JPS635476B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a holding device for holding an object to be plated, which is used when performing electroplating.

When performing electroplating, a holding device is used to hold a plurality of objects to be plated in order to immerse the objects to be plated into a plating tank and take them out from the plating tank. It is necessary to adapt the shape of the plated object from the viewpoint of workability of supporting the plated object and uniformity of plating thickness.

For example, as a holding device for holding a printed circuit board during electroplating of the printed circuit board, a device having the following structure has conventionally been used.

That is, as shown in FIG. 1, the conventional electroplating holding device is raised and lowered by a conveying device (not shown).
A rod-shaped conductive member (so-called rack) 3 equipped with a support member 2 is placed at an arbitrary position on a horizontal column-shaped conductive member (so-called movable cathode bar) 1 to be horizontally moved, by means of an engaging portion 3a at its upper end. A plurality of printed boards 4, 4, . . . are hung along the longitudinal direction of the conductive member 3 by the supporting member 2.
It is designed to hold. That is, a plurality of sets of wire-like members 2a and U-shaped members 2b are attached to the conductive member 3 alternately in the longitudinal direction, and the upper side portion 4a abuts the contact portion 5a of the wire-like member 2a, forming a U-shape. With the lower side 4b in contact with the two contact portions 5b, 5b of the member 2b, the printed circuit board 4 is clamped and supported between the two by the elasticity of the wire-like member 2a, and in this way, horizontal conduction is achieved. A plurality of conductive members 3, 3, ... are hung on the conductive member 1,
A printed circuit board 4, 4, . . . is supported on each conductive member 3, 3, . Then, the printed circuit boards 4, 4, ... are immersed in a plating solution, and a cathode voltage is applied to the printed circuit boards 4, 4, ... through the conductive members 1, 3 and the support member 2 to plate them. administer. In FIG. 2, 7 is a plating liquid, and 8 is a gripping portion for conveying the conductive member 1.

However, with this holding device, the dimensions of the printed circuit board 4 that can be clamped and supported are limited by (a) the distance between the wire-like member 2a and the U-shaped member 2b; Depending on the dimensions of the printed circuit board 4, it is necessary to provide a large number of types of conductive members 3 with different distances between the wire-like member 2a and the U-shaped member 2b. Dozens of types of holding devices were prepared.
Therefore, the manufacturing cost of the conductive member (rack) 3 is enormous, its storage is complicated, and furthermore, it is troublesome to select a conductive member 3 that matches the dimensions when attaching the printed circuit board 4.

(b) Since the conductive member (rack) 3 is simply suspended from the conductive member (movable cathode bar) 1 at the engaging portion 3a, it cannot be put into or taken out of the plating bath 6 by a conveyance device, or moved horizontally. When the conductive members 3 are held in place, there is a risk that the conductive members 3 may swing or be misaligned, causing the printed circuit boards 4 to fall off. Unable to process.

(c) In order to hold the printed circuit board 4 along the longitudinal direction of the conductive member 3, a U-shaped member 2b and a wire-shaped member are provided between the two vertically adjacent printed circuit boards 4 held. 2a, and therefore the interval between adjacent printed circuit boards cannot be made very small. Therefore, the number of printed circuit boards 4 that can be attached is reduced, making it impossible to efficiently process large quantities of printed circuit boards, and because the spacing becomes large, current concentrates at the ends of each printed circuit board 4, resulting in non-uniform plating thickness.

There were drawbacks such as:

The present invention provides a holding device for electroplating that overcomes these drawbacks, and embodiments of the present invention will be described below with reference to the drawings.

3 to 5 show an embodiment of an electroplating holding device used for holding a printed circuit board according to the present invention.

In the figure, reference numeral 11 denotes a first conductive member (moving cathode bar), which has a horizontal columnar shape with a rectangular cross section, and is held in a horizontal state by gripping parts 12, 12 protruding from the upper surface of both ends. Conveying device (not shown)
A bifurcated conductive rod 13, 1 is conveyed vertically and horizontally, and protrudes from both ends in the longitudinal direction.
3, it is removably placed on the top of the plating tank or unloading section.

A second conductive member (rack) 14 is removably and slidably suspended from the first conductive member 11 in an electrically connected manner.

