JPH01229413A - Magnetic head and its production - Google Patents

Abstract

PURPOSE:To attain a higher line recording density by securing the thickness corresponding to that of the track width for a pair of magnetic cores at a butting part and setting a gap spacer at the thickness corresponding to the gap width. CONSTITUTION:A pair of magnetic cores 3 and 4 are butting to each other approximately at the same level on a substrate 1 and have the thickness corresponding to the track width at this butting part. While a gap spacer 5 is formed on a plane approximately orthogonal to the plane where both cores 3 and 4 are set and at the butting part of these cores. In this case, the spacer 5 has the thickness corresponding to the gap length. In other words, a magnetic loop is formed within a plane parallel to the plane where the paired cored 3 and 4 are set and the pole face length of each of cores 3 and 4 is equivalent to the lateral width of the core in the direction orthogonal to the film stacking direction. As a result, the magnetic field distribution is improved at the gap part by increasing satisfactorily the lateral width of the core. Then the high line recording density is attained.

Description

Detailed Description of the Invention (Field of Industrial Application) The present invention relates to a magnetic head installed in a magnetic recording/reproducing device such as a VTR1 electronic still camera, and in particular to a so-called thin film magnetic head manufactured using a thin film deposition method. It is related to.

(Prior Art) A conventional thin film magnetic head is, for example, shown in FIGS.
As shown in e), a pair of magnetic cores (30) having a width corresponding to the track width are placed on a non-magnetic substrate (10) (<40).
and a gap spacer (5) forming the magnetic gap part G.
0) and a thin film coil (60) are respectively formed by a thin film deposition method such as sputtering or vacuum evaporation, and include a magnetic core <30) <40) and a gap spacer (50).
0), the film deposition direction of the coil (60) is all towards the substrate (10)
This is the direction perpendicular to the surface.

Thin-film magnetic heads have many advantages, such as being able to make the track width and gap length of the gap part as small as possible and enabling high-density recording. , in the above magnetic head, the magnetic core (30
) Since (40) is formed by a thin film deposition method such as sputtering, there is a certain limit to the thickness of the magnetic core (pole face length), and as a result, there is a problem that the linear recording density cannot be increased. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a magnetic head and a method for manufacturing the same, in which a magnetic core and a gap spacer can be formed by a single film deposition method, and the pole face length of the magnetic core can be made longer than before. .

(Means for Solving the Problems) In the magnetic head according to the present invention, a pair of magnetic cores (3
) and (4) are formed on the substrate (1) on substantially the same plane so as to abut each other, and have a thickness corresponding to the track width at the abutting portion. Also, the gap spacer 5) is
It is characterized in that it is formed at the abutting portion of both magnetic cores (3) and (4) on a plane substantially perpendicular to the arrangement surface of both magnetic cores, and has a thickness corresponding to the gap length.

The manufacturing method of the magnetic head described above includes the steps of depositing a magnetic material in a thickness corresponding to the track width in the formation area of both magnetic cores (3×4) on the substrate (1) to form a magnetic film;
A step of forming a first magnetic core (3) by leaving a portion of the magnetic film corresponding to the magnetic core (3) and removing other portions of the magnetic film by etching; The end surface (31) of the first magnetic core (3)
Then, a non-magnetic material is added to the magnetic core (
Step 3) of depositing the gap spacer (5) in a direction substantially perpendicular to the thickness direction to form a gap spacer (5) having a thickness corresponding to the gap length; The second magnetic core (4) is formed by depositing a magnetic material to a thickness corresponding to the track width in close contact with the surface of the magnetic core (5).

(Function) In the magnetic head according to the present invention, a pair of magnetic cores (
3) A magnetic loop is formed in a plane parallel to the installation plane of (4), and the pole face length of each magnetic core (3) (4) is
This is equivalent to the core width dimension in the direction perpendicular to the film deposition direction. Therefore, by designing the core width dimension to be sufficiently long, the magnetic field distribution in the gap portion is improved.

