JPH0524563B2 - - Google Patents
Info
- Publication number
- JPH0524563B2 JPH0524563B2 JP59081143A JP8114384A JPH0524563B2 JP H0524563 B2 JPH0524563 B2 JP H0524563B2 JP 59081143 A JP59081143 A JP 59081143A JP 8114384 A JP8114384 A JP 8114384A JP H0524563 B2 JPH0524563 B2 JP H0524563B2
- Authority
- JP
- Japan
- Prior art keywords
- magnetic
- layer
- thin film
- magnetic layer
- recording medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000010409 thin film Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 16
- 239000010408 film Substances 0.000 claims description 14
- 239000004020 conductor Substances 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 58
- 239000011162 core material Substances 0.000 description 34
- 238000000034 method Methods 0.000 description 22
- 230000000694 effects Effects 0.000 description 13
- 238000004544 sputter deposition Methods 0.000 description 7
- 238000005530 etching Methods 0.000 description 6
- 239000011229 interlayer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000696 magnetic material Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910003271 Ni-Fe Inorganic materials 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3109—Details
- G11B5/3116—Shaping of layers, poles or gaps for improving the form of the electrical signal transduced, e.g. for shielding, contour effect, equalizing, side flux fringing, cross talk reduction between heads or between heads and information tracks
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3163—Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers
Description
【発明の詳細な説明】 〔発明の利用分野〕 本発明は薄膜磁気ヘツドに関する。[Detailed description of the invention] [Field of application of the invention] The present invention relates to thin film magnetic heads.
従来の薄膜ヘツドは、基板面上に２〜20μm程
度の軟磁性膜をスパツタ又は蒸着の手法を用いて
形成し、その上にギヤツプ材としての非磁性膜を
介在させ、さらにその上に磁性膜をたい積してヘ
ツドの磁気ギヤツプを形成したものが殆んどであ
つた。
Conventional thin film heads are made by forming a soft magnetic film with a thickness of about 2 to 20 μm on the substrate surface using sputtering or vapor deposition techniques, interposing a nonmagnetic film as a gap material on top of the soft magnetic film, and then depositing a magnetic film on top of that. In most cases, the magnetic gap in the head was formed by piling up the magnetic head.
ヘツドのトラツク幅はエツチング又は機械加工
等の手法により磁性膜を寸断することで得るもの
である。この場合ヘツドのギヤツプ近傍の磁気コ
アの形状はギヤツプに平行してその左右にコアの
エツジ部があるために、このエツジ部分でもテー
プ上の信号を拾ういわゆるコンタ効果が発生し、
忠実な信号再生を行う場合支障となるものであつ
た。本来コンタ効果は、磁気ヘツドのギヤツプ以
外のコアのエツジ部等と磁気記録媒体に記録され
た信号とが磁気的にカツプルしヘツド巻線を通過
することによつてギヤツプの読信号と時間的にず
れた信号を読むもので、この場合もヘツドのいわ
ゆるアジマスロスの効果があることは良く知られ
ている。この効果を利用しギヤツプと平行でない
コアエツジを形成せしめコアエツジ部での信号読
取能力を著しく低減せしめんとするものである。 The track width of the head is obtained by cutting the magnetic film into pieces using techniques such as etching or machining. In this case, the shape of the magnetic core near the gap of the head is parallel to the gap, and there are edges of the core on the left and right sides of the gap, so a so-called contour effect occurs in which the signal on the tape is picked up even at these edges.
This was a hindrance to faithful signal reproduction. Essentially, the contour effect is caused by magnetic coupling between the edges of the core of the magnetic head other than the gap and the signal recorded on the magnetic recording medium, which passes through the head winding, resulting in a time difference between the read signal of the gap and the signal recorded on the magnetic recording medium. It is used to read shifted signals, and it is well known that in this case too, there is an effect of so-called azimuth loss of the head. This effect is utilized to form a core edge that is not parallel to the gap, thereby significantly reducing the signal reading ability at the core edge portion.
