホーローで被覆したりガラ
スに封入する方法が採られていた。(Conventional technology) Conventionally, carbon film resistors, metal film resistors,
Some metal oxide film resistors have the surface of the resistance element coated with epoxy resin paint to protect the resistance film and the exterior, but if it is overloaded during use and the temperature reaches 500℃ to 600℃. There was a problem that the paint on the surface would burn and emit smoke, which would adversely affect the circuit and set. For this reason, methods have been adopted in which smokeless resistors do not use paint, in which the resistance element is coated with enamel or sealed in glass.
また、実公昭57−561号公報に記載されている
ように、皮膜抵抗器ではないが、抵抗素子の赤熱
による火災等の事故を防ぐために、ニクロム線等
をコイル状に巻いた抵抗素子をセラミツクケース
に入れ、無機質粉末とシリコーン樹脂よりなる充
填材を充填して加熱硬化させた自動車用空調機の
送風機電流制限用の抵抗器が知られている。 In addition, as described in Japanese Utility Model Publication No. 57-561, although it is not a film resistor, in order to prevent accidents such as fires due to red heat of the resistor element, a ceramic resistor is made of a coiled nichrome wire. A resistor for limiting the blower current of an automobile air conditioner is known, which is placed in a case, filled with a filler made of inorganic powder and silicone resin, and then heated and hardened.
さらに、実開昭56−15531号公報に記載されて
いるように、スピーカボツクスの前面に取付けら
れるスイツチに接続される抵抗器の過熱によるス
イツチ取付部の変形や焼損を防止するために、磁
器材料よりなるケース内に抵抗素子を収納し無機
質フイラーを含むシリコーン樹脂コンパウンドを
充填固化した抵抗器をスイツチに接続した電力型
抵抗切替調整器が知られている。 Furthermore, as described in Japanese Utility Model Application Publication No. 56-15531, in order to prevent the switch mounting part from being deformed or burnt out due to overheating of the resistor connected to the switch mounted on the front of the speaker box, porcelain material was used. A power-type resistance switching regulator is known in which a resistor element is housed in a case made of a silicone resin, and a resistor filled with and solidified with a silicone resin compound containing an inorganic filler is connected to a switch.
（発明が解決しようとする問題点）
上述の皮膜抵抗器をホーロー被覆する方法は、
ホーロー加工時に500℃〜600℃になり皮膜抵抗が
損なわれるため適用できず、またガラス封入によ
る方法は、コストが高くかつガラスが破損し易い
という問題がある。(Problems to be Solved by the Invention) The method of enamel coating the film resistor described above is as follows:
This cannot be applied because the temperature reaches 500° C. to 600° C. during enameling, which impairs the film resistance, and the method of enclosing glass has problems in that it is expensive and the glass is easily damaged.
さらに、実公昭57−561号公報または実開昭56
−15531号公報に記載の抵抗器は、何れも抵抗素
子をセラミツクケースに収納し、無機質粉末とシ
リコーン樹脂よりなる充填材を充填して固化させ
ることにより、過負荷時の過熱による自動車空調
機の通風ダクトの火災やスピーカボツクスの焼損
等を防止しているが、抵抗器に充填された充填材
のシリコーン樹脂は、主成分がジメチルポリシロ
キサンであるため高温下に於てはその有機質成分
が発煙し、発煙によつてオーデイオアンプ用抵抗
器等として用いた場合、その回路やセツトに悪影
響を及ぼすという問題がある。 Furthermore, Utility Model Publication No. 57-561 or Utility Model Publication No. 56
In the resistors described in Publication No. 15531, the resistance element is housed in a ceramic case, filled with a filler made of inorganic powder and silicone resin, and then solidified. This prevents fires in ventilation ducts and burnout of speaker boxes, etc., but the silicone resin used as the filler in the resistor is mainly composed of dimethylpolysiloxane, so its organic components can cause smoke at high temperatures. However, when used as a resistor for an audio amplifier or the like, there is a problem in that the smoke generated has an adverse effect on the circuit or set.
本発明の目的は、上記問題点に鑑み、皮膜抵抗
器素子をセラミツクケース内において封止材料中
に埋設して皮膜抵抗を保護するとともに、熱処理
により封止材料が過負荷時に発煙しない抵抗器の
製造方法を提供するものである。 In view of the above problems, it is an object of the present invention to provide a resistor that protects the film resistor by embedding the film resistor element in a sealing material in a ceramic case, and that does not emit smoke when the sealing material is overloaded by heat treatment. A manufacturing method is provided.
