JP2001060309A - Thin-film magnetic head device having shorting part for preventing electrostatic breakdown, formation of this shorting part and device forming this shorting part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to form a shorting part for preventing electrostatic breakdown at a proper point of lead printed wiring of a thin-film magnetic head device and to easily separate or disconnect this shorting part with simple operation. SOLUTION: This thin-film magnetic head device has the shorting part 17 in conductor portions 15c existing in proximity to each other of a portion of the lead printed wiring 15 led out of a slider provided with a magneto-resistive head element and is used by separating the shorting part 17 by heating or cutting. The shorting part 17 is formed by compression deforming a pair of solder bumps 17a and 17b previously fixed to the conductor portions 15c and partially superposing and joining these solder bumps to each other.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin-film magnetic head device having a short-circuit portion for preventing electrostatic breakdown, a forming method for forming the short-circuit portion, and a forming device for forming the short-circuit portion. .

[0002]

2. Description of the Related Art As one type of a thin film magnetic head device provided with an MR type head element, a GMR type head element and the like, there is a thin film magnetic head apparatus having a short-circuit portion for preventing electrostatic breakdown.

The thin-film magnetic head device of this type is arranged close to each other between an output lead terminal provided on a lead print wiring drawn from a slider of a head element and a terminal for measuring characteristics of the head element. A short-circuit portion is provided between conductors of a printed wiring by soldering or gold bonding. This short-circuit portion is connected to an output lead terminal with an amplifier or the like in an assembling step of a final product, and then cut and used.

Generally, in a thin film magnetic head device,
In the process of assembling the thin-film magnetic head device, which is the final product, the static electricity charged to the worker may cause electrostatic damage to the head element. Measures have been taken to prevent electrostatic discharge of the head element by providing a resistor or a diode for short-circuiting static electricity between the terminals of the head element, but in the assembly process, it is still caused by static electricity charged to the operator. Frequent occurrence of electrostatic breakdown in the head element. The thin-film magnetic head device of the type described above is provided with a short circuit portion between the conductors of the printed wiring, thereby preventing the electrostatic breakdown of the head element which occurs in the assembly process of the final product. It is useful.

However, in the thin-film magnetic head device of the type described above, the short-circuit portion on the lead print wiring is formed by soldering or gold bonding. There is a drawback that the printed wiring is adversely affected due to adhesion of gas or gas generated from a synthetic resin such as polyimide resin which is a material of the printed wiring board, and it is not easy to cut a short-circuited portion when used for use. .

The present applicant has filed a thin-film magnetic head device capable of solving these problems in Japanese Patent Application No. 11-124960 (prior application). The thin-film magnetic head device is a thin-film magnetic head device in which a short-circuit portion is provided in a conductor portion arranged close to each other on a part of an output wiring drawn from a slider provided with a magnetoresistive head element, Is formed by pressing and deforming a pair of conductive substances fixed in advance to each conductor part and joining them.

[0007]

In the thin-film magnetic head device according to the above-mentioned prior application, the short-circuit portion is formed by pressing and deforming a pair of conductive materials by a press head. It is important to ensure that the joints are pressed and deformed, and the joint state of the two conductive substances is not perfect, or the joint state is weak and the two conductive substances separate with a slight stress In this case, electrical conduction at the short-circuited portion is hindered, and the effect of preventing electrostatic breakdown is insufficient.

FIG. 10 is an explanatory view schematically showing a forming method which is a comparative example of the forming method according to the present invention. In this forming method, a conductive material is formed by using a press head 25B shown in FIG. The two solder bumps 17a, 17b are simultaneously pressed to obtain the solder bumps 17a, 17b.
17b are simultaneously pressed and deformed to form the short-circuit portion 17E. In this forming method, both solder bumps 17a, 1
7b are simultaneously pressed and deformed by simultaneously pressing to form the short-circuit portion 17E. When such a molding method is adopted, the formed short-circuit portion 17E has the two solder bumps 17a and 17b developed in a plate shape as shown in FIG. The bonding state is established, the bonding portion is incomplete, the bonding strength is insufficient, the electrical conduction at the short-circuit portion 17E is insufficient, and the electrical conduction is impossible.

Accordingly, an object of the present invention is to provide a thin-film magnetic head device of the type according to the prior application, in which the two conductive materials constituting the short-circuit portion are securely joined to each other, and the short-circuit is highly reliable in electrical conduction. Providing a thin film magnetic head device having a portion,
It is still another object of the present invention to provide a forming method for forming the short-circuit portion and a forming apparatus for forming the short-circuit portion.

