JPH0234658A - Epoxy resin sealing composition - Google Patents
Epoxy resin sealing compositionInfo
- Publication number
- JPH0234658A JPH0234658A JP18527888A JP18527888A JPH0234658A JP H0234658 A JPH0234658 A JP H0234658A JP 18527888 A JP18527888 A JP 18527888A JP 18527888 A JP18527888 A JP 18527888A JP H0234658 A JPH0234658 A JP H0234658A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- talc
- resin composition
- burned
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 25
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 25
- 238000007789 sealing Methods 0.000 title claims abstract description 20
- 239000000203 mixture Substances 0.000 title claims description 22
- 239000000454 talc Substances 0.000 claims abstract description 24
- 229910052623 talc Inorganic materials 0.000 claims abstract description 24
- 239000002245 particle Substances 0.000 claims abstract description 6
- 239000011256 inorganic filler Substances 0.000 claims description 3
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 18
- 229920005989 resin Polymers 0.000 abstract description 13
- 239000011347 resin Substances 0.000 abstract description 13
- 239000005350 fused silica glass Substances 0.000 abstract description 11
- 239000011342 resin composition Substances 0.000 abstract description 9
- 238000005299 abrasion Methods 0.000 abstract description 4
- 238000002156 mixing Methods 0.000 abstract description 3
- 125000003545 alkoxy group Chemical group 0.000 abstract description 2
- 230000007423 decrease Effects 0.000 abstract description 2
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 abstract description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 abstract description 2
- 238000000465 moulding Methods 0.000 abstract description 2
- 125000005372 silanol group Chemical group 0.000 abstract description 2
- 239000000945 filler Substances 0.000 description 13
- 235000012239 silicon dioxide Nutrition 0.000 description 8
- 229910002026 crystalline silica Inorganic materials 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 239000004842 bisphenol F epoxy resin Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- -1 curing accelerators Substances 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、封止用エポキシ樹脂組成物に関するもので
ある。さらに詳しくは、こげ発明は、電気・電子部品、
半導体装置の樹脂封止に有用な、安価で金型摩耗の少な
い樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Industrial Field of Application) The present invention relates to an epoxy resin composition for sealing. More specifically, burnt inventions include electrical/electronic parts,
The present invention relates to a resin composition useful for resin encapsulation of semiconductor devices, which is inexpensive and causes less mold wear.
〈従来の技術）
従来より、電気・電子部品、半導体装置等の樹脂封止に
は、耐湿性、耐熱性等の性能や製造コストの面で良好な
エポキシ樹脂組成物が用いられてきている。(Prior Art) Epoxy resin compositions, which are good in terms of performance such as moisture resistance and heat resistance, and manufacturing cost, have been used for resin encapsulation of electric/electronic parts, semiconductor devices, etc.
これらのエポキシ樹脂組成物には、封止する部品、装置
等の用途に応じて様々な種類の硬化剤、硬化促進剤、充
填材フィラー、離型剤、難焼剤、着色剤などを配合して
いる。These epoxy resin compositions contain various types of curing agents, curing accelerators, fillers, mold release agents, fire retardants, colorants, etc., depending on the purpose of the parts to be encapsulated, devices, etc. ing.
これら配合成分のうち、フィラーは封止樹脂の耐熱性、
耐湿性、成形性等の特性に影響を与えるものとして重要
であり、特に近年になって高集積化が進んでいるＬＳＩ
の分野においては、半導体素子の封止樹脂に配合するフ
ィラーの特性への要求が厳しくなってきている。このよ
うな要請に対応するものとして、従来−船釣には、半導
体封止用に配合するフィラーには、溶融シリカや結晶シ
リカが用いられてきている。Among these compounded components, the filler improves the heat resistance of the sealing resin,
It is important as it affects characteristics such as moisture resistance and moldability, and especially LSI, which has become highly integrated in recent years.
In this field, requirements for the characteristics of fillers to be added to encapsulating resins for semiconductor devices are becoming stricter. In response to such demands, fused silica and crystalline silica have conventionally been used as fillers blended for semiconductor encapsulation in boat fishing.
（発明が解決しようとする手段）
しかしながら、これまで封止樹脂に配合されてきたこれ
らの溶融シリカおよび結晶シリカの場合には、早急に解
決すべき課題が残されてもいた。(Means to be Solved by the Invention) However, in the case of these fused silicas and crystalline silicas that have been blended into sealing resins, there still remain problems that need to be solved immediately.