Further, in the method for manufacturing a magnetic head according to the present invention, the first magnetic core (3), the gap spacer (5), and the second magnetic core (4) are sequentially formed by a thin film deposition method, The dimension of both magnetic cores (3) and (4) in the direction perpendicular to the gap plane, that is, the pole face length, is independent of the thickness of the magnetic film deposited on the substrate (1), and is It is defined by the width dimension in the orthogonal direction. Therefore, it is possible to design the pole face length to a desired value. It is possible to make the pole face length of the core sufficiently longer than in the past, thereby achieving a higher linear recording density than in the past.

Further, according to the method for manufacturing a magnetic head according to the present invention, the magnetic head can be efficiently manufactured using a single-film deposition method.

(Example) FIGS. 1 to 4 show an example of the structure of a magnetic head according to the present invention, and FIGS. 5 ( ) to 9 show a method of manufacturing the magnetic head.

As shown in FIG. 1, the magnetic head according to the present invention has a pair of magnetic cores (3) and (4) facing each other on a magnetic substrate (1) via an insulating film and a magnetic shield layer, which will be described later. A gear/bus baser (5) is interposed in the abutting portion. Both magnetic cores (3) and (4) have thin film coils (6
) is wound thereon, and a magnetic substrate (2) is further provided thereon via a magnetic shield layer and an insulating layer as described later. For example, the magnetic substrates (1) (2) are made of a wear-resistant magnetic material such as NiZn, the magnetic cores (3) (4) are made of a high permeability magnetic material such as Sendust, and the gap spacer (5) is made of a high permeability magnetic material such as Sendust.
is formed by sputtering from a non-magnetic insulating material such as S i 02. Further, the coil (6) is also formed by sputtering using a highly conductive material such as copper as described below.

Hereinafter, the detailed structure of the magnetic head will be explained while explaining the manufacturing process of the magnetic head.

As shown in FIG. 5(,) and FIG. 6(a), the substrate (1)
After etching a hatching region (11) in which both magnetic cores are to be formed to a depth of 3 to 5 μI11 on the surface of Leaving an area where one magnetic core should be formed,
Hatching area (12) where the other magnetic core is to be formed
) is etched to a depth of 0.25μ. Furthermore, the fifth
As shown in FIG. 6(c) and FIGS. 6(c) and 6(d), the hatching area (13) where the coil is to be formed is etched to a depth of 3 μm.

Next, as shown in FIGS. 7(a) and (b), a 1 μm thick SiO2 insulating film (7) is applied to the etched surface of the substrate (1) shown in FIGS. ), thickness 5μm
A silver layer (8) with a thickness of IAZll and a SiO2 insulating film (71) with a thickness of IAZll are sequentially formed by sputtering or vacuum evaporation.

Incidentally, the silver layer (8) functions as a magnetic shield layer together with the substrate (1).

After forming a copper film with a thickness of 2 μm on the entire surface of the substrate (1) shown in FIG. Figure 5 (c
As shown in FIGS. 7(c) and 7(d), a conductor layer (61) which will become a part of the coil is formed. Furthermore, a SiO2 insulating film (72) with a thickness of 1 μm is formed over the entire surface.

Thereafter, as shown in FIG. 8(a), a magnetic film (32) of Sendust, which will become a magnetic core, is formed on the entire surface by sputtering to a thickness of approximately 5 μm. Next, the magnetic film (41) is etched using a mask of a predetermined shape, as shown in FIG.
A magnetic core (3) is formed as shown in e) and FIG. 8(b). At this time, the end surface (31) of the magnetic core (3) can be formed at any angle, but here it is formed perpendicular to the substrate (1).

As shown in FIG. 8(e), a SiO2 film (51) is formed to a thickness of 0.2 μm over the entire surface. At this time, sputtering is performed while changing the angle of the substrate (1) so that an insulating film of uniform thickness is also formed on the end surface (31) of the magnetic core (3).

As a result, an insulating film (71
) < 72) with a thickness corresponding to the step.
The iO2 film (51) is formed, and when the magnetic core (4) is formed in a later step, there will be no discrepancy between the magnetic core (3) and the magnetic core (4).

Next, as shown in FIG. 5(f) and FIG. 8(d), a magnetic core (4) is formed using sputtering and etching, and a Si 02 insulating film (73) is further formed on the entire surface to a thickness of 1.
After that, ion beam etching is performed at the upper position of each end of the conductor layer (61) shown in FIG. Open a through hole (63).

