JPH01212401A - Resistor - Google Patents
ResistorInfo
- Publication number
- JPH01212401A JPH01212401A JP63037959A JP3795988A JPH01212401A JP H01212401 A JPH01212401 A JP H01212401A JP 63037959 A JP63037959 A JP 63037959A JP 3795988 A JP3795988 A JP 3795988A JP H01212401 A JPH01212401 A JP H01212401A
- Authority
- JP
- Japan
- Prior art keywords
- resistor
- mask
- element body
- same
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 abstract 1
- 238000012216 screening Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 101100269850 Caenorhabditis elegans mask-1 gene Proteins 0.000 description 1
- 241000283080 Proboscidea <mammal> Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
この発明は電子回路に用いる抵抗器に関するものである
。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a resistor used in an electronic circuit.
従来の抵抗器は、絶縁素体上に形成した抵抗体の両端に
外部電極を鰻(プた也ので、特にチップ型抵抗器のよう
にリード線のないもの逅、リード線を有するものとがあ
る。Conventional resistors have external electrodes on both ends of a resistor formed on an insulating element, so some resistors, such as chip resistors, do not have lead wires, while others have lead wires. be.
又、抵抗値等の表示は抵抗器の上下面の何れか片方のみ
に設けである。Further, the display of the resistance value etc. is provided only on either the upper or lower surface of the resistor.
更に、その製造方法においては□;低抵抗多数形成され
た短冊状の絶縁素体に、予めチップ形状に応じてスリッ
トを設けたものに外部電極を焼成したものを、ブレーク
して抵抗器単体にしていた。Furthermore, in its manufacturing method, □: A strip-shaped insulating element with a large number of low resistances formed therein, with slits formed in advance according to the chip shape, and external electrodes fired, are then broken to form a single resistor. was.
〈発明が解決しようとする課題〉
上記の従来の抵抗器においては、表示が抵抗体の片方に
のみ設けであるので、これをプリント基板等に自□動マ
ウントするに当っては、バルクカセット辷よって表裏の
判別機構が必要となる為、コストアップの要因となる。<Problems to be Solved by the Invention> In the conventional resistor described above, the display is provided only on one side of the resistor, so when automatically mounting it on a printed circuit board etc., it is difficult to load the bulk cassette. Therefore, a mechanism for determining the front and back sides is required, which increases the cost.
又、表裏の判別機構によりマウント機内でのチップ詰ま
り等が発生し易くなり、実装信頼度が低下する。In addition, the front/back discrimination mechanism tends to cause chip clogging in the mounting machine, reducing mounting reliability.
又、製造工iにおけるブレークはスリットを基準にして
行われるが、この際斜め割れや変形割れが発生し易く、
寸法制度も悪く、バルク供給時のひっかかり等の原因で
実装低下をひきおこす。In addition, the break in manufacturing process i is performed using the slit as a reference, but at this time diagonal cracks and deformation cracks are likely to occur.
The dimensional accuracy is also poor, leading to poor packaging due to snags during bulk supply.
さらにこのブレークによって抵抗器を形成するものは、
外部電極が三面電極の為、これをチップ型としてプリン
ト基板にマウントする場合、半田付は時の半田溶融によ
り発生する引張力を受は易く、チップ立ち1i!象が起
き易いという問題もある。Furthermore, this break forms a resistor,
Since the external electrode is a three-sided electrode, when it is mounted as a chip on a printed circuit board, it is easy to receive the tensile force generated by solder melting during soldering, and the chip stands 1i! There is also the problem that elephants can easily wake up.
この発明は上記のような従来の抵抗器の問題点に鑑みて
、表裏の判別の必要がなく、実装性のよい抵抗器を提供
することを課題とする。In view of the problems of conventional resistors as described above, it is an object of the present invention to provide a resistor that does not require discrimination between front and back and has good mounting performance.
く課題を解決するための手段〉
この発明は上記のような課題を解決するためになされた
もので、幅と厚みがほぼ等しい絶#i素体の少なくとも
一面に抵抗膜を形成し、その表面を絶縁膜で覆い、両端
に外部電極を設け、隣接する二面に同じ表示を施した抵
抗器を提供するものである。Means for Solving the Problems> This invention has been made to solve the above problems, and consists of forming a resistive film on at least one surface of an absolute element body having approximately the same width and thickness; The present invention provides a resistor in which the resistor is covered with an insulating film, external electrodes are provided at both ends, and the same markings are given on two adjacent surfaces.
