JPH0124934Y2 - - Google Patents

Description

[Detailed Description of the Invention] The present invention relates to a plating jig used when plating a semiconductor integrated circuit board.

Conventionally, when plating a semiconductor integrated circuit board 1 as shown in a perspective view in FIG.
As shown in the front view and side view, respectively, conductive flat bars 3, 3 are arranged in parallel in the longitudinal direction on both sides of the conductive support rod 2, and the tips are bent into an S-shape with a diameter of 0.3 to 1.5 mm. The base ends of the metal fittings 4, 4...4 are connected to the outward main surfaces 3a, 3 of the flat bars 3, 3,
3a, soldered or welded at equal intervals in the longitudinal direction, was used as a plating jig. The S-shape at the tip of the metal fittings 4, 4...4 of the plating jig means that the flat bar 3 is shaped so that the inner curved portions 4a, 4a...4a and the outer curved portion 4b connected thereto at the base end are formed. , 3 is bent at right angles to the outward main surfaces 3a, 3a. The semiconductor integrated circuit boards 1, 1, . . . 1 are placed between the metal fittings 4, 4, .
1...1 side metallized portions 1a, 1a...1a and the inwardly curved portions 4a, 4a... of the metal fittings 4, 4...4...
4a are elastically fitted so as to make conductive contact with the apex of 4a, and a positive voltage is applied to the anode body (also not shown) from a DC power source (not shown) sequentially through the flat bars 3, 3 and metal fittings 4, 4...4 to the cathode and By applying a negative voltage to the side metallized portions 1a, 1a...1a, the semiconductor integrated circuit substrates 1, 1
...1 is plated on the side metallized parts 1a, 1a...1a and on the main surface metallized parts 1b, 1b...1b.

However, with the above plating jig, firstly, it is difficult to match the respective curvatures of the inwardly curved portions 4a, 4a...4a of the metal fittings 4, 4...4. The contact area with the side metallized portions 1a, 1a, . Second, since the flat bars 3, 3 and the metal fittings 4, 4...4 are fixed by soldering or welding, the metal fittings 4, 4...4 are not arranged at exactly equal intervals, which makes it difficult to integrate semiconductors. The process of fitting the circuit boards 1, 1...1 into the metal fittings 4, 4...4 had to be performed manually, which hindered cost reduction. Third, in the case of soldering, the solder sometimes eluted into the plating solution and contaminated the semiconductor integrated circuit boards 1, 1, . . . 1.

The present invention has been made to overcome the above-mentioned drawbacks, and will be described below with reference to embodiments shown in the drawings.

FIGS. 4 and 5 show an embodiment of a plating jig according to the present invention, and are a front view and a side view, respectively, of a semiconductor integrated circuit board being held between the plating jig.

Reference numeral 5 denotes a plating jig, which includes a body 5a and a plurality of pointed legs 5b, 5b whose proximal ends are connected to the long side of the body 5a and are arranged opposite to each other at equal intervals on both sides through the body.
...consists of 5b. The plating jig 5 has a thickness of 0.3~
After punching a 1.5 mm hoop material mainly composed of stainless steel or iron into a double comb shape with a plurality of pointed legs on both long sides as shown in Fig. 6, each pointed leg is It is manufactured by bending the proximal end portion of the pointed leg, preferably inside the long side of the body 5a, so that the pointed end faces inward and the front side has a concave shape. 6 indicates a support rod, and the plating jig 5
is mechanically supported by bolts 7, and electrically conductive to the plating jig 5 from a DC power source (not shown).

In order to plate the semiconductor integrated circuit boards 1, 1...1 using the plating jig of the present invention, the side metallized portions 1a, 1a of the semiconductor integrated circuit boards 1, 1...1
...1a and plating jig 5 pointed legs 5b, 5b...5b
The semiconductor integrated circuit boards 1, 1, . . . 1 are elastically fitted between the pointed legs 5b, 5b, .

Since the manufacturing process of the plating jig of the present invention is entirely machined as described above, the machining dimension accuracy is high, and the pointed legs 5b, 5b, . . . 5b can be arranged side by side at equal intervals with accuracy. In addition, the pointed legs 5b, 5b
. . . 5b has a sharp tip, so that the side metallized portions 1 a, 1 a . . . of the semiconductor integrated circuit substrates 1, 1 .
...The contact area with 1a does not vary greatly depending on the substrate. Furthermore, since the plating jig of the present invention is manufactured by machining, there is no risk of contaminating the plating solution with solder or the like.

As described above, the present invention is a plating jig suitable for plating a semiconductor integrated circuit board.

[Brief explanation of the drawing]

Fig. 1 is a perspective view of a semiconductor integrated circuit board, Fig. 2 is a front view showing the semiconductor integrated circuit board of Fig. 1 held between conventional plating jigs, Fig. 3 is a side view, and Fig. 4 1 is a front view showing the semiconductor integrated circuit board shown in FIG. 1 being held between plating jigs according to an embodiment of the present invention, FIG. 5 is a side view of the same, and FIG. 6 is a diagram showing an embodiment of the present invention. It is a perspective view showing the manufacturing process of the above-mentioned plating jig. 1...Semiconductor integrated circuit board, 5...Plating jig,
5b... Apical foot.

Claims (1)

[Scope of utility model registration request] In a device for holding a semiconductor integrated circuit board, a plurality of pointed legs are arranged side by side on both long sides, and both comb-shaped metal plates are connected at the base end. A plating jig for semiconductor integrated circuit boards bent into a concave shape.