（問題点を解決するための手段）
本発明の抵抗器の製造方法は、皮膜抵抗器素子
を収納したセラミツクケース内に無機質粉末とシ
リコーン樹脂とよりなる封止材料を充填し、次に
シリコーン樹脂中の有機質成分の分解温度で熱処
理することにより、シリコーン樹脂を硬化させて
無機質粉末と結合させるとともにシリコーン樹脂
が含む発煙成分を揮散させるものである。
(Means for Solving the Problems) In the resistor manufacturing method of the present invention, a ceramic case housing a film resistor element is filled with a sealing material made of an inorganic powder and a silicone resin, and then a silicone resin By heat treatment at the decomposition temperature of the organic components therein, the silicone resin is cured and combined with the inorganic powder, and the fuming components contained in the silicone resin are volatilized.
（作用）
本発明の抵抗器の製造方法は、セラミツクケー
ス内に充填された無機質粉末とシリコーン樹脂よ
りなる封止材料をシリコーン樹脂中の有機質成分
の分解温度で熱処理することによりシリコーン樹
脂が含む発煙性有機質成分（メチルシロキサン）
が分解されて揮散する。したがつて抵抗器の過負
荷時に高温によつて封止材料が発煙することがな
い。またこの熱処理によつて同時に無機質粉末と
シリコーン樹脂が結合されて抵抗器素子がセラミ
ツクケース内に一体に埋設保護される。(Function) The resistor manufacturing method of the present invention heat-treats a sealing material made of inorganic powder and silicone resin filled in a ceramic case at the decomposition temperature of the organic components in the silicone resin, thereby generating smoke contained in the silicone resin. Organic component (methylsiloxane)
decomposes and evaporates. Therefore, the sealing material does not smoke due to high temperatures when the resistor is overloaded. Also, through this heat treatment, the inorganic powder and the silicone resin are simultaneously bonded, and the resistor element is buried and protected as one piece within the ceramic case.
（実施例）
次に本発明の実施例を添附図面によつて説明す
る。(Example) Next, an example of the present invention will be described with reference to the accompanying drawings.
図に示すようにセラミツクケース１内に皮膜抵
抗素子２を収納し、セラミツクケース１の両端の
切溝３，３より素子２に接続した導線４，４を外
方へ引出しておく。次にシリコーン樹脂を配合し
た無機質粉末よりなる封止材料をセラミツクケー
ス１内に充填して素子２を埋め込み、次に熱処理
を施してシリコーン樹脂を硬化させて無機質粉末
を結合させるとセラミツクケース１と一体に固化
した封止材料５中に素子２が封入される。 As shown in the figure, a film resistance element 2 is housed in a ceramic case 1, and conductive wires 4, 4 connected to the element 2 are drawn out from grooves 3, 3 at both ends of the ceramic case 1. Next, the ceramic case 1 is filled with a sealing material made of inorganic powder mixed with silicone resin, and the element 2 is embedded.Then, heat treatment is performed to harden the silicone resin and bond the inorganic powder. The element 2 is encapsulated in the integrally solidified encapsulating material 5.
セラミツクケース１はムライト系セラミツクス
またはステアタイト系セラミツクスのどちらでも
使用出来る。封止材料５の無機質粉末としては、
SiO2またはAl2O3を主成分としたものが用いられ
るが、Al2O3を主成分としたものでは、熱伝導が
良好であるから放熱性が良く、電力型抵抗に適し
ている。またシリコーン樹脂としては、モノメチ
ルシロキサンを主成分とするものが炭素数が少な
いため適当である。さらにシリコーン樹脂の流動
性を高めるために、少量の有機溶剤が加えられ
る。次に封止材料の組成の一例をあげると次のと
おりである。 The ceramic case 1 can be made of either mullite ceramics or steatite ceramics. As the inorganic powder of the sealing material 5,
A material containing SiO 2 or Al 2 O 3 as a main component is used, and a material containing Al 2 O 3 as a main component has good heat conduction and good heat dissipation, and is suitable for power type resistors. Furthermore, as the silicone resin, one containing monomethylsiloxane as a main component is suitable because it has a small number of carbon atoms. Additionally, a small amount of organic solvent is added to increase the fluidity of the silicone resin. Next, an example of the composition of the sealing material is as follows.
シリコーン樹脂 ５〜10〔重量部〕
（信越化学工業株式会社製KR221）
無機質粉末 珪 石 325＃20〜25 〃
〃 150＃25〜30 〃
〃 50＃25〜30 〃
カリオン ２〜10 〃
溶 剤 インプロピアルコール
５〜 6 〃
キシレン ５〜 6 〃
次に熱処理に際しては100℃以下で数時間予備
乾燥して溶剤による発泡などを防止しながら溶剤
を揮散させ、次に100℃〜300℃で約10分過熱しシ
リコーン樹脂を硬化させるとともにシリコーン樹
脂中の有機質成分（メチルシロキサン）を分解し
て揮散させる。Silicone resin 5-10 [parts by weight] (KR221 manufactured by Shin-Etsu Chemical Co., Ltd.) Inorganic powder Silica stone 325#20-25 〃 〃 150#25-30 〃 〃 50#25-30 〃 Carrion 2-10 〃 Solvent In Propyl alcohol 5-6 〃 Xylene 5-6 〃 Next, during heat treatment, pre-dry at 100°C or less for several hours to volatilize the solvent while preventing foaming caused by the solvent, and then dry at 100°C to 300°C for about 10 minutes. The silicone resin is heated to harden, and the organic component (methylsiloxane) in the silicone resin is decomposed and volatilized.
熱処理は導線４のハンダメツキ端子の酸化を防
ぐために、真空中あるいはN2，H2雰囲気中で行
う場合もあり、端子のハンダ付け性を保つに有効
である。 In order to prevent the solder-plated terminals of the conductive wires 4 from oxidizing, the heat treatment may be carried out in a vacuum or in an N 2 or H 2 atmosphere, which is effective in maintaining the solderability of the terminals.
本発明によれば、皮膜抵抗器素子をセラミツク
ケース内に収納し無機質粉末とシリコーン樹脂と
よりなる封止材料中に封入してシリコーン樹脂中
の有機質の成分の分解温度で熱処理するから、無
機質粉末は熱処理により硬化したシリコーン樹脂
によつてセラミツクケース体と一体に結合され、
埋設された抵抗器素子を封入して皮膜の保護、防
湿をすることが出来、同時に熱処理によつてシリ
コーン樹脂中の発煙成分となる有機質成分（メチ
ルシロキサン）が分解して揮散されるため、例え
ばオーデイオアンプ用抵抗器等として用いた場合
に過負荷状態において封止材料が発煙するような
ことがなく、発煙によつてその回路及びセツトに
悪影響を及ぼすおそれがない。さらにシリコーン
樹脂の熱硬化温度はガラスやホーローの熱処理温
度に比べて低いため、熱処理によつて皮膜抵抗器
素子の皮膜を損うようなおそれもない。
According to the present invention, the film resistor element is housed in a ceramic case, sealed in a sealing material made of inorganic powder and silicone resin, and heat-treated at the decomposition temperature of the organic component in the silicone resin. is integrally bonded to the ceramic case body using silicone resin hardened by heat treatment.
The buried resistor element can be encapsulated to protect the film and provide moisture resistance, and at the same time, the organic component (methylsiloxane) that causes smoke in the silicone resin is decomposed and volatilized through heat treatment. When used as a resistor for an audio amplifier, etc., the sealing material does not emit smoke in an overloaded state, and there is no risk of the smoke emitting an adverse effect on the circuit and set. Furthermore, since the heat curing temperature of silicone resin is lower than the heat treatment temperature of glass or enamel, there is no fear that the film of the film resistor element will be damaged by heat treatment.
図は本発明の実施例の方法によつて得られた抵
抗器の縦断側面図である。
１……セラミツクケース、２……皮膜抵抗器素
子、５……封止材料。
The figure is a longitudinal cross-sectional side view of a resistor obtained by the method of the embodiment of the present invention. 1... Ceramic case, 2... Film resistor element, 5... Sealing material.
Claims (1)
内に無機質粉末とシリコーン樹脂とよりなる封止
材料を充填し、次にシリコーン樹脂中の有機質成
分の分解温度で熱処理することにより、シリコー
ン樹脂を硬化させて無機質粉末と結合させるとと
もにシリコーン樹脂が含む発煙成分を揮散させる
ことを特徴とする抵抗器の製造方法。1 A sealing material made of inorganic powder and silicone resin is filled into a ceramic case containing a film resistor element, and then the silicone resin is cured by heat treatment at the decomposition temperature of the organic component in the silicone resin. A method for manufacturing a resistor, which comprises combining with an inorganic powder and volatilizing a fuming component contained in a silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233683A JPS59138301A (en) | 1983-01-28 | 1983-01-28 | Small-sized resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233683A JPS59138301A (en) | 1983-01-28 | 1983-01-28 | Small-sized resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59138301A JPS59138301A (en) | 1984-08-08 |
| JPH0125207B2 true JPH0125207B2 (en) | 1989-05-16 |
Family
ID=11802452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1233683A Granted JPS59138301A (en) | 1983-01-28 | 1983-01-28 | Small-sized resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138301A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531B2 (en) * | 1975-09-18 | 1981-04-10 | ||
| JPS57561U (en) * | 1980-05-30 | 1982-01-05 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531U (en) * | 1979-07-16 | 1981-02-10 |
-
1983
- 1983-01-28 JP JP1233683A patent/JPS59138301A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531B2 (en) * | 1975-09-18 | 1981-04-10 | ||
| JPS57561U (en) * | 1980-05-30 | 1982-01-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59138301A (en) | 1984-08-08 |
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