本発明は、コンタ効果の発生しない薄膜磁気へ
ツドを提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a thin film magnetic head that does not produce contour effects.
本発明は、非磁性基板上に形成された非磁性層
内に下部磁性層を埋設し、該下部磁性層上に、絶
縁層、コイル導体層、上部磁性層等を順次積層し
てなる薄膜磁気ヘツドにおいて、前記下部磁性層
および上部磁性層の両磁性層のうち、少なくとも
一方の磁性層の磁気記録媒体対向面側の端部に、
磁路長方向と直交せず所定の角度を有し、かつ前
記磁気記録媒体対向面側の磁性層の厚さが次第に
薄くなる形状の斜面部を形成し、該斜面部内に磁
路長方向と直交する磁気記録媒体対向面を形成す
ることにより前記両磁性層またはその一方の磁性
層の膜層を、トラツク幅方向に直線的に変化せし
めた構成にしてなることを特徴とする薄膜磁気ヘ
ツドである。
The present invention provides a thin film magnetic material in which a lower magnetic layer is embedded in a non-magnetic layer formed on a non-magnetic substrate, and an insulating layer, a coil conductor layer, an upper magnetic layer, etc. are sequentially laminated on the lower magnetic layer. In the head, at the end of at least one of the magnetic layers of the lower magnetic layer and the upper magnetic layer on the side facing the magnetic recording medium,
A slope portion is formed not perpendicularly to the magnetic path length direction and has a predetermined angle, and has a shape in which the thickness of the magnetic layer on the side facing the magnetic recording medium gradually becomes thinner, and within the slope portion, there is formed a slope portion that is not orthogonal to the magnetic path length direction but has a predetermined angle. A thin film magnetic head characterized in that the film layers of the two magnetic layers or one of the magnetic layers are changed linearly in the track width direction by forming orthogonal surfaces facing the magnetic recording medium. be.
これによりコンタ効果を防止することができ
る。 This can prevent contour effects.
以下に本発明の一実施例を図面に基づいて説明
する。本例においては非磁性基板１上に形成され
た非磁性層２の表面に下部磁性層３を埋設し、該
下部磁性層３上に、絶縁層４、コイル導体層８、
上部磁性層５を順次積層してなる薄膜磁気ヘツド
において、該下部磁性層３又は該上部磁性層５の
うちの少なくとも一方の膜層が、トラツク幅方向
に直線的に変化している。
An embodiment of the present invention will be described below based on the drawings. In this example, a lower magnetic layer 3 is embedded in the surface of a non-magnetic layer 2 formed on a non-magnetic substrate 1, and on the lower magnetic layer 3, an insulating layer 4, a coil conductor layer 8,
In a thin film magnetic head formed by sequentially laminating upper magnetic layers 5, at least one of the lower magnetic layer 3 and the upper magnetic layer 5 changes linearly in the track width direction.
これにより、コンタ効果を防止する。 This prevents contour effects.
以下、本発明の一実施例のより具体的内容を図
面に用いて説明する。 Hereinafter, more specific details of an embodiment of the present invention will be explained using the drawings.
第１図は、薄膜磁気ヘツドのヘツド摺動面より
見た図、第２図は第１図の磁路長方向の断面図で
ある。１は非磁性基板、２は非磁性層、３は非磁
性層の２の穴に埋め込まれた下部コアとなる下部
磁性層（以下、下部コアともいう）、４はへつど
ギヤツプを規定する絶縁層、５は上部コアとなる
上部磁性層（以下、上部コアともいう）、８は１
ターンの信号コイル導体層、９は信号コイルの絶
縁と段差を埋めるための絶縁層、６は接着層、７
は接着層６で接着された保護板である。 FIG. 1 is a view of the thin film magnetic head seen from the head sliding surface, and FIG. 2 is a sectional view of FIG. 1 in the direction of the magnetic path length. 1 is a non-magnetic substrate, 2 is a non-magnetic layer, 3 is a lower magnetic layer (hereinafter also referred to as the lower core) embedded in the hole 2 of the non-magnetic layer, and 4 is an insulator that defines a head gap. layer, 5 is an upper magnetic layer serving as an upper core (hereinafter also referred to as upper core), 8 is 1
Turn signal coil conductor layer, 9 is an insulating layer for insulating the signal coil and filling the steps, 6 is an adhesive layer, 7
is a protective plate adhered with an adhesive layer 6.