[0010]

SUMMARY OF THE INVENTION The present invention relates to a thin-film magnetic head device having a short-circuit portion for preventing electrostatic breakdown, a method of forming the short-circuit portion, and an apparatus for forming the short-circuit portion.

Thus, the thin-film magnetic head device according to the present invention has a short-circuit portion in a portion of the output wiring extending from the slider on which the magnetoresistive head element is provided, which is located close to each other. A thin-film magnetic head device in which the short-circuited portion is separated by heating or cutting and used for use, wherein the short-circuited portion presses and deforms a pair of conductive substances previously fixed to the conductor portion, thereby causing the short-circuited portion to be deformed. It is characterized by being configured to be joined in a partially overlapped state.

Further, a method of forming a short-circuit portion according to the present invention comprises:
A forming method for forming a short-circuit portion of a thin-film magnetic head device according to the present invention, the forming method comprising: pressing one of the pair of conductive materials; The conductive material is pressed and deformed, and a part of the other conductive material is overlapped and joined onto the pressed product of the one conductive material.

Further, the apparatus for forming a short-circuit portion according to the present invention comprises:
A forming device for forming a short-circuit portion of a thin-film magnetic head device according to the present invention, the forming device includes a slide base supported slidably in a vertical direction on a support standing on a base, and a slide base. A drive unit for performing a sliding operation in a vertical direction, and a press head provided on the slide base side and moving forward and backward with respect to each conductive material of the conductor portion disposed on the bed by the sliding operation of the slide base. It is characterized by the following.

[0014]

According to the thin-film magnetic head device of the present invention, since the two conductive substances constituting the short-circuit portion are pressed and deformed and are joined in a partially overlapped state, The short-circuit portion has a perfect connection state and high reliability of electrical conduction. As a result, in the thin-film magnetic head device, the above-mentioned various problems caused by the incomplete connection state of the short-circuit portion or the separation of the two conductive substances with a small stress due to the weak connection state are solved. be able to.

In the thin-film magnetic head device according to the present invention, bumps can be employed as the respective conductive substances. The term “bump” refers to a plateau-shaped or raised conductor-shaped portion intended for connection on a component mounting pattern or a lead wire of a printed wiring board. In the present invention, the conductive material forming the conductor-shaped portion is referred to as a bump. Means substance. Specific examples of the bumps include solder bumps formed by covering solder in a spherical or hemispherical shape with Ni or Au as a nucleus, bumps made of a paste such as NiAg, and bumps made of a silver paste. In these cases, the atmosphere in the step of pressing and deforming both conductive materials may be a non-oxidizing gas atmosphere such as a nitrogen atmosphere or an unoxidized gas atmosphere in order to prevent the formation of an oxide film on the surfaces of the pressed and deformed conductive materials. It is preferable to use an active gas atmosphere or the like.

According to the method of forming a short circuit portion according to the present invention,
Pressing and deforming one conductive material of both conductive materials,
Then, the other conductive material is pressed and deformed, and a part of the other conductive material is overlapped and joined to the pressed product of one conductive material. The bonding of the active substances is complete.

When the two conductive materials are simultaneously pressed and deformed, the pressed and deformed two conductive materials are liable to form a bonding state in which their side surfaces are brought into contact with each other. Although it is in an incomplete state, in the forming method according to the present invention, since both conductive materials are separately pressed and deformed, the other conductive material is pressed and deformed and largely expanded in a plane. On the conductive material, it is pressed and deformed and superposed in a state where it is largely expanded in a plane, and it is surely superimposed on each other, so that a short circuit part with high reliability of electrical conduction is formed. You.

In the method of forming a short-circuit portion according to the present invention, a method of pressing and deforming each conductive material from above can be adopted as a basic method. A method of pressing and deforming from above with a pressing force applied in the lateral direction, and a method of pressing and deforming at least one of the conductive materials while maintaining a predetermined angle with respect to the conductor portion are employed. be able to. According to these methods, at least one of the two conductive substances can be further expanded in the lateral direction, and the two conductive substances can be more reliably polymerized and joined.

Further, in the method of forming a short-circuit portion according to the present invention, a method of pressing and deforming both conductive materials and joining them in a state of being overlapped with each other, and further pressing and deforming the both conductive materials in the joined state. Can be adopted. According to this method, the joining of the two conductive substances that have been once overlapped and joined can be further assured.

