JPH01199443A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPH01199443A JPH01199443A JP63022790A JP2279088A JPH01199443A JP H01199443 A JPH01199443 A JP H01199443A JP 63022790 A JP63022790 A JP 63022790A JP 2279088 A JP2279088 A JP 2279088A JP H01199443 A JPH01199443 A JP H01199443A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- ball
- load
- capillary
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000006073 displacement reaction Methods 0.000 claims description 13
- 238000001514 detection method Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 abstract description 3
- 238000003825 pressing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4941—Connecting portions the connecting portions being stacked
- H01L2224/4942—Ball bonds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、配線基板および半導体のワイヤボンディング
装置に係り、特に単一の電極への複数本の導電線の接合
、および接合強度の安定性向上に好適なワイヤボンディ
ング装置に関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a wire bonding device for wiring boards and semiconductors, and particularly relates to bonding of a plurality of conductive wires to a single electrode and stability of bonding strength. The present invention relates to a wire bonding device suitable for improvement.
従来の技術については、特開昭５６−３０７３５号公報
および特開昭５８−９８９３７号公報などに記載されて
いるように、ボンディング時において、荷重の制御を目
ざしていたが、導電線の先端のボールの変形量に関して
は必ずしも制御されていなかった。Regarding conventional techniques, as described in JP-A-56-30735 and JP-A-58-98937, the aim was to control the load during bonding; The amount of deformation of the ball was not necessarily controlled.
上記従来技術では、ボンディングの際の荷重を制御して
いたが、ボールの変形量を制御して、常に一定の変形量
を与えるような配慮がないために、前記変形量の不均一
に基づく接合強度の不安定性という点に問題があった。In the above conventional technology, the load during bonding is controlled, but since there is no consideration to control the amount of deformation of the ball and always give a constant amount of deformation, bonding based on the unevenness of the amount of deformation There was a problem with instability of strength.
特に、単一の電極へ複数の線材の端部（ボール）を積重
ねて接合する（以下、多重ボンディングという）場合に
は、接合部の形状が一定とならず、良好な接合が得られ
なかった。In particular, when stacking and bonding the ends (balls) of multiple wires to a single electrode (hereinafter referred to as multiple bonding), the shape of the bonded part is not constant, making it difficult to obtain a good bond. .
本発明の目的は、このようなボンディング時。The purpose of the present invention is to solve the problem of such bonding.
特に、単一の電極への多重ボンディングにおけるボール
変形量の不均一に起因する接合強度の不安定性を解決し
て、常に安定したボンディングができるようなワイヤボ
ンディング装置を提供することである。In particular, it is an object of the present invention to provide a wire bonding device that can always perform stable bonding by solving the instability of bonding strength caused by non-uniform ball deformation in multiple bonding to a single electrode.
（ａｌｌ！を解決するための手段〕
上記課題を解決するための本発明に係るワイヤボンディ
ング装置の構成は、導電線の先端に形成されたボールを
、キャピラリもしくはボンディングツールによって電極
上へ熱圧着するようにしたワイヤボンディング装置にお
いて、熱圧着の初期に、キャピラリもしくはボンディン
グツールとボールと電極とが接触状態になったことを検
知することができる接触検出装置と、そのボールに、前
記状態から、予め設定した荷重、変形量を与えることが
できる負荷装置と前記接触検出装置から接触信号を入力
したとき、前記負荷装置をＯＮにすることができる制御
装置とを具備するようにしたものである。(Means for solving all!) The structure of the wire bonding apparatus according to the present invention for solving the above problems is to thermocompress a ball formed at the tip of a conductive wire onto an electrode using a capillary or a bonding tool. In the wire bonding apparatus, the contact detection device is capable of detecting that the capillary or the bonding tool is in contact with the ball and the electrode at the initial stage of thermocompression bonding, and the ball is provided with a The load device is equipped with a load device that can apply a set load and deformation amount, and a control device that can turn on the load device when a contact signal is input from the contact detection device.