The second conductive member 14 includes an engaging portion 15 bent in a U-shape to fit the first conductive member 11, and a rod-shaped portion 16 joined to the engaging portion 15. Consists of. The engaging portion 15 can be fixed at any position on the first conductive member 11 using a fastener 15a. In addition, the rod-shaped portion 16 has two types of support contact members 17 that support the printed circuit board 4 that protrudes in a direction perpendicular to the longitudinal direction of the first conductive member 11 and supplies current, and an elastic support member 17 that supports the printed circuit board 4 and supplies current. The members 18 are attached alternately at predetermined intervals. As shown in FIG. 5, the contacts 17a and 18a at the tips of the support contact members 17 and
are located on opposite sides of each other, and the support member 18 is located at the contact point 18
It is provided with elasticity to press the printed circuit board 4 in the direction of the a side.

Note that the second conductive member 14 is a support member 17,1
8 except for the contacts 17a and 18a are covered with an insulator to prevent electroplating.

In such a configuration, in order to attach the printed circuit board 4, first a plurality of second conductive members 1 are attached.
4, 14, . The positions of the second conductive members 14, 14 are fixed. Then, one side of the left and right side of the printed circuit board 14 is connected to the supporting member 18 of the second conductive member 14.
The second conductive member 1 that contacts the contact point 18a and presses against the elasticity of the support member 18 on the other side
The printed circuit board 4 is clamped and supported on both left and right sides between two adjacent second conductive members 14, 14 that are in contact with the contacts 17a of the support members 17 of the second conductive member 4. In this way, a large number of printed circuit boards 4, 4, .
After attaching with a pressing force of 8a, the first conductive member 11 is conveyed by a conveying device, and the printed circuit boards 4, 4, . . .
...soak. A negative voltage is applied to the printed circuit boards 4, 4, . . . via the rod 13, the first conductive member 11, the second conductive member 14, and the support members 17, 18 to perform electroplating. .

As a means for positioning and fixing the second conductive member 14, positioning grooves 20 are provided at a predetermined pitch in the first conductive member 11, as shown in FIG. 7, instead of the aforementioned fastener 15a. The second conductive member 14 may be positioned and fixed by fitting into the groove 20 of the second conductive member 14 . Also, this groove 20
The positioning and fixing may be performed by both the positioning method and the fastening tool 15a, or a fitting protrusion may be formed to further increase the strength.

In the embodiment described above, the second conductive member 14 was positioned and fixed at its upper end, but in another embodiment, as shown in FIG. Then, the lower end of the second conductive member 14 is engaged with any engagement hole 21, thereby positioning and fixing the second conductive member 14. By providing the positioning member 22 in this way, it is possible to improve the workability when mounting the member to be fitted, and the support member 17 of the second conductive member 14,
There is no danger of bending 18 more than necessary. The upper part of this engagement hole 21 is formed into a conical shape, and a conical taper pin 1 is attached to the lower end of the second conductive member 14 to fit into the dovetail-shaped upper part of this engagement hole 21.
If a taper pin 19 is provided and the taper pin 19 is engaged with the engagement hole 21, the engagement becomes more reliable.

The positioning member 22 may be constructed separately as a single unit as shown in FIG. 8, or the engagement hole 21 may be provided in the bottom portion 23a of the frame itself.

Alternatively, as shown in FIG. 9, a positioning plate 22 may be fixed to the lower end of one second conductive member 14. Furthermore, as shown in FIG. 10, the first conductive member 11 is also provided with positioning recesses 24, 24, . . .
The second conductive member 14 is provided at the same pitch as the second conductive member 14.
It is also possible to provide a convex portion 15b on the engaging portion 15 for positioning. In this way, the second
The conductive member 14 is positioned at both the upper end and the lower end thereof.

In the above embodiment, only the case of holding a printed circuit board was described, but it goes without saying that the plated member for holding can be used to hold other things besides the printed circuit board.

The holding device for electroplating of the present invention (a) can hold members to be plated with various dimensions by changing the distance between the adjacent second conductive members 14, 14, so that it is possible to hold members having different dimensions. In this way, it is no longer necessary to prepare a wide variety of second conductive members corresponding to the dimensions of the member to be fitted, and at least one type is required, and the second conductive member 14
The manufacturing cost can be reduced, and the storage becomes easy.