〈実施例〉
第1図、第2図は、この発明の実施例を示すもので、1
は幅と厚みがほぼ等しい例えば磁器よりなる絶縁素体で
あり、この絶縁素体1の少なくとも一面に抵抗1g12
を形成し、その表面を電気絶縁13で覆い、更に該絶縁
素体1の両端に外部電極4を設ける。<Example> Figures 1 and 2 show examples of the present invention.
is an insulating body made of, for example, porcelain and has a width and thickness that are approximately equal, and a resistor of 1g12 is provided on at least one surface of this insulating body 1.
is formed, its surface is covered with electrical insulation 13, and external electrodes 4 are provided at both ends of the insulating element body 1.
その後、隣接する二面に同じ表示5を施したものである
。Thereafter, the same display 5 is applied to two adjacent sides.
第3図ないし第10図は、この発明の抵抗器の製造工程
の一例を示すものである。3 to 10 show an example of the manufacturing process of the resistor of the present invention.
第3図に示すものは、アルミナ等からなる第1マスク1
1であって、このマスク11の表面には、複数の角形断
面の凹部12がII横に整然と設けである。What is shown in FIG. 3 is a first mask 1 made of alumina or the like.
1, on the surface of this mask 11, a plurality of recesses 12 having a rectangular cross section are arranged in an orderly manner laterally.
前記の絶縁素体1は例えばアルミナの生シートの状態に
おいて、金型によりチップ形状に打ち抜いた優、焼成し
たもので、さらに必要によりその多数をバレルに入れて
振動させることにより角をとったものである。The insulating element 1 is, for example, a raw sheet of alumina, which is punched into a chip shape using a mold, then fired, and if necessary, a large number of the sheets are placed in a barrel and vibrated to take the corners off. It is.
このような絶縁素体1の多数を該マスク11の各凹部1
2に第4図、第5図のように振り込む。A large number of such insulating elements 1 are placed in each recess 1 of the mask 11.
2 as shown in Figures 4 and 5.
次に該マスク11の表面に、抵抗膜2およびその取出電
極(図示せず)をスクリーン印刷若しくは熱転写により
形成する。Next, the resistive film 2 and its lead electrode (not shown) are formed on the surface of the mask 11 by screen printing or thermal transfer.
そして、マスク11に入れたまま焼成する。その後、抵
抗W12のトリミングを行う。Then, the mask 11 is fired while being placed in the mask 11. Thereafter, the resistor W12 is trimmed.
第6図は前記第1マスクと同様にアルミナ等で作った第
2マスク14であって、このマスク14には三角の断面
の凹部15を該第1マスク11の各凹部12に対向する
位置に設けである。FIG. 6 shows a second mask 14 made of alumina or the like similarly to the first mask, and this mask 14 has recesses 15 having a triangular cross section at positions facing each recess 12 of the first mask 11. It is a provision.
この第2マスク14を前記第1マスク11上に被せて重
ねたまま反転させることによりマスク14を下にすると
第7図のように各絶縁素体1が凹部15内に45°に傾
斜した状態で移しかえられる。 2更に、第8図のよ
うに、該第2マスク14と同じ三角の凹部16を有する
第3マスク17に移しかえる。When this second mask 14 is placed over the first mask 11 and turned over while being overlapped, each insulating element 1 is tilted at 45 degrees in the recess 15 as shown in FIG. 7 when the mask 14 is turned down. It can be moved with 2. Furthermore, as shown in FIG. 8, the mask is transferred to a third mask 17 having the same triangular recess 16 as the second mask 14.
次に、第9図のように、絶縁膜3を有する転写シート1
8を絶縁素体1の抵抗膜2上から隣接する面上に重ねて
加熱した押圧部材19により押圧して絶縁lI3を熱転
写する。Next, as shown in FIG. 9, a transfer sheet 1 having an insulating film 3 is
8 is stacked on the resistive film 2 of the insulating element 1 and on the adjacent surface and pressed by a heated pressing member 19 to thermally transfer the insulating lI3.
更に、第10図のように、該絶縁膜3上に適宜の表示5
を2m5所に隣接して設けた転写シート20を重ねて、
加熱した押圧部@21により押圧して表示5を隣接した
2面に熱転写する。Furthermore, as shown in FIG.
The transfer sheets 20 placed adjacent to each other at 2 m5 locations are stacked,
The display 5 is thermally transferred onto two adjacent surfaces by pressing with the heated pressing section @21.
その後、該処理ずみの絶縁素体1をマスク17から取り
出し、その両端に銀ベース、ト等を塗布して焼成する等
の方法で外部電極4を設けると、第1図、第2図に示す
抵抗器が得られる。Thereafter, the treated insulating element 1 is taken out from the mask 17, and external electrodes 4 are provided by applying a silver base, etc. to both ends thereof and baking, as shown in FIGS. 1 and 2. A resistor is obtained.
