JPS5913318A - Method of producing electronic part - Google Patents
Method of producing electronic partInfo
- Publication number
- JPS5913318A JPS5913318A JP57122413A JP12241382A JPS5913318A JP S5913318 A JPS5913318 A JP S5913318A JP 57122413 A JP57122413 A JP 57122413A JP 12241382 A JP12241382 A JP 12241382A JP S5913318 A JPS5913318 A JP S5913318A
- Authority
- JP
- Japan
- Prior art keywords
- wax
- electronic component
- present
- exterior
- exterior resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
的歪みを緩衝できるようにした電子部品の製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing an electronic component that can buffer distortion.
たとえばセラミックコンデンサ侑、エポキシ樹脂やフェ
ノール樹脂等の外装樹脂がコーチイア’ｆされている。For example, ceramic capacitors are coated with exterior resins such as epoxy resins and phenolic resins.
ところがこの外装樹脂は、熱膨張係数が大きいため、コ
ンデンサ自体に機械的な歪みを与えることになっていた
。この歪が加えられることによりコンデンサは、その誘
電率温度特性が変化し、安定な特性が得られないという
欠点があった。またこの歪により、極端な場合は電極に
半田付けされているリード線がとれたり、誘電体がワし
たりすることもあった。However, this exterior resin has a large coefficient of thermal expansion, which causes mechanical distortion to the capacitor itself. The addition of this strain changes the dielectric constant-temperature characteristics of the capacitor, resulting in a drawback that stable characteristics cannot be obtained. In extreme cases, this distortion could also cause the lead wires soldered to the electrodes to come off or the dielectric to warp.
そこで本発明は、上記のような欠点のない電子部品を得
んとした製造方法を提供するものである。Therefore, the present invention provides a method of manufacturing an electronic component free from the above-mentioned drawbacks.
本発明を要約すれば、電子部品と外装樹弓旨の間にワッ
クスを介在させ、このワックスを加熱して、一部を外装
樹脂中に吸収させて含浸材とし、残余は緩衝層としたと
ころに存する。To summarize the present invention, wax is interposed between the electronic component and the exterior resin, the wax is heated, and a portion is absorbed into the exterior resin to serve as an impregnating material, and the remainder is used as a buffer layer. exists in
以下本発明の具体例をセラミックコンデンサにもとづい
て詳述する。第１図は本発明によシ得られた電子部品の
一例を示した側断面図である。A specific example of the present invention will be described in detail below based on a ceramic capacitor. FIG. 1 is a side sectional view showing an example of an electronic component obtained according to the present invention.
先づ、誘電体１の両面に電極２．５を付与し、両電鳳に
リード線４．５を半田付けしたコンデンサを準備する。First, a capacitor is prepared in which electrodes 2.5 are provided on both sides of the dielectric 1 and lead wires 4.5 are soldered to both electrodes.
次にこのコンデンサの両面にワラ潟
クス６．６の層液を滴下等の方法で付与し、これを固化
させる。そして仁の状態でディップ塗料中への浸漬法等
で全体に外装樹脂７をコーティングする。その後この外
装塗料７を熱硬化させるが、この硬化のための熱を利用
し、前記ワックス６・６の一部を溶融させて外装塗料７
中に吸収させ、残余のワックス６．６は、コンデンサと
外装樹脂７間に残存させる。この結果、外装塗料Ｚ中に
吸収されたワックスが含浸材として機能し、残存したワ
ックスが緩衝材としてＩＬｍすることになる。Next, a layer solution of Waragaga Kusu 6.6 is applied to both sides of this capacitor by a method such as dropping, and is solidified. Then, the whole body is coated with the exterior resin 7 by dipping it in dip paint or the like. After that, the exterior paint 7 is thermally cured, and the heat for curing is used to melt a portion of the wax 6, thereby melting the exterior paint 7.
The remaining wax 6.6 is left between the capacitor and the exterior resin 7. As a result, the wax absorbed into the exterior paint Z functions as an impregnating material, and the remaining wax acts as a buffering material.