Copper is deposited to a thickness of 2 μm over the entire surface of the insulating layer (73) shown in FIG. At this time, the through hole (63) is also filled with copper. Thereafter, the deposited copper film is etched using a predetermined mask to form a conductor layer (62) that will become the remaining portion of the coil. Furthermore, on top of that, a thickness of 1μ
Ill 5iOz insulating layer (74), 5μ thick silver layer (
81), a thickness of 1 μm (7), and a SiO2 insulating layer (75) are sequentially formed. Incidentally, the silver layer (81) plays a role as a magnetic shield layer together with the substrate (2) described later.

Finally, the NiZn substrate (2) is bonded via the glass bonding layer (9) to complete the magnetic head shown in FIG. Note that the sliding surface with the magnetic recording medium is finished into a cylindrical shape by machining.

10(a)-(f) and FIG. 11(a)-(g) show the manufacturing process of a second embodiment of the magnetic head according to the present invention.

As shown in FIGS. 10(a) and 11(a), NiZ
After etching the surface of the substrate (1) made of n-based material, and recessing a hatching region (14) to a depth of 5 μIII where the entire first magnetic core and a part of the second magnetic core are to be formed. As shown in FIG. 10(b) and FIG. 11(b), the hatching region (15) where a part of the second magnetic core is to be formed is etched to a depth of 0.25 μm.

Next, as shown in FIG. 7(,)(b), a 5iO insulating film (7) with a thickness of 1 μm was applied to the surface of the substrate (1).
A silver layer (8) of III and a SiO2 insulating film (71) having a thickness of lμn are sequentially formed by sputtering.

Thereafter, as shown in FIG. 10(c) and FIG. 11(d), a magnetic core (3) with a thickness of approximately 5 μm is formed by sputtering and etching with sendust, and a 5iOz film with a thickness of 1 μm is further formed on the surface of the magnetic core (3). (51) is formed.

As shown in FIG. 10(d), a spiral first conductor layer (64) covering the rear end of the magnetic core (3) is formed to a thickness of 2 μIn by vapor deposition and etching, and then a spiral conductor layer (64) is formed to a thickness of 1 μIn.
A SiO2 insulating layer (76) is formed over the entire surface.

Next, after opening a through hole above the end of the first conductor layer (64), a linear second conductor layer (65) is formed as shown in FIG. 10(e) to complete the coil. .

Further 1 u, m (7) S io 2 insulating layer (77)
After forming the second layer on the entire surface, as shown in FIG.
The region where the magnetic core is to be formed is etched to a depth of 2.75 μm to define the thickness of the insulating layer that will become the magnetic gap portion to 0.25 μm, and the gear spacer (5) is etched.
form.

Thereafter, the rear end of the first magnetic core (3) was etched to a depth that reached the sendust layer, and as shown in FIG.
As shown in f), the second magnetic core (
4) (see Fig. 11(g)).

As a result, both magnetic cores overlap each other at their respective rear ends.

Next, as shown in FIG. 11(g), a 5in2 insulating layer (78) of 1μm, a silver layer (81) of 5μm, and a Si layer of 1μIll.
After sequentially forming the O□ insulating layer (79), the glass bonding layer (
A NiZn substrate (2) is attached via the magnetic head 9) to complete the magnetic head. The magnetic head thus obtained has basically the same structure as the magnetic head shown in FIG.

In the above magnetic head, since the gap spacer (5) is formed on a plane substantially parallel to the film deposition direction of the magnetic cores (3) and (4), the ball faces of the magnetic cores (3) and (4) The length is equal to the width dimension of the magnetic film deposition region, and as a result, a longer ball face length than conventionally can be achieved.

However, both magnetic cores (3) and (4) are made of a pair of silver layers and Ni
Because it is sandwiched between Zn magnetic substrates, the magnetic shielding effect exerted by the silver layer and the magnetic substrate not only makes it possible to achieve a narrower track width (for example, 1 μm to 30 μm) than before, but also increases the wear resistance exerted by the magnetic substrates. Due to its properties, sufficient strength can be maintained even when the magnetic head is made smaller.

In addition, in the above magnetic head manufacturing method, all steps are performed by thin film deposition processing and etching.
Extremely high mass productivity can be achieved.

