JPH01236686A - Hybrid circuit board - Google Patents
Hybrid circuit boardInfo
- Publication number
- JPH01236686A JPH01236686A JP6399088A JP6399088A JPH01236686A JP H01236686 A JPH01236686 A JP H01236686A JP 6399088 A JP6399088 A JP 6399088A JP 6399088 A JP6399088 A JP 6399088A JP H01236686 A JPH01236686 A JP H01236686A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- conductor
- primary
- board
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 238000000034 method Methods 0.000 abstract description 7
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000004593 Epoxy Substances 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 239000004744 fabric Substances 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 239000007767 bonding agent Substances 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 2
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 229920006015 heat resistant resin Polymers 0.000 description 7
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は電子機器に用いるプリント回路板の構造で、と
りわけ、複数の回路板を結合したハイブリッド回路板に
関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to the structure of a printed circuit board used in electronic equipment, and more particularly to a hybrid circuit board in which a plurality of circuit boards are combined.
従来の技術
従来、複数のプリント回路板を樹脂などで貼り合わせて
複合回路板を形成したものは知られている。この構造は
、予め、第１の回路板と第２の回路板とに、それぞれ、
実装部品を装着したのちに、互いの回路板をはんだ付け
あるいは樹脂接着材で貼り合わせて一体化したものであ
る。2. Description of the Related Art Conventionally, it has been known to form a composite circuit board by bonding a plurality of printed circuit boards together using resin or the like. In this structure, in advance, each of the first circuit board and the second circuit board is
After mounting the components, the circuit boards are integrated by soldering or pasting them together with a resin adhesive.
発明が解決しようとする課題
しかしながら、従来の構成では、これらの回路板に他の
実装部品をはんだ付けする場合に、先に樹脂接着あるい
は、はんだ付けのされた部分が熱的影響を受けて、その
接合部が緩んだり、その強度の劣化を起すことがあった
。Problems to be Solved by the Invention However, in the conventional configuration, when other mounted components are soldered to these circuit boards, the parts that are bonded with resin or soldered first are affected by heat. The joints may become loose or their strength may deteriorate.
課題を解決するための手段
本発明は、上述の問題点を解消するものであり、要約す
るに、両面に導体層を配設した第１の回路板の端面に、
はんだ付け可能な導体を設けて、前記両面の導体層を互
いに接続するとともに、その一方の面の導体層を第２の
回路板の導体層に導電性接着材で接続した構造である。Means for Solving the Problems The present invention solves the above-mentioned problems.In summary, on the end face of a first circuit board having conductor layers on both sides,
In this structure, a solderable conductor is provided to connect the conductor layers on both sides to each other, and the conductor layer on one side is connected to the conductor layer of the second circuit board using a conductive adhesive.
作用
本発明によると、第１の回路板と第２の回路板とが、互
いの導体層を導電性接着材で接着されているので、次に
、両回踏板面の導電層に対して電子部品の電極部をリフ
ロウはんだ付け処理したとき、そのリフロウ処理時の加
熱によって、第１゜第２の回路板間の接着性を劣化する
ことがない。According to the present invention, since the first circuit board and the second circuit board have their conductive layers bonded to each other with a conductive adhesive, electronic When the electrode portion of the component is subjected to reflow soldering, the adhesiveness between the first and second circuit boards is not deteriorated by heating during the reflow process.
実施例 つぎに、本発明を実施例によって詳しくのべる。Example Next, the present invention will be described in detail by way of examples.