以下、具体的な製造方法を説明する。最初に第
３図、第４図により、ギヤツプ形成面と上下薄膜
コアのエツジ部をギヤツプ線に対して非平行なら
しめる方法を説明する。 A specific manufacturing method will be described below. First, a method for making the gap forming surface and the edge portions of the upper and lower thin film cores non-parallel to the gap line will be explained with reference to FIGS. 3 and 4.
第３図はその方法を説明するための斜視図、第
４図は第３図のＰ−P′線断面を図面右方向から見
た図である。第３図において、基板１１上に２つ
の薄膜層１２，１３が、その両者の境界面が基板
１１表面に対して前記両者の厚さを次第に変化す
るようにαなる角度で重なり、図に矢印ｘで示す
磁路長方向と直交せず所定の角度βを有する点線
で示す直線AA′と、その対辺BB′とのAA′B′Bで
囲む斜面部を形成している。また２つの薄膜層１
２、１３の表面は基板１１表面と平行になつてい
る。 FIG. 3 is a perspective view for explaining the method, and FIG. 4 is a cross-sectional view taken along line P-P' in FIG. 3, viewed from the right side of the drawing. In FIG. 3, two thin film layers 12 and 13 are overlapped on a substrate 11 at an angle α such that the interface between the two gradually changes the thickness of the two with respect to the surface of the substrate 11. A slope portion is formed between a straight line AA' shown by a dotted line that is not perpendicular to the magnetic path length direction shown by x and has a predetermined angle β, and AA'B'B of the opposite side BB'. There are also two thin film layers 1
The surfaces of 2 and 13 are parallel to the surface of the substrate 11.
このように形成した２つの薄膜層１２，１３を
その重なりあう前記斜面部分において、薄膜層１
２，１３の境界面が基板１１表面と接してできる
前記直線AA′と所定の角度βを有する方向、つま
り前記磁路長方向と直交する方向の直線PP′を含
むPP′QQ′で囲む斜線部で切断すると、第４図の
ような断面が得られる。 The two thin film layers 12 and 13 formed in this way are placed on the overlapping slope portion of the thin film layer 1.
A diagonal line surrounded by PP'QQ' including a straight line PP' in a direction having a predetermined angle β with the straight line AA' formed by the boundary surfaces of 2 and 13 in contact with the surface of the substrate 11, that is, a direction perpendicular to the magnetic path length direction. When cut at the section, a cross section as shown in FIG. 4 is obtained.
第４図より明らかなように、上述の方法によれ
ば薄膜層１２，１３の境界面のエツジがつくる直
線RR′は、基板表面および薄膜層表面のエツジが
つくる直線PP′，QQ′と非平行となる。 As is clear from FIG. 4, according to the method described above, the straight line RR' formed by the edges of the interface between the thin film layers 12 and 13 is different from the straight lines PP' and QQ' formed by the edges of the substrate surface and the thin film layer surface. become parallel.
この方法を使つて、第１図、第２図に示した実
施例の薄膜ヘツドを作るわけである。すなわち、
第３図におけるPP′線での切断は、円筒研削面に
相当し、薄膜層１２，１３がそれぞれ第１図の非
磁性層２、下部コア３に相当し、薄膜層１２，１
３の表面がギヤツプ形成面とすれば、第４図の直
線RR′はギヤツプ形成面と非平行ならしめた下部
コア３のエツジに当る。また、第３図、第４図の
薄膜層１２を上部コア５、基板１１表面をギヤツ
プ形成面とすれば、第４図の直線RR′はギヤツプ
形成面と非平行ならしめた上部コア５のエツジに
当る（ただし、この場合は薄膜層１３はないもの
と考える）。 This method is used to make the thin film head of the embodiment shown in FIGS. 1 and 2. That is,
The cut along the line PP' in FIG.
If the surface of 3 is a gap forming surface, the straight line RR' in FIG. 4 corresponds to the edge of the lower core 3 which is made non-parallel to the gap forming surface. Furthermore, if the thin film layer 12 in FIGS. 3 and 4 is the upper core 5, and the surface of the substrate 11 is the gap forming surface, then the straight line RR' in FIG. (However, in this case, it is assumed that there is no thin film layer 13).
次に、第５図、第６図により、より具体的な製
造方法を説明する。第５図は下部コアの形成方法
を説明するための工程図、第６図はウエハ工程終
了後のヘツド素子の正面図（ただし、上部コア
５、絶縁層９は省略）および断面図である。符号
は第１図と第２図に同じである。以下、工程に沿
つて説明する。 Next, a more specific manufacturing method will be explained with reference to FIGS. 5 and 6. FIG. 5 is a process diagram for explaining the method of forming the lower core, and FIG. 6 is a front view (however, the upper core 5 and the insulating layer 9 are omitted) and a sectional view of the head element after the wafer process is completed. The symbols are the same in FIG. 1 and FIG. 2. The process will be explained below.
１ 基板１上に非磁性層２としてSiO2やＡ2O3
などをスパツタ、蒸着等で成膜し、第５図ａに
示したようにテーパ角α1（第３図に示す角度α
に相当）をつけて穴加工を施す。加工法として
は、テーパをつけたマスク（例えば、ポストベ
ーク条件の選定によりレジストパターンエツジ
に傾斜をつける方法、レジストをプラズマエツ
チングで等方性エツチングを行つてパターンエ
ツジに傾斜をつける方法等がある）を使つて、
イオンエツチングでエツチングする方法、ある
いはイオンエツチングで基板を傾けてエツチン
グする方法等がある。1 SiO 2 or A 2 O 3 as a nonmagnetic layer 2 on the substrate 1
A film is formed by sputtering, vapor deposition, etc., and the taper angle α 1 (the angle α shown in Figure 3) is set as shown in Figure 5a.
(equivalent to ) and drill the hole. Processing methods include a tapered mask (for example, a method in which the edges of the resist pattern are made sloped by selecting post-bake conditions, a method in which the resist is isotropically etched by plasma etching and a method in which the pattern edges are made sloped), etc. ) using
There are a method of etching by ion etching, a method of etching by tilting the substrate by ion etching, etc.
また、非磁性層２をリフトオフ法で形成し、
下部コア埋込み穴を作つてもよい。テーパ角α1
としては20°〜60°程度が好ましい。 In addition, the nonmagnetic layer 2 is formed by a lift-off method,
A hole may be made for embedding the lower core. Taper angle α 1
The preferred angle is about 20° to 60°.
なお、上述の下部コア埋込み用穴の形状は第
３図、第４図の説明で明らかであるが、第６図
ａに示したように、フロントギヤツプ形成側の
１辺は、円筒研削面Ｃ−C′（コイルパターン端
と平行）と角度βをなすように作る（バツクギ
ヤツプ側は平行でもよい）。 The shape of the hole for embedding the lower core mentioned above is clear from the explanation of FIGS. 3 and 4, but as shown in FIG. Make an angle β with C′ (parallel to the end of the coil pattern) (the back gap side may be parallel).
２ 次にFe−Ａ−Si，Ni−Fe、アモルフアス
等の磁性材料をスパツタで成膜した下部磁性層
３を、第５図ｂに示したように、ラツプ加工で
平坦にする。2. Next, the lower magnetic layer 3, which is made of a magnetic material such as Fe--A--Si, Ni--Fe, or amorphous, is formed by sputtering and is flattened by lapping, as shown in FIG. 5b.
３ SiO2，Ａ2O3などを、ギヤツプを規定する
所定厚さにスパツタで形成する。3 SiO 2 , A 2 O 3 or the like is formed by sputtering to a predetermined thickness that defines the gap.
４ Ａ，Cuなどをスパツタ、蒸着等で成膜し
た後に、第６図ａに示したようにエツチングし
て、コイル導体層８を作る。4. After forming a film of A, Cu, etc. by sputtering, vapor deposition, etc., etching is performed as shown in FIG. 6a to form the coil conductor layer 8.
５ この上にSiO，SiO2などをスパツタ、蒸着等
で成膜し、フロントおよびバツクギヤツプ部を
エツチングで除去し、絶縁層９を形成する。5. A film of SiO, SiO 2 or the like is formed on this by sputtering, vapor deposition, etc., and the front and back gap portions are removed by etching to form the insulating layer 9.
６ 再びFe−Ａ−Si，Ni−Fe、アモルフアス
等の磁性材料をスパツタで成膜した上部磁性層
５を、１）で述べたエツチング方法により、第
６図ｂに示したようにテーパ角α2をつけてパタ
ーニングする。この形状も先に述べた下部コア
と同様に、円筒研削面Ｃ−C′とβの角度をなす
形状に作る。6 The upper magnetic layer 5, which is made of a magnetic material such as Fe-A-Si, Ni-Fe, or amorphous amorphous by sputtering, is etched by the etching method described in 1) to obtain a taper angle α as shown in FIG. 6b. Add 2 and pattern. This shape is also made to form an angle β with the cylindrical grinding surface C-C', similar to the lower core described above.
７ このようにしてウエハ工程を終わつたあと、
第６図に示したように、Ｃ−C′線で円筒研削で
削り落すことによつて、第１図、第２図に示し
た薄膜ヘツドができる。7 After completing the wafer process in this way,
As shown in FIG. 6, the thin film head shown in FIGS. 1 and 2 is obtained by cylindrical grinding along line C--C'.
以上、本例によれば、上下コアのエツジをギヤ
ツプ線と非平行ならしむることができ、コンタ効
果を解決できる。 As described above, according to this example, the edges of the upper and lower cores can be made non-parallel to the gap line, and the contour effect can be solved.
また、前記実施例では単層膜のコアについて述
べたが、多層膜構造のコアについても同様の手段
によつて適用できる。特に、下部コアについて
は、基板１上にテーパ角α1の非磁性絶縁層（図示
しない）をパターニングした後、軟磁性コア材と
非磁性絶縁層（図示しない）を所定の膜厚だけ順
次積層する。この場合、磁気記録媒体対向面にお
ける前記非磁性絶縁層は、第１図を利用して説明
すると、下部磁性層３の端部abに平行で、かつ
磁気ギヤツプ面に対して非平行に形成される。そ
の後、ラツプ等の手法により平面化し、ギヤツプ
面を形成する。この構成により、擬似磁気ギヤツ
プとなる上記コア層間面に真の磁気ギヤツプ面と
アジマス角度をもつので、コア層間面の原因によ
るコンタ効果を低減することができる。一方、上
部コアについては、該基板上にギヤツプ材４を形
成した後、第１層目の上部コアを形成し、第６図
ｂに示すようにテーパ角度をα2として所定の形状
でパターニングする。次に、コア層間材と第２層
目以降の上部コアを順次積層し最終的に上部多層
コアを一括してパターニングする。この場合も、
磁気記録媒体対向面における前記非磁性絶縁層
は、第１図を利用して説明すると、上部磁性層３
の端部cdに平行で、かつ磁気ギヤツプ面に対し
て非平行に形成される。この手法により、第一層
目の上部コアのテーパ角α2が第２層目以上の上部
コアおよび層間材に転写されることになるので、
擬似磁気ギヤツプとなる上記上部コア層間面が真
の磁気ギヤツプ面に対してアジマス角度を有する
ことになるのでコンタ効果が低減できる。上記の
多層膜構造コアの構成とすることにより、単層膜
構造コアに比較して渦電流損失が少なく（高周波
特性改善）、かつ前記した簡単な構成でコンタ効
果を低減した薄膜磁気ヘツドが実現できる。 Furthermore, although the above embodiments have described the core of a single layer film, the same method can be applied to a core of a multilayer film structure. In particular, for the lower core, after patterning a non-magnetic insulating layer (not shown) with a taper angle of α 1 on the substrate 1, a soft magnetic core material and a non-magnetic insulating layer (not shown) are sequentially laminated to a predetermined thickness. do. In this case, the non-magnetic insulating layer on the surface facing the magnetic recording medium is formed parallel to the end ab of the lower magnetic layer 3 and non-parallel to the magnetic gap surface, as explained using FIG. Ru. Thereafter, it is flattened by a technique such as lapping to form a gap surface. With this configuration, since the core interlayer plane serving as the pseudo magnetic gap has an azimuth angle with respect to the true magnetic gap plane, the contour effect caused by the core interlayer plane can be reduced. On the other hand, for the upper core, after forming the gap material 4 on the substrate, the first layer of the upper core is formed and patterned in a predetermined shape with a taper angle of α 2 as shown in FIG. 6b. . Next, the core interlayer material and the second and subsequent layers of the upper core are sequentially laminated, and finally the upper multilayer core is patterned all at once. In this case too,
To explain using FIG. 1, the nonmagnetic insulating layer on the surface facing the magnetic recording medium is the upper magnetic layer 3.
parallel to the end cd of the magnetic gap and non-parallel to the magnetic gap surface. With this method, the taper angle α 2 of the upper core of the first layer is transferred to the upper core and interlayer material of the second and higher layers, so
Since the above-mentioned upper core interlayer plane, which becomes the pseudo magnetic gap, has an azimuth angle with respect to the true magnetic gap plane, the contour effect can be reduced. By adopting the above-mentioned structure of the multilayer film structure core, a thin film magnetic head with less eddy current loss (improved high frequency characteristics) than a single-layer film structure core and reduced contour effect with the above-mentioned simple structure has been realized. can.
以上、本発明によればコンタ効果を解決でき、
高忠実度再生が可能な磁気ヘツドを作ることがで
きるようになつた。
As described above, according to the present invention, the contour effect can be solved,
It became possible to create magnetic heads capable of high-fidelity playback.
第１図及び第２図は本発明の一実施例に係る薄
膜磁気ヘツドを示し、第１図は摺動面からの正面
図であり、第２図は断面図である。第３図は本発
明の一実施例を説明するための要部斜視部、第４
図は第３図のＰ−P′線断面図、第５図は本発明の
一実施例に係る薄膜磁気ヘツドの下部コアの形成
方法を説明すための工程図、第６図は本発明の一
実施例に係る薄膜磁気ヘツドのウエハ工程終了後
の状態を示す図で、同図ａはその正面図、同図ｂ
はその断面図である。
１，１１……基板、２……非磁性層、３……下
部磁性層（下部コア）、４……ギヤツプを規定す
る絶縁層、５……上部磁性層（上部コア）、１２，
１３……薄膜層。
1 and 2 show a thin film magnetic head according to an embodiment of the present invention, with FIG. 1 being a front view from the sliding surface and FIG. 2 being a sectional view. FIG. 3 is a perspective view of main parts for explaining one embodiment of the present invention, and FIG.
The figure is a cross-sectional view taken along the line P-P' in FIG. 1 is a diagram showing the state of a thin film magnetic head according to an embodiment after the wafer process is completed; FIG.
is a sectional view thereof. DESCRIPTION OF SYMBOLS 1, 11...Substrate, 2...Nonmagnetic layer, 3...Lower magnetic layer (lower core), 4...Insulating layer that defines the gap, 5...Upper magnetic layer (upper core), 12,
13... Thin film layer.
Claims (1)
磁性層を埋設し、該下部磁性層上に、絶縁層、コ
イル導体層、上部磁性層等を順次積層してなる薄
膜磁気ヘツドにおいて、前記下部磁性層および上
部磁性層の両磁性層のうち、少なくとも一方の磁
性層の磁気記録媒体対向面側の端部に、磁路長方
向と直交せず所定の角度を有し、かつ前記磁気記
録媒体対向面側の磁性層の厚さが次第に薄くなる
形状の斜面部を形成し、該斜面部内に磁路長方向
と直交する磁気記録媒体対向面を形成することに
より前記両磁性層またはその一方の磁性層の膜厚
を、トラツク幅方向に直線的に変化せしめた構成
にしてなることを特徴とする薄膜磁気ヘツド。 ２ 前記下部磁性層および上部磁性層の両磁性層
のうち、少なくとも一方の磁性層が、内部に非磁
性絶縁層を介在した多層膜で構成され、磁気記録
媒体対向面における前記非磁性絶縁層が、前記磁
性層の端部に平行で、かつ磁気ギヤツプ面に対し
て非平行である特許請求の範囲第１項記載の薄膜
磁気ヘツド。[Claims] 1. A lower magnetic layer is embedded in a non-magnetic layer formed on a non-magnetic substrate, and an insulating layer, a coil conductor layer, an upper magnetic layer, etc. are sequentially laminated on the lower magnetic layer. In the thin film magnetic head, an end portion of at least one of the magnetic layers of the lower magnetic layer and the upper magnetic layer on the side facing the magnetic recording medium is formed at a predetermined angle not perpendicular to the magnetic path length direction. and forming a sloped portion having a shape in which the thickness of the magnetic layer on the side facing the magnetic recording medium gradually becomes thinner, and forming a magnetic recording medium facing surface perpendicular to the magnetic path length direction within the sloped portion. 1. A thin film magnetic head characterized in that the thickness of one or both of the magnetic layers is varied linearly in the track width direction. 2. At least one of the magnetic layers, the lower magnetic layer and the upper magnetic layer, is composed of a multilayer film with a nonmagnetic insulating layer interposed therein, and the nonmagnetic insulating layer on the surface facing the magnetic recording medium is 2. A thin film magnetic head according to claim 1, wherein the magnetic head is parallel to the end of the magnetic layer and non-parallel to the magnetic gap plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8114384A JPS60226007A (en) | 1984-04-24 | 1984-04-24 | Thin film magnetic head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8114384A JPS60226007A (en) | 1984-04-24 | 1984-04-24 | Thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60226007A JPS60226007A (en) | 1985-11-11 |
| JPH0524563B2 true JPH0524563B2 (en) | 1993-04-08 |
Family
ID=13738187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8114384A Granted JPS60226007A (en) | 1984-04-24 | 1984-04-24 | Thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60226007A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2575617B2 (en) * | 1985-04-15 | 1997-01-29 | 日本電信電話株式会社 | Thin film head |
| JP2710439B2 (en) * | 1990-03-13 | 1998-02-10 | アルプス電気株式会社 | Thin film magnetic head and method of manufacturing the same |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5880119A (en) * | 1981-11-04 | 1983-05-14 | Hitachi Ltd | Magnetic head of composite magnetic material |
-
1984
- 1984-04-24 JP JP8114384A patent/JPS60226007A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5880119A (en) * | 1981-11-04 | 1983-05-14 | Hitachi Ltd | Magnetic head of composite magnetic material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60226007A (en) | 1985-11-11 |
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