JPH0124934Y2 - - Google Patents
Info
- Publication number
- JPH0124934Y2 JPH0124934Y2 JP18984083U JP18984083U JPH0124934Y2 JP H0124934 Y2 JPH0124934 Y2 JP H0124934Y2 JP 18984083 U JP18984083 U JP 18984083U JP 18984083 U JP18984083 U JP 18984083U JP H0124934 Y2 JPH0124934 Y2 JP H0124934Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- semiconductor integrated
- plating jig
- plating
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 25
- 239000004065 semiconductor Substances 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000000758 substrate Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18984083U JPS6096840U (ja) | 1983-12-07 | 1983-12-07 | 半導体集積回路基板の鍍金治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18984083U JPS6096840U (ja) | 1983-12-07 | 1983-12-07 | 半導体集積回路基板の鍍金治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6096840U JPS6096840U (ja) | 1985-07-02 |
| JPH0124934Y2 true JPH0124934Y2 (enrdf_load_stackoverflow) | 1989-07-27 |
Family
ID=30409198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18984083U Granted JPS6096840U (ja) | 1983-12-07 | 1983-12-07 | 半導体集積回路基板の鍍金治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096840U (enrdf_load_stackoverflow) |
-
1983
- 1983-12-07 JP JP18984083U patent/JPS6096840U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6096840U (ja) | 1985-07-02 |
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