図面は本発明の実施例回路板を示すもので、第１図は断
面図、第２図は平面図、第３図は主要部の破断斜視図で
ある。この回路板は、親プリント配線板１として、厚さ
１．０聴のガラス布基材エポキシ板を用い、これに対し
て、子プリント配線板２として、厚さ０．４＋ｎｌ１１
の同基材板を用いて複合回路板にする。親、子の各プリ
ント配線板１゜２の各面には、それぞれ、導体層３，４
が各々銅箔導体で形成されている。そして、子プリント
配線板２の端面には、エツジスルー導体５が形成され、
両面の導体層４の端部に結合可能な状態で配設される。The drawings show a circuit board according to an embodiment of the present invention; FIG. 1 is a sectional view, FIG. 2 is a plan view, and FIG. 3 is a cutaway perspective view of the main parts. This circuit board uses a glass cloth-based epoxy board with a thickness of 1.0mm as the parent printed wiring board 1, and a 0.4+nl11 thick as the child printed wiring board 2.
The same base board is used to make a composite circuit board. On each side of each parent and child printed wiring board 1゜2, there are conductor layers 3 and 4, respectively.
are each formed of a copper foil conductor. An edge-through conductor 5 is formed on the end surface of the child printed wiring board 2.
It is disposed so as to be connectable to the ends of the conductor layer 4 on both sides.
さらに、この子プリント配線板２の一面の導体層４が、
親プリント配線板３に重ね合わされて、これらを導電性
耐熱樹脂接着材６で貼り合わせる。また、この導電性接
着材６の上を耐熱性の樹脂層７を被覆すると、その接着
が補強される。なお、導電性耐熱樹脂接着材６は、この
上層を耐熱性樹脂層７で被う構造の場合、これをはんだ
ペーストで置き代えて使用でき、上層の耐熱性樹脂Ｍ７
を熱硬化処理する過程で５短時間のはんだリフロウ処理
工程を付加することもできる。Furthermore, the conductor layer 4 on one side of this child printed wiring board 2 is
It is superimposed on the parent printed wiring board 3 and bonded together with a conductive heat-resistant resin adhesive 6. Furthermore, by covering the conductive adhesive 6 with a heat-resistant resin layer 7, the adhesion is reinforced. In addition, in the case of a structure in which the upper layer of the conductive heat-resistant resin adhesive 6 is covered with a heat-resistant resin layer 7, this can be replaced with solder paste, and the upper layer of the heat-resistant resin M7
It is also possible to add a short solder reflow treatment step to the heat curing process.
エツジスルー導体５は、ニッケルを壁面付着して、この
上に、銀、パラジウム、ｆｊｉ４などよりなるはんだ付
け可能な金属層を用いて構成する。なお、形状は第３図
示のように、端面に半円筒状にすることにより、付着性
、導電性が良好になる。The edge-through conductor 5 is constructed by depositing nickel on the wall and using a solderable metal layer made of silver, palladium, fji4, etc. thereon. Note that, by forming the end face into a semi-cylindrical shape as shown in the third figure, adhesion and conductivity are improved.
次に、親プリント配線板１の両面の導電層３上に表面実
装部品８，９をそれぞれ当接し、また、子プリント配線
板２の他面の導電層４にも印刷抵抗体１０を形成した状
態で、上記表面実装部品８．９は、はんだペースト１１
を介在させて、はんだリフロウ処理を行って、ハイブリ
ッド回路板を完成させる。このとき、各導体層３．４．
５の表面には、はんだペースト１１を付しておくと、導
電層の抵抗を下げ、導電度の向上に有効である。さらに
、・これらの導電層を被って耐熱性樹脂層７を配してお
けば、熱処理工程ではんだリフロウが行われている間に
、部品の位置移動が抑制される。Next, surface mount components 8 and 9 were brought into contact with the conductive layers 3 on both sides of the parent printed wiring board 1, respectively, and a printed resistor 10 was also formed on the conductive layer 4 on the other side of the child printed wiring board 2. In this state, the surface mount component 8.9 is covered with solder paste 11.
The hybrid circuit board is completed by performing a solder reflow process. At this time, each conductor layer 3.4.
Applying a solder paste 11 to the surface of the conductive layer 5 is effective in lowering the resistance of the conductive layer and improving the conductivity. Furthermore, if the heat-resistant resin layer 7 is disposed to cover these conductive layers, the positional movement of the component can be suppressed during solder reflow in the heat treatment process.