すなわち、溶融シリカおよび結晶シリカは、熱放散性、
耐湿性等において比較的有効であるものの、溶融シリカ
の場合にはその価格が高く、樹脂封止にともなって金型
の摩耗が避けられず、結晶シリカでは金型摩耗とともに
封止樹脂の膨張係数が大きいという欠点があった。That is, fused silica and crystalline silica have heat dissipation properties,
Although it is relatively effective in terms of moisture resistance, etc., fused silica is expensive and mold abrasion is unavoidable due to resin sealing, while crystalline silica has mold wear and the expansion coefficient of the sealing resin decreases. The disadvantage was that it was large.
この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来のエポキシ樹脂封止用フィラーとしての溶融
シリカおよび結晶シリカの欠点を改善し、溶融シリカと
同程度の低膨張率を有し、安価で、しかも金型摩耗の少
ないフィラーを配合した新しい封止用エポキシ樹脂組成
物を提供することを目的としている。This invention was made in view of the above circumstances, and it improves the drawbacks of fused silica and crystalline silica as fillers for conventional epoxy resin sealing, and has a coefficient of expansion as low as that of fused silica. The object of the present invention is to provide a new epoxy resin composition for sealing that is inexpensive and contains a filler that causes less mold wear.
（課題を解決するための手段）
この発明は、上記の課題を解決するために、エポキシ樹
脂に、タルクを１ｏｏｏ’ｃ以上の高温で熱処理した焼
成タルクからなる無機フィラーを配合してなることを特
徴とする封止用エポキシ樹脂組成物を提供する。(Means for Solving the Problems) In order to solve the above problems, the present invention includes an epoxy resin mixed with an inorganic filler made of calcined talc that is heat-treated at a high temperature of 100'C or higher. Provided is an epoxy resin composition for sealing characterized by:
この発明の組成物に配合する上記の焼成タルクは、組成
式として５ＩＯ２・ＭｇＯ−Ｈ２Ｏで示されるタルクを
１０００℃以上の高温、たとえば１０００〜２０００℃
において熱処理したものであり、その大きさは、平均粒
径１〜５０μｍ、最大粒径１５０μｍ以下のものとする
ことが好ましい、もちろんこの大きさに限定されるもの
ではないが、この焼成タルクを配合した樹脂組成物を用
いた封止樹脂の膨張を低く抑え、かつ成形時の金型摩耗
を少なくするためには、この大きさの範囲とすることが
好ましい。The above-mentioned calcined talc to be blended into the composition of the present invention is prepared by heating talc having the composition formula 5IO2.MgO-H2O at a high temperature of 1000°C or higher, for example 1000 to 2000°C.
It is preferable that the average particle size is 1 to 50 μm and the maximum particle size is 150 μm or less. Although the size is not limited to this size, it is preferable that this calcined talc is blended with In order to suppress the expansion of the sealing resin using the resin composition and to reduce mold wear during molding, it is preferable to set the size within this range.
また、この焼成タルクについては、メトキシ基、エトキ
シ基等のアルコキシ基およびシラノール基を有するアル
コキシシラン類によって処理し、焼成タルク表面をこの
アルコキシシラン類によって被覆したものを用いること
がさらに有利である。Further, it is more advantageous to use the calcined talc that has been treated with an alkoxysilane having an alkoxy group such as a methoxy group or an ethoxy group and a silanol group, and the surface of the calcined talc is coated with the alkoxysilane.
樹脂組成物への配合割合は、特に限定はないが、組成物
に対して２０〜５０ｗｔ％程度を目安とすることができ
る。The blending ratio in the resin composition is not particularly limited, but can be approximately 20 to 50 wt% relative to the composition.
組成物のベース樹脂となるエポキシ樹脂としては、従来
公知のものをはじめとして適宜な種類のものを使用する
ことができる。たとえば、ノボラック型エポキシ樹脂、
ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型
エポキシ樹脂、脂環式エポキシ樹脂、ハロゲン化エポキ
シ樹脂等を例示することができる。As the epoxy resin serving as the base resin of the composition, any suitable type of epoxy resin including conventionally known ones can be used. For example, novolac type epoxy resin,
Examples include bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, and halogenated epoxy resin.
また、組成物には硬化剤や硬化促進剤を適宜に配合する
ことができ、たとえば硬化剤としては、フェノールノボ
ラック樹脂、酸無水物、脂肪族または芳香族アミン類を
、硬化促進剤としてはイミダゾール化合物、アミン類や
リン化合物等を例示することができる。さらにまた、そ
の他の添加剤として離型剤、難焼化剤、着色剤、カップ
リング剤などを使用することができる。In addition, a curing agent or a curing accelerator can be appropriately blended into the composition. For example, a phenol novolac resin, an acid anhydride, an aliphatic or aromatic amine can be used as a curing agent, and imidazole can be used as a curing accelerator. Examples include compounds such as amines and phosphorus compounds. Furthermore, other additives such as a mold release agent, a flame retardant, a coloring agent, a coupling agent, etc. can be used.