It should be noted that the configuration of each part of the present invention is not limited to the above-mentioned embodiments, and it goes without saying that various modifications can be made within the technical scope of the claims.

[Brief explanation of the drawing]

FIG. 1 is an oblique view of the magnetic head according to the present invention, FIG. 2 is an enlarged front view showing the sliding surface with the signal recording medium, and FIG.
Figure 4 is an enlarged cross-sectional view along line 2 and Figure 1, IY-1.
Figures 5(a) to 5(f) are perspective views showing the magnetic head manufacturing process up to forming a pair of magnetic cores on a substrate, and Figures 6(, ) to ( d) is a diagram showing the etching process for the substrate, in which FIG.
) is a cross-sectional view along the line a-Via in Figure 5(a), Figure 6(b) is a cross-sectional view along the line b-VI lJ in Figure 5(b), and Figure 6(c) is a cross-sectional view along the line Figure 5(c) is a sectional view taken along line VIc-■c, Figure 6(d) is a sectional view taken along line 5(c)■d-VId, and Figures 7(a) to (d) are thin films. 7(a) and 7(c) are cross-sectional views corresponding to FIG. 6(c), and FIG. 7(b)<d) is a cross-sectional view corresponding to FIG. 6(c). 8(a) to 8(d) are a series of sectional views showing the latter half of the thin film deposition process, in which FIG. 8(b) corresponds to FIG. 5(e). ■A cross-sectional view along line b-■b, Figure 8(d) is a cross-sectional view along line 5(f) ■d-■d, Figure 9 is a cross-sectional view showing the through-hole opening process,
10(a) to (f) and FIG. 11(a) to (g) are a series of perspective views and a series of sectional views showing a second embodiment of the manufacturing process of a magnetic head according to the present invention. 11(a) is a sectional view taken along the line Xla-Da in FIG. 10(a), and FIG. 11(b) is a sectional view taken along the XIb-XIb line in FIG.
11(d) is a cross-sectional view along the line, FIG. 10(C) XI
A cross-sectional view along the d-1lcl line, FIG. 11(e) is the 10th
Figure (e) Cross-sectional view along line XI e - XI e, 12th
12(a) and 12(b) are a front view and a plan view of a conventional 74-film magnetic head, and FIG. 12(c) is a sectional view taken along line ce in FIG. 12(b). (1)(2)...Substrate (3)(4)...
Magnetic core (5)... Gap spacer (6)... Coil (61) (62)... Conductor layer (8) (81
)...Silver layer 7 @<dノ) film S Figure (d) Figure 9 (Go1 (b) (C) (e) (f) (≦Rose) (b)

Claims (1)

[Claims] [1] A pair of magnetic cores (3) and (4), a gap spacer (5) serving as a magnetic gap portion, and a coil (6) are formed on a substrate (1) through a thin film deposition process. In the magnetic head formed by the above method, both magnetic cores (3) and (4) are formed so as to abut each other on substantially the same plane, have a thickness corresponding to the track width at the abutting portion, and have a gap spacer ( 5) is characterized in that it is formed at the abutting portion of both magnetic cores (3) and (4) on a plane substantially perpendicular to the arrangement surface of both magnetic cores, and has a thickness corresponding to the gap length. magnetic head. [2] A magnetic head in which a pair of magnetic cores (3) (4), a gap spacer (5) serving as a magnetic gap portion, and a coil (6) are formed on a substrate (1) by thin film deposition. In the manufacturing method, a bimagnetic core (3) (
Step 4) of depositing a magnetic material in the formation region to a thickness corresponding to the track width to form a magnetic film, and leaving a portion of the magnetic film corresponding to the first magnetic core (3) and depositing the other magnetic material on the magnetic film. The first magnetic core (3) is removed by etching.
and depositing a non-magnetic material on the end surface (31) of the first magnetic core (3) newly formed by the etching in a direction substantially perpendicular to the thickness direction of the magnetic core (3). A step of forming a gap spacer (5) with a thickness corresponding to the gap length, and applying a magnetic material to the track width in close contact with the surface of the gap spacer (5) in the etched region on the substrate (1). A method for manufacturing a magnetic head, comprising the step of depositing the second magnetic core (4) to a corresponding thickness to form a second magnetic core (4).