発明の効果
本発明によれば、第１．第２の回路板間を、端面配設の
導体層、いわゆる、エツジスルー導体および導電性樹脂
接着材で結合したことにより、各回路板面への実装部品
のリフロウはんだ付け処理が安定、容易に達成でき、そ
の熱処理過程で複合する回路板の相互変位を抑制するこ
とができる。Effects of the Invention According to the present invention, first. By connecting the second circuit board with a conductor layer placed on the end surface, a so-called edge-through conductor, and a conductive resin adhesive, reflow soldering of mounted components to each circuit board surface can be stably and easily achieved. This makes it possible to suppress mutual displacement of the combined circuit boards during the heat treatment process.
第１図、第２図および第３図は本発明実施例回路板の断
面図、平面図および主要部の破断斜視図である。
１・・・・・・親プリント配線板、２・・・・・・子プ
リント配線板、３．４．５・・・・・・導体層、６・・
・・・・導電性接着材、７・・・・・・耐熱性樹脂層、
８，９・・・・・・表面実装部品。
代理人の氏名 弁理士 中尾敏男 ほか１泡立５上Ｄ＜
９
第２図８ 第３ｒ５
／1, 2, and 3 are a sectional view, a plan view, and a cut away perspective view of the main parts of a circuit board according to an embodiment of the present invention. 1... Parent printed wiring board, 2... Child printed wiring board, 3.4.5... Conductor layer, 6...
... Conductive adhesive, 7... Heat-resistant resin layer,
8, 9...Surface mount parts. Name of agent: Patent attorney Toshio Nakao and 1 other person
9 Figure 2 8 3rd r5 /
Claims (1)
付け可能な導体を設けて、前記両面の導体層を互いに接
続するとともに、その一方の面の導体層を第２の回路板
の導体層に導電性接着材で接続したことを特徴とするハ
イブリッド回路板。A solderable conductor is provided on the end face of the first circuit board having conductor layers on both sides, and the conductor layers on both sides are connected to each other, and the conductor layer on one side is connected to the second circuit board. A hybrid circuit board characterized in that it is connected to a conductor layer using a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63063990A JPH0834344B2 (en) | 1988-03-17 | 1988-03-17 | Method of manufacturing hybrid circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63063990A JPH0834344B2 (en) | 1988-03-17 | 1988-03-17 | Method of manufacturing hybrid circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01236686A true JPH01236686A (en) | 1989-09-21 |
| JPH0834344B2 JPH0834344B2 (en) | 1996-03-29 |
Family
ID=13245229
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63063990A Expired - Lifetime JPH0834344B2 (en) | 1988-03-17 | 1988-03-17 | Method of manufacturing hybrid circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0834344B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0613331A1 (en) * | 1993-02-26 | 1994-08-31 | Siemens Aktiengesellschaft | Method of attaching a hybrid circuit on a pcb |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498757A (en) * | 1972-05-20 | 1974-01-25 | ||
| JPS5771197A (en) * | 1980-10-22 | 1982-05-01 | Matsushita Electric Ind Co Ltd | Method of mounting electronic circuit |
| JPS6293993A (en) * | 1985-10-19 | 1987-04-30 | 松下電器産業株式会社 | Electronic circuit device and mounting of the same |
-
1988
- 1988-03-17 JP JP63063990A patent/JPH0834344B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS498757A (en) * | 1972-05-20 | 1974-01-25 | ||
| JPS5771197A (en) * | 1980-10-22 | 1982-05-01 | Matsushita Electric Ind Co Ltd | Method of mounting electronic circuit |
| JPS6293993A (en) * | 1985-10-19 | 1987-04-30 | 松下電器産業株式会社 | Electronic circuit device and mounting of the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0613331A1 (en) * | 1993-02-26 | 1994-08-31 | Siemens Aktiengesellschaft | Method of attaching a hybrid circuit on a pcb |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0834344B2 (en) | 1996-03-29 |
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