（作 用）
この発明の封止用のエポキシ樹脂組成物は、エポキシ樹
脂に１０００℃以上の高温度において熱処理した焼成タ
ルクからなる無機フィラーを配合しているので、従来の
溶融シリカよりも安価なフィラーを用い、膨張係数を低
く抑え、金型摩耗を少なくすることができる。このため
封止樹脂を耐湿性、低応力性に潰れたものとすることが
できる。(Function) The epoxy resin composition for sealing of the present invention contains an epoxy resin and an inorganic filler made of calcined talc that has been heat-treated at a high temperature of 1000°C or higher, so it is cheaper than conventional fused silica. Fillers can be used to keep the expansion coefficient low and reduce mold wear. For this reason, the sealing resin can be crushed to have moisture resistance and low stress properties.
（実施例）
以下、実施例を示し、さらにこの発明の組成物について
説明する。(Example) Hereinafter, Examples will be shown and the composition of the present invention will be further explained.
実施例１
クレゾールノボラック型エポキシ樹脂に、硬化剤として
フェノフルノボラック系硬化剤を配合し、これに加えて
、タルクを１２００℃の温度において熱処理した後にエ
ポキシシランによって表面被覆処理した焼成タルクを、
組成物全量の３５ｗｔ％となるように配合した。Example 1 A fenoflu novolac type curing agent was blended into a cresol novolac type epoxy resin, and in addition to this, calcined talc was heat treated at a temperature of 1200°C and then surface coated with epoxy silane.
It was blended so that it was 35 wt% of the total amount of the composition.
得られたエポキシ樹脂組成物を用いて半導体素子の樹脂
封止を行った。この際の封止樹脂について、スパイラル
フロー、線膨張係数、曲げ強度、耐湿性および金型摩耗
について評価した。A semiconductor element was encapsulated with resin using the obtained epoxy resin composition. The sealing resin at this time was evaluated in terms of spiral flow, coefficient of linear expansion, bending strength, moisture resistance, and mold wear.
また、これらの緒特性に、フィラーコストを加昧して、
封止用樹脂組成物に焼成タルクフィラーを用いることの
有効性を総合的に判定した。In addition, by adding filler cost to these characteristics,
The effectiveness of using a calcined talc filler in a sealing resin composition was comprehensively evaluated.
これらの評価および判定の結果を示したものが表１であ
る。Table 1 shows the results of these evaluations and judgments.
後述の比較例との対比からも明らかなように、この実施
例の組成物は、スパイラルフロー、曲げ強度および線膨
張係数が従来の溶融シリカと同程度と良好であり、しか
も、溶融シリカよりも金型豪耗は少なく、耐湿性に優れ
、フィラーとして低コストでもある。結晶シリカの場合
に比べると、線膨張係数ははるかに低レベルにあり、金
型摩耗も少なく、耐湿性に優れている。As is clear from the comparison with the comparative example described later, the composition of this example has spiral flow, bending strength, and coefficient of linear expansion that are comparable to those of conventional fused silica, and are also better than fused silica. It causes less mold wear, has excellent moisture resistance, and is low cost as a filler. Compared to crystalline silica, it has a much lower linear expansion coefficient, less mold wear, and excellent moisture resistance.
実施例２
エポキシシランによる表面被覆処理を行わない焼成タル
クを用い、実施例１と同様にしてエポキシ樹脂組成物を
作製した。この組成物についても、同様にして特性評価
および総合判定を行った。その結果を表１に示した。Example 2 An epoxy resin composition was prepared in the same manner as in Example 1 using calcined talc that was not subjected to surface coating treatment with epoxy silane. This composition was also subjected to characteristic evaluation and comprehensive evaluation in the same manner. The results are shown in Table 1.
この結果から明らかなように、膨張は低く抑えられてお
り、耐湿性は良好で、金型摩耗も少ない。As is clear from these results, expansion is kept low, moisture resistance is good, and mold wear is low.
実施例１と同様にフィラーとしてこの例のものは極めて
優れている。Similar to Example 1, this example is extremely excellent as a filler.
比較例１〜２
焼成タルクに代えて溶融シリカおよび結晶シリカを各々
用いて実施例１と同様に樹脂組成物を作製した。この場
合も特性評価と総合判定を行い、その結果を表１に示し
た。Comparative Examples 1-2 Resin compositions were produced in the same manner as in Example 1, using fused silica and crystalline silica in place of calcined talc. In this case as well, characteristic evaluation and comprehensive judgment were performed, and the results are shown in Table 1.