さらに詳しくは、ボンディング装置に、ボンディングツ
ールあるいはキャピラリを低荷重の下にボールに向けて
駆動すると共に、それ等がボールに接触したことを検出
する機構及びボンディングツール等がボールに接触した
後、最適荷重の下に予め定められた量だけボールを変形
させる機構を設けるよ゛うにしたものである。すなわち
、配線基板上の電極にボールを接触し、接合するキャピ
ラリを一端に保持し、支点を介して他端側に揺動カムロ
ーラ、ばね、ストッパを保有する揺動アームは１本装置
の制御装置によって制御されている。More specifically, the bonding device includes a mechanism that drives the bonding tool or capillary toward the ball under a low load and detects when the bonding tool or capillary comes into contact with the ball. A mechanism is provided to deform the ball by a predetermined amount under load. In other words, there is only one swing arm that contacts the electrode on the wiring board, holds the capillary to be joined at one end, and has a swing cam roller, spring, and stopper at the other end via a fulcrum. controlled by.
キャピラリ先端部のボールが電極に接触した瞬間に接触
検出装置が、それを検出し、制御装置に伝達する。制御
装置は、予め指定された荷重でボールを押圧する。この
際の押圧力はシリンダによるばね力とパルスモータを介
したストッパとの調整によって、所定の値をとることが
できる。例えば、キャピラリ先端のボールの変位量をδ
と設定すれば、ストッパと揺動アームとのギャップの変
位量δ０をδ に相当するように調整しておけばよい。The moment the ball at the tip of the capillary comes into contact with the electrode, the contact detection device detects this and transmits it to the control device. The control device presses the ball with a prespecified load. The pressing force at this time can be set to a predetermined value by adjusting the spring force of the cylinder and the stopper via the pulse motor. For example, the displacement of the ball at the tip of the capillary is δ
If it is set, the amount of displacement δ0 of the gap between the stopper and the swing arm may be adjusted to correspond to δ.
制御装置に、予め所定の押圧力、ボールの変位量を指示
してやれば、常にボールを一定量だけ変位させることが
できるので、均一な形状で、接合強度の一定な接合が得
られる。By instructing the control device in advance with a predetermined pressing force and displacement amount of the ball, the ball can always be displaced by a certain amount, so that a bond with a uniform shape and constant bonding strength can be obtained.
以下本発明の一実施例を、第１図〜第６図を用いて説明
する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 6.
第１図は、本発明の一実施例に係るワイヤボンディング
装置の構成を示す縦断面図、第２図は、第１図のボンデ
ィング個所の単層のボール（キャピラリによる）の接合
部の変位量を示す拡大断面図、第３図は、第１図のボン
ディング個所の２層のボール（ボンディングツールによ
る）の接合部の変位量を示す拡大断面図、第４図は、第
１図のワイヤボンディング装置の動作の第１段階を示し
。FIG. 1 is a vertical cross-sectional view showing the configuration of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a displacement amount of the bonded portion of the single-layer ball (by the capillary) at the bonding location shown in FIG. FIG. 3 is an enlarged cross-sectional view showing the amount of displacement of the bonding part of the two layers of balls (by the bonding tool) at the bonding location in FIG. 1, and FIG. 4 is the wire bonding shown in FIG. 1. 1 shows the first stage of operation of the device.
揺動アーム（後述する）先端のキャピラリまたはボンデ
ィングツールが、配線基板または半導体装置の上方に位
置した状態の断面略示図、第５図は、同上の第２段階を
示し、キャピラリ等が、配線基板面等と接触した位置の
断面略示図、第６図は、同上の第３段階を示し、キャピ
ラリ等の先端のボールが所定量だけ変形し、配線基板面
等と接合した位置の断面略示図である６
本実施例における構成を第１図〜第３図を用いて説明す
る。FIG. 5 is a schematic cross-sectional view showing a state in which a capillary or a bonding tool at the tip of a swinging arm (described later) is positioned above a wiring board or a semiconductor device, and shows the second stage of the same, in which the capillary, etc. FIG. 6 is a schematic cross-sectional view of the position where it contacts the board surface, etc., showing the third stage of the same as above, and the ball at the tip of the capillary etc. is deformed by a predetermined amount and is a schematic cross-sectional view of the position where it joins with the wiring board surface, etc. 6 The configuration of this embodiment will be described with reference to FIGS. 1 to 3.
