JPS59119545U - Chip-shaped fuse - Google Patents
Chip-shaped fuseInfo
- Publication number
- JPS59119545U JPS59119545U JP1286083U JP1286083U JPS59119545U JP S59119545 U JPS59119545 U JP S59119545U JP 1286083 U JP1286083 U JP 1286083U JP 1286083 U JP1286083 U JP 1286083U JP S59119545 U JPS59119545 U JP S59119545U
- Authority
- JP
- Japan
- Prior art keywords
- fuse element
- pair
- fuse
- chip
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Fuses (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａ、 Ｂは従来の代表的小形ヒユーズの断面図、
第２図は本考案によるチップヒユーズの構造を示す組立
図、第３図は本考案による２連装のチップヒユーズの斜
視図である。
１、 １’、 ｌｂ、 １’ ｂ、 １７・・・
金属端子、２゜１２・・・ヒユーズエレメント、３．
１３． １５・・・内部空間、４． １４． １８・・
・ボディ（絶縁体基板）、５．１９・・・カバー（絶縁
体の上蓋）、６，６′・・・ボディとカバーの接着境界
面、７・・・封止用充填剤、１１．１１’・・・Ｔ状板
端子、１６・・・ヒユーズエレメントと平板状端子間の
樹脂に囲まれた部分。Figures 1A and 1B are cross-sectional views of typical conventional small fuses.
FIG. 2 is an assembled view showing the structure of the chip fuse according to the present invention, and FIG. 3 is a perspective view of the dual chip fuse according to the present invention. 1, 1', lb, 1' b, 17...
Metal terminal, 2゜12...fuse element, 3.
13. 15...Inner space, 4. 14. 18...
・Body (insulator substrate), 5.19... Cover (insulator top cover), 6, 6'... Adhesive interface between body and cover, 7... Sealing filler, 11.11 '...T-shaped plate terminal, 16...The part surrounded by resin between the fuse element and the flat terminal.
Claims (1)
端子板と、上記一対の金属端子間に展張シタヒユーズエ
レメントと、ヒユーズエレメントの中央一定長を上記端
子板より遮蔽しヒユーズエレメントのみ存在させる内部
中空室と端子板頭部を固定する溝を有し、ヒユーズエレ
メントの端子板頭部近くの一部分を樹脂中に食い込むよ
うに上下から加圧加熱して互に接着させた上下一対の耐
熱絶縁性樹脂よりなる基板とカバーとを具備することを
特徴とするチップ形ヒユーズ。A pair of flat metal terminal plates arranged with their heads facing the same direction on one plane, a shield fuse element extending between the pair of metal terminals, and a fuse element with a central fixed length of the fuse element shielded from the terminal plate. A pair of upper and lower fuse elements are bonded to each other by pressurizing and heating from above and below so that a part of the fuse element near the terminal board head is bitten into the resin. A chip-type fuse characterized by comprising a substrate and a cover made of a heat-resistant insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1286083U JPS59119545U (en) | 1983-02-02 | 1983-02-02 | Chip-shaped fuse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1286083U JPS59119545U (en) | 1983-02-02 | 1983-02-02 | Chip-shaped fuse |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59119545U true JPS59119545U (en) | 1984-08-11 |
Family
ID=30144255
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1286083U Pending JPS59119545U (en) | 1983-02-02 | 1983-02-02 | Chip-shaped fuse |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59119545U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08106845A (en) * | 1994-10-03 | 1996-04-23 | S O C Kk | Microchip fuse |
| JPH11120853A (en) * | 1997-10-16 | 1999-04-30 | Nippon Technica Kk | Thermal protector for power source |
| JP2007280919A (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Ind Co Ltd | Surface-mounted current fuse and its manufacturing method |
| WO2007119358A1 (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Industrial Co., Ltd. | Surface-mount current fuse |
| JP2011175892A (en) * | 2010-02-25 | 2011-09-08 | Kyocera Corp | Fuse device |
| CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
| JP2018503235A (en) * | 2015-01-22 | 2018-02-01 | リテルヒューズ・インク | Wire in air split fuse with built-in arc quencher |
-
1983
- 1983-02-02 JP JP1286083U patent/JPS59119545U/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08106845A (en) * | 1994-10-03 | 1996-04-23 | S O C Kk | Microchip fuse |
| JPH11120853A (en) * | 1997-10-16 | 1999-04-30 | Nippon Technica Kk | Thermal protector for power source |
| JP2007280919A (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Ind Co Ltd | Surface-mounted current fuse and its manufacturing method |
| WO2007119358A1 (en) * | 2006-03-16 | 2007-10-25 | Matsushita Electric Industrial Co., Ltd. | Surface-mount current fuse |
| JP2011175892A (en) * | 2010-02-25 | 2011-09-08 | Kyocera Corp | Fuse device |
| CN102194615A (en) * | 2010-03-02 | 2011-09-21 | 功得电子工业股份有限公司 | Embedded type circuit lamination protection element and manufacturing method thereof |
| JP2018503235A (en) * | 2015-01-22 | 2018-02-01 | リテルヒューズ・インク | Wire in air split fuse with built-in arc quencher |
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