JPS59138301A - Small-sized resistor - Google Patents
Small-sized resistorInfo
- Publication number
- JPS59138301A JPS59138301A JP1233683A JP1233683A JPS59138301A JP S59138301 A JPS59138301 A JP S59138301A JP 1233683 A JP1233683 A JP 1233683A JP 1233683 A JP1233683 A JP 1233683A JP S59138301 A JPS59138301 A JP S59138301A
- Authority
- JP
- Japan
- Prior art keywords
- ceramic case
- small
- silicone resin
- heat treatment
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は、例えばオ・−ダイオ機器用抵抗器等に用いら
れる小型抵抗器に係り、過負荷状態においても発煙しな
い小型抵抗器に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a small resistor used, for example, in a resistor for audio-diode equipment, and more particularly, to a small resistor that does not emit smoke even under overload conditions.
従来、カーボレ゛皮膜抵抗器、金属皮膜抵抗器、金゛属
酸化皮膜抵抗器等は抵抗皮膜の保穫と外装のために抵抗
素子の表面をエポキシ樹脂塗料で被覆したものがあるが
、使用時に過負荷状態となって温度が５００Ｃ〜６００
Ｃになると表面の塗料が燃えて発煙しその回路やセット
に悪影響を及ぼすという問題があった。また途料を用い
ない無煙抵抗器として抵抗素子をホーローで被覆したり
ガラスに封入したりしたものがあるが、ホーロー被覆は
ホーロー 加工時に５００Ｃ〜６００ＣＫなるため皮膜
抵抗器には適用出来ず、またガラス封入はコストが高く
かつガラスが破損しやすいという欠点がある。Conventionally, the surface of the resistance element of carbon film resistors, metal film resistors, metal oxide film resistors, etc. has been coated with epoxy resin paint to protect the resistance film and protect the exterior. The temperature is 500C to 600C due to overload condition.
In the case of C, the paint on the surface burns and smokes, which has a negative effect on the circuit and set. In addition, there are smokeless resistors that do not use any materials, such as those in which the resistance element is coated with enamel or sealed in glass, but the enamel coating becomes 500C to 600CK during enamel processing, so it cannot be applied to film resistors. Glass encapsulation has the drawbacks of high cost and easy glass breakage.
本発明は上述の問題に鑑み、セラミックケース内に収態
された小型皮膜抵抗器素子を、前記セラミックケース内
に充填され熱処理拠よって結合した無機質粉末とシリコ
ーン樹脂よりなる封止材料に制入し、熱処理によりシリ
コーン樹脂を硬化させて無機質粉末を結合させるととも
に発煙成分を揮散させ、過負荷時の発熱によっても発煙
しないようにしたものである。In view of the above-mentioned problems, the present invention incorporates a small film resistor element housed in a ceramic case into a sealing material made of inorganic powder and silicone resin filled in the ceramic case and bonded by heat treatment. , the silicone resin is cured by heat treatment to bond the inorganic powder, and the smoke-generating components are volatilized, so that smoke does not emit even when heat is generated during overload.
本発明は、セラミックケースと、このセラミックケース
内に収納された小型皮膜抵抗器素子と、前記セラミック
ケース内に充填され熱処理によって結合して前記抵抗器
・素子を封入した封止材料とよりなり、との封止材料が
無機質粉末と・シリコーン樹脂とよりなり、熱処理によ
ってシリコーン樹脂を硬化させるとともに有機質成分を
分解して揮散させるものである。The present invention comprises a ceramic case, a small film resistor element housed in the ceramic case, and a sealing material filled in the ceramic case and bonded by heat treatment to encapsulate the resistor/element, The sealing material is made of inorganic powder and silicone resin, and the silicone resin is hardened by heat treatment, and the organic components are decomposed and volatilized.
次に本発明の実施例を添附図面について説明する。 Next, embodiments of the present invention will be described with reference to the accompanying drawings.
矛１図に示すようにセラミックケース（１１内に皮膜抵
抗器素子（２）を収納し、セラミックケース（１）の両
端の切溝１３１ ＋３１より素子（２）に接続した導線
（４１＋４１を外方へ引出しておく。次にシリコーン樹
脂を配合した無機質粉末よりなる封止材料をセラミック
ケース（ＩＩ内に充填して素子（２）を埋め込み、次に
熱処理を施してシリコーン樹脂を硬化させて無機質粉末
を結合させるとセラミックケース（１）と一体に固化し
た封止材料（５）中に素子（２）が封入される。As shown in Figure 1, the film resistor element (2) is housed inside the ceramic case (11), and the conductor (41+41) connected to the element (2) is inserted outward through the grooves 131+31 at both ends of the ceramic case (1). Next, a sealing material made of inorganic powder mixed with silicone resin is filled into the ceramic case (II) to embed the element (2), and then heat treatment is performed to harden the silicone resin to form the inorganic powder. When these are combined, the element (2) is encapsulated in the sealing material (5) which is solidified integrally with the ceramic case (1).
セラミックケース（１）はムライト系セラミックスまた
はステアタイト系セラミックスのどちらでも使用出来る
。封止材料（５）の無機質粉末としては、Ｆｌｉｐ２ま
たはＡｌ２Ｏ３を主成分とした−ものが用いられるが、
ＡＪ１２０．を主成分としたものは、熱伝導が良好であ
るから放熱性が良く、電力型抵抗に適して（・る。また
シリコーン樹脂としては、モノメチルシロキサンを主成
分とするものが炭素数が少ないため適当である。さらに
シリコーン樹脂の流動性を高めるために、少量の有機溶
剤が加えられる。The ceramic case (1) can be made of either mullite ceramics or steatite ceramics. As the inorganic powder of the sealing material (5), Flip2 or one containing Al2O3 as a main component is used.