第１図において、１および２は夫々キャピラリおよびボ
ンディングツールであり、導電線先端のボールを電極面
に熱圧着させる治具である。３は、枠構造物２０上に付
設された支持台の支点を中心に移動することができる揺
動アームであり、その一端にはキャピラリ１またはボン
ディングツール２（以下、キャピラリ１で代表する）を
保持し、他端側には揺動カム４のローラ受部、シリンダ
５（詳細後述）に連なるばね６の係止部が設けられてい
る。４は、偏心回転する揺動カムであり、この揺動カム
が、前記ローラ受部と当接して、揺動アーム３を駆動す
ることができるようになっている。前記シリンダ５は、
下端が前記係止部にとめられた引張りばね６の上端を、
そのロッドの先端に引掛け、前記ロッドの上下動にとも
ない、引張りばね６に所定の引張力を負荷することがで
きるようになっている。７は、その送りねじ８の回転に
よってこれと噛み合うストッパ１９を上下動させること
により、揺動アーム３の揺動ストロークを制限する柔と
ができるパルスモータである。In FIG. 1, numerals 1 and 2 are a capillary and a bonding tool, respectively, which are jigs for thermocompression bonding the ball at the tip of the conductive wire to the electrode surface. 3 is a swinging arm that can move around the fulcrum of a support mounted on the frame structure 20, and a capillary 1 or a bonding tool 2 (hereinafter referred to as capillary 1) is attached to one end of the swinging arm. The other end thereof is provided with a roller receiving portion of the swing cam 4 and a locking portion of a spring 6 connected to the cylinder 5 (details will be described later). Reference numeral 4 denotes a swinging cam that rotates eccentrically, and this swinging cam can drive the swinging arm 3 by coming into contact with the roller receiving portion. The cylinder 5 is
The upper end of the tension spring 6 whose lower end is fixed to the locking part,
It is hooked onto the tip of the rod, and a predetermined tensile force can be applied to the tension spring 6 as the rod moves up and down. Reference numeral 7 designates a pulse motor that can be used to limit the swing stroke of the swing arm 3 by vertically moving a stopper 19 that engages with the feed screw 8 as the feed screw 8 rotates.
９は、揺動アーム３に保持されたキャピラリと、配線基
板１５または半導体装置１４（以下、配線基板で代表す
る）との接触状況を、即刻捕捉するための接触検出装置
であり、これにより、キャピラリ１先端に位置する導電
線のボールが第２図゛ （Ａ）または第３図（Ａ）の状
態になった瞬間に、これを検出することができる。１０
は、接触検出装置９からの、キャピラリとボールと電極
１６とが接触状態になったという信号を入力したとき、
その信号を、シリンダ５．パルスモータ７へ出力し、ば
ね６を高い引張力の状態にするとともに、前記ボールに
所定量δだけの変形を与えることができるように揺動ア
ーム３の揺動ストローク量を制限する位置へ、ストッパ
１９を位置ぎめすることができる制御装置である。Reference numeral 9 denotes a contact detection device for instantly detecting the contact status between the capillary held by the swinging arm 3 and the wiring board 15 or the semiconductor device 14 (hereinafter referred to as the wiring board). The moment the ball of the conductive wire located at the tip of the capillary 1 reaches the state shown in FIG. 2(A) or FIG. 3(A), this can be detected. 10
When inputting a signal from the contact detection device 9 indicating that the capillary, ball, and electrode 16 are in contact,
The signal is sent to cylinder 5. output to the pulse motor 7 to place the spring 6 in a high tension state and to a position where the swing stroke amount of the swing arm 3 is limited so that the ball can be deformed by a predetermined amount δ; This is a control device that can position the stopper 19.
