JPH0123942B2 - - Google Patents

Info

Publication number
JPH0123942B2
JPH0123942B2 JP57025646A JP2564682A JPH0123942B2 JP H0123942 B2 JPH0123942 B2 JP H0123942B2 JP 57025646 A JP57025646 A JP 57025646A JP 2564682 A JP2564682 A JP 2564682A JP H0123942 B2 JPH0123942 B2 JP H0123942B2
Authority
JP
Japan
Prior art keywords
film carrier
axis
bonding
axis direction
movement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57025646A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58142534A (ja
Inventor
Hiroshi Aoyama
Minoru Okamura
Kazunori Hara
Yasuro Furutoku
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Kaijo Denki Co Ltd
Original Assignee
Kaijo Denki Co Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Denki Co Ltd, Nippon Electric Co Ltd filed Critical Kaijo Denki Co Ltd
Priority to JP57025646A priority Critical patent/JPS58142534A/ja
Publication of JPS58142534A publication Critical patent/JPS58142534A/ja
Publication of JPH0123942B2 publication Critical patent/JPH0123942B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP57025646A 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置 Granted JPS58142534A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57025646A JPS58142534A (ja) 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57025646A JPS58142534A (ja) 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58142534A JPS58142534A (ja) 1983-08-24
JPH0123942B2 true JPH0123942B2 (cg-RX-API-DMAC7.html) 1989-05-09

Family

ID=12171587

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57025646A Granted JPS58142534A (ja) 1982-02-19 1982-02-19 フイルムキヤリアボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58142534A (cg-RX-API-DMAC7.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0510364Y2 (cg-RX-API-DMAC7.html) * 1987-05-11 1993-03-15
US5113565A (en) * 1990-07-06 1992-05-19 International Business Machines Corp. Apparatus and method for inspection and alignment of semiconductor chips and conductive lead frames

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS521067U (cg-RX-API-DMAC7.html) * 1976-06-18 1977-01-06
JPS56162846A (en) * 1980-05-20 1981-12-15 Citizen Watch Co Ltd Ic gang bonding device

Also Published As

Publication number Publication date
JPS58142534A (ja) 1983-08-24

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