特性はいずれの場合も実施例に比べて劣っており、特に
結晶シリカの場合には金型瑠耗性は極めて悪く、線膨張
係数も大きい、また、耐湿性もがなり劣っている。In all cases, the properties are inferior to those of the examples, and in particular, in the case of crystalline silica, the mold abrasion resistance is extremely poor, the coefficient of linear expansion is large, and the moisture resistance is also very poor.
比較例３
無焼成のタルクを用い、実施例１と同様に樹脂組成物を
作製し、特性評価および総合判定を行った。Comparative Example 3 A resin composition was prepared in the same manner as in Example 1 using unfired talc, and the characteristics were evaluated and comprehensively evaluated.
表１に示した通り、フィラーコスト、金型摩耗性には優
れているものの、曲げ強度、耐湿性は著しく劣っていた
。As shown in Table 1, although the filler cost and mold abrasion resistance were excellent, the bending strength and moisture resistance were significantly inferior.
（発明の効果）
この発明により、従来の溶融シリカと同程度の低い膨張
保ち、安価なフィラーでしかも金型摩耗の少ない封止用
エポキシ樹脂組成物が実現される。(Effects of the Invention) According to the present invention, an epoxy resin composition for sealing can be realized which has low expansion retention comparable to that of conventional fused silica, is an inexpensive filler, and has less mold wear.
Claims (3)
で熱処理した焼成タルクからなる無機フィラーを配合し
てなることを特徴とする封止用エポキシ樹脂組成物。(1) An epoxy resin composition for sealing, characterized in that an epoxy resin is blended with an inorganic filler made of calcined talc obtained by heat-treating talc at a high temperature of 1000° C. or higher.
の焼成タルクを配合した請求項（１）記載の封止用エポ
キシ樹脂組成物。(2) The epoxy resin composition for sealing according to claim (1), which contains calcined talc having an average particle size of 1 to 50 μm and a maximum particle size of 150 μm or less.
タルクを配合した請求項（１）記載の封止用エポキシ樹
脂組成物。(3) The epoxy resin composition for sealing according to claim (1), which contains calcined talc whose surface has been coated with an alkoxysilane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18527888A JPH0234658A (en) | 1988-07-25 | 1988-07-25 | Epoxy resin sealing composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18527888A JPH0234658A (en) | 1988-07-25 | 1988-07-25 | Epoxy resin sealing composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0234658A true JPH0234658A (en) | 1990-02-05 |
Family
ID=16168035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18527888A Pending JPH0234658A (en) | 1988-07-25 | 1988-07-25 | Epoxy resin sealing composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0234658A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001085848A1 (en) * | 2000-05-09 | 2001-11-15 | Daikin Industries, Ltd. | Polymer composition containing clean filler incorporated therein |
| JP2002275352A (en) * | 2001-03-21 | 2002-09-25 | Sumitomo Bakelite Co Ltd | One-pack liquid epoxy resin composition |
| JP2006328105A (en) * | 2005-05-23 | 2006-12-07 | Hitachi Chem Co Ltd | Resin composition, prepreg for printed wiring board, and metal-clad laminate |
| JP2008089113A (en) * | 2006-10-03 | 2008-04-17 | Bridgestone Corp | Vibration controlling damper |
| WO2008057931A1 (en) * | 2006-11-02 | 2008-05-15 | Henkel Ag & Co. Kgaa | Composition with thermally-treated silica filler for performance enhancement |
-
1988
- 1988-07-25 JP JP18527888A patent/JPH0234658A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001085848A1 (en) * | 2000-05-09 | 2001-11-15 | Daikin Industries, Ltd. | Polymer composition containing clean filler incorporated therein |
| US6946513B2 (en) | 2000-05-09 | 2005-09-20 | Daikin Industries, Ltd. | Polymer composition containing clean filler incorporated therein |
| JP2002275352A (en) * | 2001-03-21 | 2002-09-25 | Sumitomo Bakelite Co Ltd | One-pack liquid epoxy resin composition |
| JP2006328105A (en) * | 2005-05-23 | 2006-12-07 | Hitachi Chem Co Ltd | Resin composition, prepreg for printed wiring board, and metal-clad laminate |
| JP2008089113A (en) * | 2006-10-03 | 2008-04-17 | Bridgestone Corp | Vibration controlling damper |
| WO2008057931A1 (en) * | 2006-11-02 | 2008-05-15 | Henkel Ag & Co. Kgaa | Composition with thermally-treated silica filler for performance enhancement |
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