配線基板１５上の電極１６と、ボールを介して接合する
ための導電線１３は、枠構”進物２０の上部に取付けら
れた導電線リレー（図示せず）からキャピラリ１直上に
位置するズプール１２を経て、キャピラリ１に送り出さ
れ、配線基板１５上の電極１６に熱圧着法によって接合
できるようになっている。この配線基板１５は、フレー
ム１７に付設されたＸＹ子テーブル８上に保持されてい
る。A conductive wire 13 for connecting an electrode 16 on a wiring board 15 via a ball is connected to a conductive wire relay (not shown) attached to the top of a frame structure 20 to a pulley 12 located directly above the capillary 1. After that, it is fed into the capillary 1 and can be bonded to the electrode 16 on the wiring board 15 by thermocompression bonding.The wiring board 15 is held on the XY child table 8 attached to the frame 17. There is.
さらに、クレーム１７上には、前記枠構、進物２０も組
込まれている。Furthermore, claim 17 also incorporates the framework and gift 20.
つぎに、本実施例の動作について、主として第４図〜第
６図を用いて説明する。Next, the operation of this embodiment will be explained using mainly FIGS. 4 to 6.
第４図は、動作の第１段階の状態を示すものである。ま
ず、スイッチを入れると、制御装置１０が作動し、その
指示に従ってシリンダ５を介してばね６に弱い張力が加
わる。揺動カム４は揺動アーム側のカムローラと接触し
た状態を保ち、揺動アーム３の先端にあるキャピラリ１
は、ばね６による力により、揺動カム４で支えられなが
ら、揺動アーム３の支点を軸に、若干上方へ上る。配線
基板１５上の電極１６の上に位置をとるキャピラリ１と
電極１６とは離れた状態にある。FIG. 4 shows the state of the first stage of operation. First, when the switch is turned on, the control device 10 operates, and a weak tension is applied to the spring 6 via the cylinder 5 according to its instructions. The swing cam 4 maintains contact with the cam roller on the swing arm side, and the capillary 1 at the tip of the swing arm 3
is supported by the swing cam 4 due to the force of the spring 6, and rises slightly upward about the fulcrum of the swing arm 3. The capillary 1 positioned above the electrode 16 on the wiring board 15 and the electrode 16 are separated from each other.
第５図は、第２段階の状態を示すものである。FIG. 5 shows the state of the second stage.
制御装置１０からの信号を受けて、シリンダ５を介して
ばね６にやや強い張力を加えると同時に、揺動カム４は
矢印方向に回転して、静かに揺動アーム側のカムローラ
から離れるように作動して、揺動アーム３の先端部にあ
るキャピラリ１のボールは配線基板１５」二の電極１Ｇ
に接触し、第２図（Ａ）、第３図（Ａ）のような状態と
なる。その瞬間に、接触検出装置９は、この接触状態を
検出し、制御装置１１１０が先の信号を受けて、第６図
に示すように、シリンダ５を矢印の方向に作動させて、
ばね６により上向きの強い張力を与えて、支点を介して
（揺動カムは離れた状態のまま）揺動アーム３の他端に
下向きの力を与えるので、その先端部キャピラリ１のボ
ールは所定の荷重（予め制御装置に指示した最適な値）
により押圧されて電極１６面に接合される。これと同時
に、制御装置１０からの信号をパルスモータフに伝え、
送りねじ８を介してストッパ１９を下方に移動させ、揺
動アーム３とストッパ１９とのギャップδ０が、キャピ
ラリ１の先端のボールの変位δに相当する変位となるよ
うにする。第２図（Ａ）、（Ｂ）に示すように、ボール
の変位量δとストッパ１９側から与えるδ０の関係は、
予め十分に調整をとり、制御装置１０に指示しておくこ
とによって、所期の目的値を得ることができる。以上の
第１段階（第４図）、第２段階（第５図）、第３段階（
第６図）の動作を繰返して実施することにより、予め設
定した一定量δだけボールを変形させた状態での接合が
継続して実施されることになる。Upon receiving a signal from the control device 10, a rather strong tension is applied to the spring 6 via the cylinder 5, and at the same time, the swing cam 4 rotates in the direction of the arrow and gently moves away from the cam roller on the swing arm side. When activated, the ball of the capillary 1 at the tip of the swinging arm 3 connects the wiring board 15'' to the second electrode 1G.