According to the apparatus for forming a short circuit portion according to the present invention,
By the sliding operation of the slide base by the driving means, each conductive material fixed to the conductor portion arranged on the bed is alternately pressed and deformed by the press head, and the other conductive material is pressed and deformed. It can be superimposed on one conductive material that has been greatly expanded in a plane and pressed and deformed, and can be superimposed in a state where it has been greatly expanded in a plane. It is possible to form a short circuit portion having high property.

In the apparatus for forming a short-circuit portion according to the present invention, the bed is configured to be movable in the direction in which both conductive substances are arranged in series, and the movable arm having the press head supported on the slide base so as to be vertically rotatable. In this case, providing an adjusting means for adjusting the facing angle of the movable arm with respect to the slide base, providing a press surface of the press head with a smooth surface parallel to the conductor portion receiving surface of the bed, and a conductor portion of the bed. Various types such as a smooth surface inclined at a predetermined angle on the receiving surface, a flat surface having a groove in these smooth surfaces, or a curved surface, and a structure having a shock absorber for regulating the descending operation of the slide base, etc. A configuration can be employed. By appropriately employing these configurations, the above-described forming method according to the present invention can be suitably performed.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 shows a head gimbal assembly (Head Gimba) which is an example of a thin film magnetic head device according to the present invention.
l assembly) 10. The head gimbal assembly 10 (hereinafter, referred to as a thin-film magnetic head device) includes an MR type or GMR type head element 13 fixed to a distal end portion of a flat suspension 11 via a gimbal 12 made of a metal substrate. Mounted slider 1
4, a lead printed wiring 15 drawn out from a terminal 14a provided at the front end of the slider 14 via ball bonding and fixed along the upper surface of the suspension 11, and a base plate 1 fixed to a base end portion of the suspension 11.
6 is provided. The lead print wiring 15 is integrally formed on a thin substrate made of a synthetic resin (polyimide resin), and extends outside from a base end portion of the suspension 11. As shown in an enlarged view in FIG. 2, a portion extending to the outside of the lead print wiring 15 is provided with output lead terminals 15a and measurement terminals 15b at predetermined intervals.

In the thin-film magnetic head device 10, the pair of lead printed wirings 15 extending from the slider 14 of the head element 13 is close to each other between the output lead terminals 15a and the measurement terminals 15b. A pair of enlarged portions 15
c is formed via a minute gap. As shown in FIGS. 2 and 3, a pair of solder bumps 17a and 17b are arranged on the upper surface of each of the enlarged portions 15c, and these two solder bumps 17a and 17b are mechanically pressed and deformed. As shown in the figure, the short-circuit portion 17 is formed by being joined in a partially overlapped state.

The above-described pressing deformation of the solder bumps 17a and 17b is performed by connecting a measuring device to the characteristic measuring terminal 15b and measuring the characteristics of the product to confirm that the predetermined characteristics are obtained. This is performed by using a press machine 20 which is an example of the apparatus for forming a short circuit portion according to the present invention shown in FIG. The working atmosphere in this case is preferably a non-oxidizing atmosphere such as a nitrogen atmosphere or an inert gas atmosphere, and thereby, it is possible to prevent an oxide film from being generated when the solder bumps 17a and 17b are deformed by pressing. In addition to joining by pressing deformation, it is preferable from the viewpoint of joining reliability that the joining portion of the conductive substance is melted before oxidation to prevent formation of an oxide film on the joining interface.

A product in which the short-circuit portion 17 is formed on the lead printed wiring 15 in this manner (hereinafter, this is referred to as an intermediate product)
In this case, even when static electricity charged to the worker is applied to the intermediate product in the process of assembling the final product using the same, the potential difference does not occur between the terminals of the head element 13 of the intermediate product due to the presence of the short-circuit portion 17. Thus, electrostatic breakdown of the head element 13 can be reliably prevented.

In the final product assembling process, the short-circuit portion 17 is separated by connecting an amplifier or the like to the output lead terminal 15a of the intermediate product. If the printed wiring board is heated at a temperature (250 ° C. to 180 ° C.) that does not damage the printed wiring board, the short-circuit portion 17 formed by pressing and deforming the solder bumps 17a and 17b is melted and cut off. It is easily separated by surface tension and can be shipped as a final product. In this case, the separation of the short-circuit portion 17 is as follows.
In addition to heating by hot air, infrared heating can be used. In the separation operation of the short-circuit portion 17, the solder bump 17
In order to prevent the separation from becoming insufficient due to the oxidation of a and 17b, the treatment is performed in a non-oxidizing atmosphere such as a nitrogen atmosphere, a reducing gas atmosphere of hydrogen, a mixed gas atmosphere of nitrogen and hydrogen, or an inert gas atmosphere. Is desirable.