なお上述の方法においては、ワックスの加熱を外装塗料
の加熱硬化時の熱を利用して行なったが、ワックスの加
熱を別の工程で行なってもよい。また加熱時、ワックス
は全体が溶融するため、一部が含浸されたところで加熱
を停止させる必要がある。さらに図面ではワックス６が
誘電体１０両平面中央部に付与されているが、この付与
領域は、含浸効果および緩衝効果の点から任意に選ばれ
る。In the above-described method, the wax was heated using the heat generated during heating and curing of the exterior paint, but the wax may be heated in a separate step. Furthermore, since the entire wax melts during heating, it is necessary to stop heating when a portion of the wax is impregnated. Further, in the drawing, wax 6 is applied to the center of both planes of dielectric 10, but this application area is arbitrarily selected from the viewpoint of impregnating effect and buffering effect.
また本発明方法は、セラミックコンデンサに限られるこ
とはなく、形状等もまったく任意である。Further, the method of the present invention is not limited to ceramic capacitors, and the shape etc. can be completely arbitrary.
以上のとおり、本発明は、安価なワックスを用いて電子
部品と外装樹脂間の緩衝層を形成しているので、外装置
ａＪＩＩＷの熱膨張、収縮による歪が電子部品に加わる
ことがなく、常に安定な特性が得られるとともに、破壊
等もなくす４ことができる。As described above, in the present invention, since the buffer layer between the electronic component and the exterior resin is formed using an inexpensive wax, the distortion due to thermal expansion and contraction of the external device aJIIW is not applied to the electronic component, and the electronic component is always Stable characteristics can be obtained and breakage etc. can be eliminated4.
また本発明では、ワックスの一部を同時に外装樹脂の含
浸材としても使用しているので、通常外装樹脂の硬化後
に行なわれる含浸工程を省略できたり、簡単化したりす
ることができる。Furthermore, in the present invention, since a part of the wax is also used as an impregnating material for the exterior resin, the impregnation step, which is normally performed after curing the exterior resin, can be omitted or simplified.
なお実験によれば、Ｈｌ−に特性の！ラミックコンデン
サで、温度による容量変化率を測定したところ、本発明
により得られたものは従来のものに比べて、約１０〜１
５チ改善できることを確認した。According to experiments, Hl- has a characteristic! When we measured the rate of change in capacitance due to temperature with Ramic capacitors, we found that the rate of change in capacitance due to temperature was approximately 10 to 1
It was confirmed that 5 points could be improved.
第１図は本発明により得られた電子部品の一形状例を示
す側断面図である。
１・・・・・ｎ成体、２．３・・・・・・電極、４．５
・・・・・・リード線、６・・・・・・ワックス、７・
・・・・・外装樹脂。
特許出願人
株式会社村田製作所
一部
ンＺ
℃Ｚ
−女FIG. 1 is a side sectional view showing an example of the shape of an electronic component obtained by the present invention. 1...n adult, 2.3... electrode, 4.5
...Lead wire, 6...Wax, 7.
...Exterior resin. Patent applicant: Murata Manufacturing Co., Ltd. ℃Z −Female
Claims (1)
た状態で外装樹脂をコーティングし、後加熱することに
よって、前記ワックスの一部を外としたことを特徴とす
る電子部品の製造方法。1. A method of manufacturing an electronic component, characterized in that an outer surface of the electronic component is coated with an exterior resin while wax is applied to the outer surface of the electronic component, and a portion of the wax is removed by post-heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57122413A JPS5913318A (en) | 1982-07-13 | 1982-07-13 | Method of producing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57122413A JPS5913318A (en) | 1982-07-13 | 1982-07-13 | Method of producing electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5913318A true JPS5913318A (en) | 1984-01-24 |
| JPS6317324B2 JPS6317324B2 (en) | 1988-04-13 |
Family
ID=14835192
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57122413A Granted JPS5913318A (en) | 1982-07-13 | 1982-07-13 | Method of producing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5913318A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02304211A (en) * | 1989-05-17 | 1990-12-18 | Fujitsu Ltd | Roller shaft supporting structure |
| US9636378B2 (en) | 2012-03-30 | 2017-05-02 | Stealth Biotherapeutics Corp | Methods and compositions for the prevention and treatment neuropathy |
-
1982
- 1982-07-13 JP JP57122413A patent/JPS5913318A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6317324B2 (en) | 1988-04-13 |
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