2 (A) and 3 (A). At that moment, the contact detection device 9 detects this contact state, and the control device 1110 receives the previous signal and operates the cylinder 5 in the direction of the arrow as shown in FIG.
A strong upward tension is applied by the spring 6, and a downward force is applied to the other end of the swinging arm 3 via the fulcrum (while the swinging cam remains separated), so that the ball of the capillary 1 at its tip is held in a predetermined position. load (optimal value instructed to the control device in advance)
is pressed and bonded to the electrode 16 surface. At the same time, a signal from the control device 10 is transmitted to the pulse motor,
The stopper 19 is moved downward via the feed screw 8 so that the gap δ0 between the swing arm 3 and the stopper 19 becomes a displacement corresponding to the displacement δ of the ball at the tip of the capillary 1. As shown in FIGS. 2(A) and (B), the relationship between the displacement amount δ of the ball and δ0 given from the stopper 19 side is as follows:
By making sufficient adjustments in advance and instructing the control device 10, the desired target value can be obtained. The above first stage (Fig. 4), second stage (Fig. 5), and third stage (
By repeating the operation shown in FIG. 6), welding can be continued with the ball deformed by a preset amount δ.
一方、ＸＹ子テーブル８上に設定された配線基板１５上
の電極１６は、予め与えられたプログラムにしたがって
、逐次Ｘ、Ｙ方向に移動することによって、新しいボー
ルが逐次、次の電極１６へ接合されて、すべての電極１
６への接続を終了したとき、ワイヤボンディング装置が
ＯＦＦになる。On the other hand, the electrodes 16 on the wiring board 15 set on the XY child table 8 are sequentially moved in the X and Y directions according to a predetermined program, so that new balls are sequentially joined to the next electrodes 16. and all electrodes 1
6, the wire bonding device is turned off.
本実施例における効果としては、
（１）ボールの変位量δと押圧力を、予め任意に設定し
、制御装置内に記憶させておけば、常に一定形状の表面
積の接合点が得°られるので、安定した電流および接合
強度の接合点が提供できる。The effects of this embodiment are as follows: (1) If the displacement amount δ and the pressing force of the ball are arbitrarily set in advance and stored in the control device, a joining point with a constant shape of surface area can always be obtained. , can provide a junction with stable current and bond strength.
（２）第３図に示すように、単一の電極への多重ボンデ
ィングを行なう場合には、制御装置への指示により、常
に安定した、一定形状の接合ができる。(2) As shown in FIG. 3, when performing multiple bonding to a single electrode, stable bonding in a constant shape can always be achieved by instructions to the control device.
その他に、単一の電極へ複数の線材のボールを積重ねて
接合する場合にも、第３図（Ａ）。In addition, when a plurality of wire balls are stacked and bonded to a single electrode, the method shown in FIG. 3(A) is used.
（Ｂ）に示すように、電極に接合した１層目のボール上
に重ねて、ボンディングツールで２層目のボールを接合
する場合にも、予め制御装置１０上に押圧力、ボールの
変位量を指示しておけば、上記と同様な動作によって、
接合部形状を均一なものとすることができる。As shown in (B), even when bonding the second layer of balls using a bonding tool over the first layer of balls bonded to the electrode, the pressing force and the amount of ball displacement are preliminarily set on the control device 10. If you specify
The joint shape can be made uniform.
なお、第３図に示すような多重ボンディングの場合には
、制御装置に指示して、各ボール毎に変位量δの異った
値とすることもできる。In the case of multiple bonding as shown in FIG. 3, the control device can be instructed to set the displacement δ to a different value for each ball.
さらに、本実施例では、負荷の方法として、１つのばね
の強弱によって行なったが、ばね力の異なる２つのばね
の引張力を相互に組合わせて作用させる方法を用いるこ
ともできる。Further, in this embodiment, the loading method is performed by applying the strength of one spring, but it is also possible to use a method in which the tensile forces of two springs having different spring forces are combined with each other.
本発明によれば、接合部の形状を予め定めた、バラツキ
の少ない均一なものとすることができるので、同一電極
に複数の線材を積重ねて接合する。According to the present invention, the shape of the bonding portion can be predetermined and uniform with little variation, so a plurality of wire rods are stacked and bonded to the same electrode.
多重ボンディングの場合にも良好な接合を得ることがで
きるので、配線基板の高密度実装を可能にす・るという
効果がある。また、ボールの変形量の制御と接合のため
の加圧の制御とを分離することができるので、接合面積
の安定化、接合加圧条件の最適化が可能となり、安定し
た接合強度を得ることができる。Since good bonding can be obtained even in the case of multiple bonding, it has the effect of enabling high-density mounting of wiring boards. Furthermore, since it is possible to separate the control of the amount of deformation of the ball from the control of the pressure applied for bonding, it is possible to stabilize the bonding area and optimize the bonding pressure conditions, thereby achieving stable bonding strength. Can be done.
以上要するに、ボンディングの際に、特に、単一の電極
への多重ボンディングにおけるボール変形量の不均一に
起因する接合強度の不安定性を解決して、常に安定した
ボンディングができるようなワイヤボンディング装置を
提供することができる。In summary, we have created a wire bonding device that can always perform stable bonding by solving the instability of bonding strength caused by uneven ball deformation during bonding, especially in multiple bonding to a single electrode. can be provided.
第１図は、本発明の一実施例に係るワイヤボンディング
装置の構成を示す縦断面図、第２図は。
キャピラリボンディング（単層）のボール接合部の変位
量を示す拡大断面図、第３図は、ボンディングツールに
よる２層ボンディングのボール接合部の変位量を示す拡
大断面図、第４図は、第１図のワイヤボンディング装置
の動作の第１段階（ボール未接触）状態の断面略示図、
第５図は、同上の第２段階（ボール接触）状態の断面略
示図、第６図は、同上の第３段階（ボール接合）状態の
断面略示図である。
１・・・キャピラリ、２・・・ボンディングツール、３
・・・揺動アーム、６・・・ばね、９・・・接触検出装
置、１０・・・制御装置、１３・・・導電線、１４・・
・半導体装置、１５・・・配線基板、１６・・・電極、
１９・・・ストッパ。FIG. 1 is a longitudinal sectional view showing the configuration of a wire bonding apparatus according to an embodiment of the present invention, and FIG. FIG. 3 is an enlarged sectional view showing the amount of displacement of the ball joint in capillary bonding (single layer); FIG. A schematic cross-sectional view of the first stage (ball non-contact) state of the operation of the wire bonding device shown in FIG.
FIG. 5 is a schematic cross-sectional view of the second stage (ball contact) state of the same as above, and FIG. 6 is a schematic cross-sectional view of the third stage (ball bonding) state of the same. 1... Capillary, 2... Bonding tool, 3
... Swinging arm, 6... Spring, 9... Contact detection device, 10... Control device, 13... Conductive wire, 14...
・Semiconductor device, 15... Wiring board, 16... Electrode,
19...stopper.