Further, in the separating operation of the short-circuit portion 17 with the warm air, the blowing angle of the warm air can be appropriately adjusted such as an obliquely upward direction other than directly from above. , 17b can be separated easily and quickly. Note that the short-circuit portion 17 can be easily separated by a laser beam in a non-oxidizing atmosphere.

In order to easily form the short-circuit portion 17 by pressing and deforming the solder bumps 17a and 17b and to separate the short-circuit portion 17 by heating, the solder bumps 17a and 17b may be used.
It is desirable that the interval at which b is disposed is appropriately set within a range of 1/10 to 2 times the diameter of each of the solder bumps 17a and 17b. Further, the solder forming the solder bumps 17a and 17b can contain an antioxidant, a brightener, a surfactant, and the like, whereby the short-circuit portion 17 formed by the solder bumps 17a and 17b is oxidized. Can be prevented and the surface tension can be increased to facilitate easy and reliable separation. It is also preferable to use a conductive substance mixed with a non-oxidizing metal such as Au to prevent oxidation. On the other hand, as a method of cutting the short-circuit portion, there is a method of cutting the entire substrate on the output wiring between the short-circuit portion 17 and the slider 14, which is, for example, an AA portion shown in FIG.

In forming the short-circuit portion 17, a synthetic resin such as an epoxy resin containing a conductive material such as NiAg or silver paste may be used instead of the solder bumps 17a and 17b. Regarding the formation site of the short-circuit portion 17,
An appropriate portion of the lead printed wiring 15 can be set, for example, an appropriate portion between the base plate 16 and the output lead terminal 15a can be set.

According to such a configuration, after confirming that the intermediate product has the predetermined characteristics by the inspection of the intermediate product, before the shipment of the intermediate product, the two conductive materials (the solder bumps 17) are used.
a, 17b) is deformed by mechanical pressing or ultrasonic vibration welding and joined to form a short-circuited portion 17, and at least a part of the joined portion can be melted. . Further, after the intermediate product is assembled to the final product and an amplifier or the like is connected to the lead terminal 15a provided on the lead printed wiring 15, the short-circuited portion 17 is heated by an appropriate heating means, so that the lead printed wiring 15 is heated. The 15 substrates can be easily separated or separated for use without damage. Of course, it is possible to cut between the short-circuit portions 17 or between the lead terminal 15a and the short-circuit portions 17.

Thus, in the thin-film magnetic head device 10, the two solder bumps 17a,
As shown in FIGS. 4 (a) and 4 (b), the solder bumps 17b are joined in a state where they are pressed and deformed and are partially overlapped with each other.
The short-circuit portion 17 having high reliability of electrical conduction is configured.

In order to form the short-circuit portion 17 in the thin-film magnetic head device 10 according to the present invention, a press 20 according to an example of the present invention shown in FIG. 5 can be used. Thus, various molding methods according to the present invention can be performed.

The press machine 20 includes a support 21 and a bed 22 erected on a base (not shown), and a press mechanism 20a supported on the support 21. The press mechanism 20a includes a slide base 23, A movable arm 24, a press head 25, a lateral load spring means 26, and a stopper 27 are provided. The bed 22 has a slide base 23
, And / or can move in the left-right direction.

The slide base 23 has a base body 2
A slider 23b provided on the support 3a is vertically slidably mounted on a rail 21a provided on the support 21 and connected to a cylinder rod 28a of an air cylinder 28 supported above the support 21. Prop 21
Is connected to a cylinder rod 29a of a shock absorber 29 supported below.

As a result, the slide base 23 slides up and down by driving the air cylinder 28,
At the time of descending, it is received by the shock absorber 29 and its descending speed is adjusted. The descending amount and the descending speed of the slide base 23 are also controlled by an air regulator that controls the air cylinder 23.

The movable arm 24 has a substantially L-shaped side surface shape. The movable arm 24 is mounted on the base body 23a of the slide base 23 at the base of the horizontal arm portion 24a and the vertical arm portion 24b. And is urged counterclockwise by lateral load spring means 26 described later. Lateral arm 2 of movable arm 24
Reference numeral 4a extends above the receiving table 22a of the bed 22, and a press head 25 is attached to the lower surface thereof. Also,
The vertical arm portion 24b of the movable arm 24 extends in parallel with the base body 23a of the slide base 23,
The lateral load spring means 26 and the stopper 27 are assembled.