さらに必要により外部電極にリード線を接続して、リー
ド線式の抵抗器とすることもできる。Furthermore, if necessary, a lead wire can be connected to the external electrode to form a lead wire type resistor.
く効果〉
この発明の抵抗器は上記の構成を有するものであるから
、次に列記する効果がある。Effects> Since the resistor of the present invention has the above configuration, it has the following effects.
断面が角形で幅と厚みがほぼ等しいものであり、必要に
よりバレルがけすることにより角がとれてRがつき丸に
近い形状になる為、プリント基板への自動マウント機に
おける取扱いが円滑に行なえ、99、9999%以上の
信頼性が得られる。The cross section is rectangular and the width and thickness are almost equal, and if necessary, by barreling, the corners are rounded and the shape is rounded, making it easy to handle with automatic mounting machines for printed circuit boards. Reliability of 99,9999% or more can be obtained.
隣接する二面に表示が施されているので、マウント時に
方向を選別する必要がなくなる。Since the two adjacent sides are marked, there is no need to select the direction when mounting.
従って、プリント基板への自動マウント機での表裏判別
a栴が不要になる。その為、機械のシンプル化、低コス
ト化がはかられると共に、チップ詰まり等が発生し難く
なり高信頼性が得られる。Therefore, there is no need to use an automatic mounting machine to determine the front and back sides of printed circuit boards. Therefore, the machine can be simplified and costs can be reduced, and chip clogging is less likely to occur, resulting in high reliability.
更に、各単体に外部電極を形成するものでやるため、方
面電極とでき、チップとしてプリント基板に半田付けす
る場合、半田の溶融による引張力が分散されてチップ立
ちが生じ難くなる。Furthermore, since external electrodes are formed on each unit, directional electrodes can be formed, and when soldering to a printed circuit board as a chip, the tensile force due to melting of the solder is dispersed, making it difficult for chips to stand up.
第1図はこの発明の抵抗器の実施例を示す斜視図、第2
図は同上の拡大横断正面図、第3図ないし第10図は同
上の@#造工程を示すもので、第3図は第1マスクの一
部切欠斜視図、第4図は第1マスクに絶縁素体を振り込
んだ状態の一部切欠斜視図、第5図は同上の一部の拡大
断面図、第6図は第2マスクの一部切欠斜視図、第7図
は第1マスクから第2マスクへの移しかえを示す一部の
拡大断面図、第8図は第2マスクから第3マスクへの移
しかえを示す一部の拡大断面図、第9図、第10図はそ
れぞれ転写状態を示す一部の拡大断面図である。
1・・・絶縁素体 2・・・抵抗膜 3・・・
絶縁膜4・・・外部電極 5・・・表示
出願人代理人 弁理士 和 1) 昭第1図FIG. 1 is a perspective view showing an embodiment of the resistor of the present invention, and FIG.
The figure is an enlarged cross-sectional front view of the same as above, Figures 3 to 10 show the @# manufacturing process of the same as above, Figure 3 is a partially cutaway perspective view of the first mask, and Figure 4 is a cross-sectional view of the first mask. FIG. 5 is an enlarged sectional view of a portion of the same as above, FIG. 6 is a partially cutaway perspective view of the second mask, and FIG. 7 is a partial cutaway perspective view of the second mask. 8 is an enlarged sectional view of a portion showing the transfer from the second mask to the third mask, and FIGS. 9 and 10 are the transfer state, respectively. FIG. 1... Insulating element 2... Resistive film 3...
Insulating film 4...External electrode 5...Display Applicant's agent Patent attorney Kazu 1) Showa 1
Claims (1)
膜を形成し、その表面を絶縁膜で覆い、両端に外部電極
を設け、隣接する二面に同じ表示を施したことを特徴と
する抵抗器。A resistor characterized in that a resistive film is formed on at least one surface of an insulating element body having approximately the same width and thickness, the surface is covered with an insulating film, external electrodes are provided at both ends, and the same marking is applied to two adjacent surfaces. vessel.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63037959A JPH01212401A (en) | 1988-02-19 | 1988-02-19 | Resistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63037959A JPH01212401A (en) | 1988-02-19 | 1988-02-19 | Resistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01212401A true JPH01212401A (en) | 1989-08-25 |
Family
ID=12512096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63037959A Pending JPH01212401A (en) | 1988-02-19 | 1988-02-19 | Resistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01212401A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0396001U (en) * | 1990-01-24 | 1991-10-01 |
-
1988
- 1988-02-19 JP JP63037959A patent/JPH01212401A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0396001U (en) * | 1990-01-24 | 1991-10-01 |
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