Claims (1)
しくはボンディングツールによつて電極上へ熱圧着する
ようにしたワイヤボンディング装置において、熱圧着の
初期に、キャピラリもしくはボンディングツールとボー
ルと電極とが接触状態になつたことを検知することがで
きる接触検出装置と、そのボールに、前記状態から、予
め設定した荷重、変形量を与えることができる負荷装置
と前記接触検出装置から接触信号を入力したとき、前記
負荷装置をＯＮにすることができる制御装置とを具備し
たことを特徴とするワイヤボンディング装置。 ２、負荷装置を、キャピラリもしくはボンディングツー
ルとボールと電極とが接触状態になつたときは、接触検
出装置からの信号を受けた制御装置の指示により、揺動
アームを制御できるシリンダを作動させて、ばねに弱い
荷重を与え、また、熱圧着による接合には、前記制御装
置の指示により、前記シリンダを介して前記ばねに強い
荷重を与えると同時に、パルスモータを駆動してストッ
パにより、所定の変位をボールに与えることができる負
荷装置にしたことを特徴とする特許請求の範囲第１項記
載のワイヤボンディング装置。[Claims] 1. In a wire bonding device that thermocompresses a ball formed at the tip of a conductive wire onto an electrode using a capillary or a bonding tool, at the beginning of thermocompression bonding, the capillary or bonding tool a contact detection device capable of detecting that a ball and an electrode are in a contact state, a load device capable of applying a preset load and deformation amount to the ball from the state, and the contact detection device A wire bonding device comprising: a control device capable of turning on the load device when a contact signal is input from the wire bonding device. 2. When the load device is in contact with the capillary or bonding tool, the ball, and the electrode, the cylinder that can control the swinging arm is operated according to instructions from the control device that receives a signal from the contact detection device. , a weak load is applied to the spring, and for joining by thermocompression, a strong load is applied to the spring via the cylinder according to instructions from the control device, and at the same time, a pulse motor is driven to set a stopper to a predetermined value. The wire bonding device according to claim 1, characterized in that the wire bonding device is a load device that can apply displacement to the ball.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63022790A JPH0783039B2 (en) | 1988-02-04 | 1988-02-04 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63022790A JPH0783039B2 (en) | 1988-02-04 | 1988-02-04 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01199443A true JPH01199443A (en) | 1989-08-10 |
| JPH0783039B2 JPH0783039B2 (en) | 1995-09-06 |
Family
ID=12092476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63022790A Expired - Lifetime JPH0783039B2 (en) | 1988-02-04 | 1988-02-04 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783039B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998031498A1 (en) * | 1997-01-22 | 1998-07-23 | Equilasers, Inc. | Laser-driven microwelding apparatus and process |
| KR100632258B1 (en) * | 2005-01-14 | 2006-10-12 | 우리마이크론(주) | Sample tester for semiconductor |
| KR100823015B1 (en) * | 2001-09-27 | 2008-04-17 | 주식회사 포스코 | Mash-seam Welding Parts Continuity Test Apparatus |
| JP2008130863A (en) * | 2006-11-22 | 2008-06-05 | Nichia Chem Ind Ltd | Semiconductor device, and manufacturing method therefore |
| JP2009152480A (en) * | 2007-12-21 | 2009-07-09 | Shinapex Co Ltd | Wire bonding device |
| US8476726B2 (en) | 2009-04-30 | 2013-07-02 | Nichia Corporation | Semiconductor device and method of manufacturing the semiconductor device |
| US11004821B2 (en) * | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire bonding method and wire bonding apparatus |
-
1988
- 1988-02-04 JP JP63022790A patent/JPH0783039B2/en not_active Expired - Lifetime
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1998031498A1 (en) * | 1997-01-22 | 1998-07-23 | Equilasers, Inc. | Laser-driven microwelding apparatus and process |
| US5938952A (en) * | 1997-01-22 | 1999-08-17 | Equilasers, Inc. | Laser-driven microwelding apparatus and process |
| KR100823015B1 (en) * | 2001-09-27 | 2008-04-17 | 주식회사 포스코 | Mash-seam Welding Parts Continuity Test Apparatus |
| KR100632258B1 (en) * | 2005-01-14 | 2006-10-12 | 우리마이크론(주) | Sample tester for semiconductor |
| JP2008130863A (en) * | 2006-11-22 | 2008-06-05 | Nichia Chem Ind Ltd | Semiconductor device, and manufacturing method therefore |
| JP2009152480A (en) * | 2007-12-21 | 2009-07-09 | Shinapex Co Ltd | Wire bonding device |
| US8476726B2 (en) | 2009-04-30 | 2013-07-02 | Nichia Corporation | Semiconductor device and method of manufacturing the semiconductor device |
| US9281457B2 (en) | 2009-04-30 | 2016-03-08 | Nichia Corporation | Semiconductor device and method of manufacturing the semiconductor device |
| US11004821B2 (en) * | 2016-08-23 | 2021-05-11 | Shinkawa Ltd. | Wire bonding method and wire bonding apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0783039B2 (en) | 1995-09-06 |
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