The press head 25 presses and deforms the solder bumps 17a and 17b on the enlarged portion 15c of the lead print wiring 15 placed on the receiving table 22a of the bed 22 by pressing and deforming the lower surface. Press surface 25a is an inclined surface inclined at a predetermined angle with respect to the receiving surface of receiving table 22a. The press surface 25a is gradually inclined upward toward the tip of the receiving table 22a.

The lateral load spring means 26 is an adjusting means for adjusting the lateral load of the movable arm 25.
6a, a projection 26b that is attached to the front end of the case 26a so as to be able to move forward and backward, and protrudes toward the slide base 23; Retainer 26c and case 26a
It is constituted by a compression spring 26d housed in the inside and located between the projection 26b and the retainer 26c. In the lateral load spring means 26, the projection 26b is resiliently abutted against the side surface of the base body 23a of the slide base 23 by the urging force of the compression spring 26d.
By moving back and forth c, it is possible to adjust the urging force of the compression spring 26d on the projection 26b and adjust the elasticity of the projection 26b on the base body 23a.

The stopper 27 is screwed to the vertical arm portion 24b of the movable arm 24 and is attached to the base body 23a of the slide base 23 so as to be able to advance and retreat. Base body 23
a, the movable arm 24
Of the base body 23a.
The stopper 27 is separated from the base body 23a in a non-operating state, and functions to determine the upper rotation limit of the press head 25.
The point of contact with the side surface of “a” is the maximum rotation position of the press head 25.

By moving the stopper 27 forward and backward, the angle at which the vertical arm 24b faces the base body 23a can be changed, and the press angle of the press head 25 with respect to the bed 22 can be adjusted.
The amount of development of the press head 25 on the solder bumps 17a and 17b in the horizontal direction during pressing can be adjusted.

By using the forming apparatus 20, various methods for forming a short-circuit portion according to the present invention can be performed.
FIG. 6 is an explanatory view schematically showing a first forming method of the forming method according to the present invention, and is a method of forming the short-circuit portion 17 using the press head 25 shown in FIG.

In the forming apparatus 20, the air cylinder 27 is driven by the push button operation of the press command, the slide base 23 is lowered, the movable arm 24 and the press head 25 are lowered integrally, and the press head 25 is moved to the bed 22. Bump 17 placed on the receiving table 22a
a. Press head 25 is solder bump 17a.
When it comes into contact with the solder bump 17a, the solder bump 17a slightly rotates so as to be pushed upward, and at the same time, the solder bump 17a is pressed and deformed while being pushed back while rotating. Next, at the same time as raising the slide base 23, the bed 22 is advanced by a predetermined amount toward the slide base 23, and then the slide base 23 is lowered,
The solder bump 17b at another desired position is pressed by the press head 25 and pressed and deformed.

In this forming method, both solder bumps 17a,
17b are compressed and deformed to form the short-circuit portion 17 by a two-stage press in which the press surface 17a is sequentially pressed.
Is subjected to a first press on the solder bumps 17a by a press head 25 formed on a predetermined inclined surface,
As shown in FIG. 6 (a), the solder bump 17a is pressed and deformed and developed into a substantially wedge shape. Next, the press head 25 is moved upward and the bed 22 is advanced, so that the solder bump 1
7b is positioned below the press head 25, and a second press is performed on the solder bump 17b by the press head 25, and the solder bump 17b is pressed and deformed into a substantially wedge shape as shown in FIG. Let it unfold. Thus, the pressed and deformed solder bumps 17a and 17b are joined in a state where they are partially overlapped with each other, and the short-circuit portion 17 in a completely joined state is formed.

The short-circuit portion 17 thus formed can be further subjected to a third press.
By pressing as described above, the short-circuit portion 17 is pressed as shown in FIG. 3C, and the bonding strength between the solder bumps 17a and 17b can be further increased.

In the first forming method shown in FIG. 6, the inclination angle of the press surface 25a of the press head 25 is 0 to 3 degrees.
By appropriately setting the temperature within the range of 0 degrees, both solder bumps 1
It is possible to adjust the expansion amount due to the pressing deformation of 7a, 17b. By adjusting the area of the overlapping portion of the solder bumps 17a and 17b, the bonding strength can be adjusted.