AJ120. Silicone resins whose main component is monomethylsiloxane have good heat dissipation and are suitable for power type resistors because they have good thermal conductivity. Suitable.Additionally, a small amount of organic solvent is added to increase the fluidity of the silicone resin.
次に刊止祠料の組成の一例をあげると次のとおりである
。Next, an example of the composition of the sacrificial material is as follows.
シリコーン樹脂 ５〜１ｏ
〔重量部〕（信越化学工業株式会社ＭＫＲ２２１）無機
質粉末 珪 石 ３２５＝＃−２０〜２５〃＃ １
５０４２５〜３０ ｔｔ
珪 石 ５０＋ ２５〜３０ Ｉカオリン
２〜１０ ｙ
溶剤 イソプロピルアルコール ５〜６
＃キシレン ５〜６ 〃
次に熱処理に際しては１０００以下で数時間予備乾燥し
て溶剤による発泡などを防止しながら溶剤を揮散させ、
次に１００Ｃ〜３００Ｃで数１０分加熱しシリコーン樹
脂を硬化させるとともにシリコーン樹脂中の有機質成分
を分解して揮散させる。Silicone resin 5~1o
[Parts by weight] (Shin-Etsu Chemical Co., Ltd. MKR221) Inorganic powder Silica stone 325 = #-20 to 25 #1
50425~30 tt Silica stone 50+ 25~30 I Kaolin
2-10y Solvent Isopropyl alcohol 5-6
#Xylene 5-6 Next, during heat treatment, pre-dry for several hours at a temperature of 1000 or less to volatilize the solvent while preventing foaming caused by the solvent.
Next, the silicone resin is cured by heating at 100C to 300C for several tens of minutes, and the organic components in the silicone resin are decomposed and volatilized.
熱処理は、導線（４）のハンダメッキ端子の酸化を防ぐ
ために、真空中あるいはＮ２、Ｈ２雰囲気中で行う場合
もあり、端子のハンダ付は性を保つに有効である。The heat treatment may be performed in vacuum or in an N2 or H2 atmosphere in order to prevent oxidation of the solder-plated terminals of the conductive wire (4), and soldering the terminals is effective in maintaining the properties.
本発明によれば、セラミックケース内に収納された小型
皮膜抵抗器素子を、前記セラミックケース内に充填され
熱処理によって結合した無機質粉末とシリコーン樹脂と
よりなる封止材料中に封入したから、熱処理により無機
質粉末は硬化したシリコーン樹脂釦よって結合され、埋
設された抵抗器素子を封入して皮膜の保護、防湿をする
ことが出来、同時に熱処理によってシリコーン樹脂中の
発煙成分となる有機質成分が分解して揮散されるため、
例えばオーディオアンプ用抵抗器等として用いた場合に
過負荷状態において発煙するようなことがなく、発煙に
よってその回路及びセットに悪影響を及ぼすおそれ・か
ない。さらにシリコーン樹脂の熱硬化温度はガラスやホ
ーローの熱処理温度に比べて低いため、熱処理によって
皮膜抵抗器素子の皮膜を損うようなおそれもない。According to the present invention, a small film resistor element housed in a ceramic case is encapsulated in a sealing material made of an inorganic powder and a silicone resin filled in the ceramic case and bonded by heat treatment. The inorganic powder is bonded with a hardened silicone resin button, which can encapsulate the buried resistor element to protect the film and prevent moisture.At the same time, heat treatment decomposes the organic components in the silicone resin that cause smoke. Because it evaporates,
For example, when used as a resistor for an audio amplifier, it will not emit smoke in an overloaded state, and there is no risk that the emitted smoke will have an adverse effect on the circuit or set. Furthermore, since the heat curing temperature of silicone resin is lower than the heat treatment temperature of glass or enamel, there is no fear that the film of the film resistor element will be damaged by heat treatment.
図は本発明の一実施例を示す抵抗器の縦断側面図である
。
（１）・・セラミックケース、（２）・・小型皮膜抵抗
器素子、（５）や・封止材料。The figure is a longitudinal sectional side view of a resistor showing one embodiment of the present invention. (1) Ceramic case, (2) Small film resistor element, (5) Sealing material.
Claims (1)
内に収納された小型皮膜抵抗器素子と、前記セラミック
ケース内に充填され熱処理によって結合して前記抵抗器
素子を封入した封止材料とよりなり、この封止材料が無
機質粉末とシリコーン樹脂とよりなることを特徴とする
小型抵抗器。(1) Consisting of a ceramic case, a small film resistor element housed in the ceramic case, and a sealing material filled in the ceramic case and bonded by heat treatment to encapsulate the resistor element. A small resistor characterized in that the stopping material is made of inorganic powder and silicone resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233683A JPS59138301A (en) | 1983-01-28 | 1983-01-28 | Small-sized resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1233683A JPS59138301A (en) | 1983-01-28 | 1983-01-28 | Small-sized resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59138301A true JPS59138301A (en) | 1984-08-08 |
| JPH0125207B2 JPH0125207B2 (en) | 1989-05-16 |
Family
ID=11802452
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1233683A Granted JPS59138301A (en) | 1983-01-28 | 1983-01-28 | Small-sized resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59138301A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531U (en) * | 1979-07-16 | 1981-02-10 | ||
| JPS57561U (en) * | 1980-05-30 | 1982-01-05 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5236951A (en) * | 1975-09-18 | 1977-03-22 | Yaskawa Electric Mfg Co Ltd | Computer system |
-
1983
- 1983-01-28 JP JP1233683A patent/JPS59138301A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5615531U (en) * | 1979-07-16 | 1981-02-10 | ||
| JPS57561U (en) * | 1980-05-30 | 1982-01-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0125207B2 (en) | 1989-05-16 |
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