(b) Since the plated members are held on both sides of the second conductive member 14, and there is no support member etc. interposed between the two vertically adjacent plated members, it can be used both in the horizontal and vertical directions. Since multiple parts to be plated can be closely arranged and held with narrow intervals, a large number of parts to be plated can be plated, improving work efficiency and eliminating defects in plating thickness that occur when the spacing becomes large. Can prevent uniformity.

(c) The second conductive member 14 is the first conductive member 1
Since the plating tank 6 is positioned and fixed at the upper end of the plating tank 1, it is possible to prevent swinging when the members to be plated are taken in and out of the plating tank 6 or transported in the horizontal direction, so that a large number of members to be plated can be held. . Furthermore, this can be made even more reliable by using a positioning member.

(D) As shown in Fig. 3a and b, in order to hold the covered object 4 between the upper and lower parts of the two opposing sides, 1
Two overlays 4 on both sides of the rod-shaped portion 16 of the book,
4 can be attached, so a large amount of covered objects can be processed at once.

[Brief explanation of the drawing]

Figures 1 and 2 are diagrams explaining a conventional electroplating holding device, Figure 3 is a diagram showing a state in which the second conductive member is fixed to the first conductive member, and Figure 5 is a diagram showing the state in which the second conductive member is fixed to the first conductive member. 6 is a front view showing the printed circuit board attached to the second conductive member, FIG. 7 is a perspective view showing the first conductive member provided with a positioning groove, and FIG. 8 is a front view showing the printed circuit board attached to the second conductive member. A diagram showing the case where the lower end of the second conductive member is engaged by the positioning member, FIG. 9 is a diagram showing the case where the positioning member is fixed to one second conductive member, and FIG. 10 FIG. 10a is a perspective view showing the main part when a recess for positioning is provided in the first conductive member, and FIG. 10b is a sectional view of the main part showing a state in which the engaging part is engaged with this recess. . DESCRIPTION OF SYMBOLS 11...First conductive member, 14...Second conductive member, 15...Engaging part, 15a...Tightening part,
16... Rod-shaped portion, 17... Support member, 17a...
Contact, 18... Elastic support member, 18a... Contact,
20...Positioning groove, 21...Engagement hole, 22...
Positioning member.

Claims (1)

[Scope of Claims] 1. A first conductive member 11 that is removably placed horizontally across the upper part of the plating bath, and a first conductive member that is electrically connected to the first conductive member 11 and that is removable. an engaging portion 15 that can be engaged;
An engaging portion 15 is provided vertically downward from the engaging portion 15.
a rod-shaped portion 16 electrically connected to the rod-shaped portion 1;
electrically connected support members 17 protruding horizontally and having clamping contacts 17a on one side and horizontally protruding and having clamping contacts 18a on the opposite side, provided alternately in the vertical direction on 6; a plurality of second conductive members 14 including an elastic support member 18 having an elastic return force toward the side; and the engaging portions 15 of each of the second conductive members 14.
positioning means for positioning the attachment position of the plurality of second conductive members to the first conductive member 11; The supporting member 1 of one of the two adjacent second conductive members 14 is fixed to the first conductive member 11.
The upper and lower parts of two opposing sides of a rectangular object to be mated are pressed and clamped between the clamping contacts 17a of No. 7 and the clamping contacts 18a of one of the elastic support members 18. Holding device for electroplating. 2. A first conductive member 11 that is removably placed across the upper part of the plating bath horizontally; and a first conductive member 11 that is electrically connected to and removably engaged with the first conductive member 11. An engaging portion 15;
An engaging portion 15 is provided vertically downward from the engaging portion 15.
a rod-shaped portion 16 electrically connected to the rod-shaped portion 1;
electrically connected support members 17 protruding horizontally and having clamping contacts 17a on one side and horizontally protruding and having clamping contacts 18a on the opposite side, provided alternately in the vertical direction on 6; a plurality of second conductive members 14 each having an elastic support member 18 having an elastic return force toward the side; and a positioning member 22 for positioning the lower end of each of the rod-like portions 16; The lower end of the rod-shaped part 16 of the first conductive member 11 is fixed by the positioning member 22 by adjusting the interval between the conductive members 14, and one of the two adjacent second conductive members 14 is fixed. between the clamping contact 17a of the support member 17 and the clamping contact 18a of one of the elastic support members 18 so as to press and clamp the upper and lower parts of two opposing sides of the rectangular object. A holding device for electroplating characterized by: