JPH0121621B2 - - Google Patents

Info

Publication number
JPH0121621B2
JPH0121621B2 JP15587381A JP15587381A JPH0121621B2 JP H0121621 B2 JPH0121621 B2 JP H0121621B2 JP 15587381 A JP15587381 A JP 15587381A JP 15587381 A JP15587381 A JP 15587381A JP H0121621 B2 JPH0121621 B2 JP H0121621B2
Authority
JP
Japan
Prior art keywords
sealing
electrode
jig
sealing hole
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP15587381A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5856351A (ja
Inventor
Masanori Kuroki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
Original Assignee
NEC Home Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd filed Critical NEC Home Electronics Ltd
Priority to JP15587381A priority Critical patent/JPS5856351A/ja
Publication of JPS5856351A publication Critical patent/JPS5856351A/ja
Publication of JPH0121621B2 publication Critical patent/JPH0121621B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP15587381A 1981-09-29 1981-09-29 半導体装置の検査方法 Granted JPS5856351A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15587381A JPS5856351A (ja) 1981-09-29 1981-09-29 半導体装置の検査方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15587381A JPS5856351A (ja) 1981-09-29 1981-09-29 半導体装置の検査方法

Publications (2)

Publication Number Publication Date
JPS5856351A JPS5856351A (ja) 1983-04-04
JPH0121621B2 true JPH0121621B2 (enrdf_load_stackoverflow) 1989-04-21

Family

ID=15615364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15587381A Granted JPS5856351A (ja) 1981-09-29 1981-09-29 半導体装置の検査方法

Country Status (1)

Country Link
JP (1) JPS5856351A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5856351A (ja) 1983-04-04

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