Further, in the first forming method, the press head 25A having a smooth press surface 25a can be replaced with a press head 25A shown in FIG. A press head combined with an angle is also possible.

As shown in FIG. 7A, the press head 25A shown in FIG. 7 has a press surface 25b having an inclined surface like the press head 25.
As shown in (b), a large number of minute grooves are formed on the press surface 25b. The press head 25A
In this case, the frictional resistance of the press surface 25b to the solder bumps 17a, 17b during pressing is large, and the laterally acting force on the solder bumps 17a, 17b can be effectively transmitted, so that the solder bumps 17a, 17b The amount of lateral development due to the pressing deformation can be increased.
In this case, a short-circuit portion 17A having the structure shown in FIG. 3C is formed, and the bonding area of each solder bump 17a, 17b is increased by the groove, so that the bonding strength can be further increased.

In the press head 25A, as shown in FIG. 8 (a), the press surface 25c may be a curved surface, and as shown in FIG. 8 (c), the press surface 25d is formed by the press surface 25a and the press surface 25b. May be combined to form a surface. Press head 25 having press surface 25c
5A, a short-circuit portion 17B having the structure shown in FIG. 6B is formed, and depending on the press head 25A having the press surface 25d, the short-circuit portion 17B having the structure shown in FIG.
C is formed.

FIG. 9 is an explanatory view schematically showing a second forming method of the forming method according to the present invention. In this forming method, the press head 25 shown in FIG.
To form a short-circuit portion 17D. In this forming method, the short-circuit portion 17D is pressed and deformed by a two-stage press in which the solder bumps 17a and 17b are sequentially pressed.
However, the press surface 25e of the press head 25B has a substantially horizontal plane parallel to the receiving surface of the receiving table 22a of the bed 22.

In the forming method, the solder bump 17
9a is subjected to a first press, and as shown in FIG. 9 (a), the solder bumps 17a are pressed and deformed and developed into a substantially flat plate shape. Next, the press head 25B is moved upward and the bed 22 is advanced to position the solder bump 17b below the press head 25B, and the press head 25B applies a second press to the solder bump 17b. As shown in FIG. 2B, the solder bump 17b is pressed and deformed to develop a substantially flat plate. As a result, the pressed and deformed solder bumps 17a and 17b are partially joined to each other in a state of being overlapped with each other, and the short-circuit portion 17 in a completely joined state is formed.
D is configured. The configured short-circuit portion 17D is, for example,
It becomes about twice as large as the bump diameter after being pressed, and the overlap portion becomes about 1/2 of that.

In the above forming method, the press head 2
Since the press surface 25e of 5B has a substantially horizontal shape, the amount of development in the horizontal direction due to the compressive deformation of each solder bump 17a, 17b is small, and the amount of overlap between the solder bumps 17a, 17b is likely to be small. Therefore, in order to compensate for this, it is preferable to take measures such as making the interval between the solder bumps 17a and 17b narrow, and making at least one of the solder bumps 17a and 17b large.

[Brief description of the drawings]

FIG. 1 is a perspective view of a head gimbal assembly which is an example of a thin-film magnetic head device according to the present invention.

FIG. 2 is an enlarged partial plan view of an extension of a lead print wiring constituting the head gimbal assembly.

FIG. 3 is an enlarged plan view (a) of a state before a short-circuit portion is formed in a conductive portion of the lead printed wiring, and a vertical cross-sectional view (b) taken along line bb in FIG. .

FIG. 4 is an enlarged plan view (a) showing a state where a short-circuit portion is formed in the conductive portion, and a vertical cross-sectional view (b) taken along line bb of FIG.

FIG. 5 is a side view in which a part of a forming device for forming the short-circuit portion is omitted.

FIGS. 6A to 6C are explanatory views schematically showing a first method of forming a short-circuit portion according to the present invention.

FIG. 7A is a side view of a press head according to an example used in the forming method, FIG. 7B is a bottom view of the press head, and FIG. c).

FIGS. 8A and 8B are side views (a) and (c) of a press head according to two other examples used in the same forming method, and longitudinal sectional views (b) and (d) of a short-circuit portion formed by the press head. ).

FIGS. 9A and 9B are schematic views (a) and (b) schematically showing a second method of forming a short-circuit portion according to the present invention.

10A and 10B are an explanatory view schematically showing a forming method according to a comparative example of the method of forming a short-circuited portion according to the present invention, and a longitudinal sectional view of a short-circuited portion formed by the same forming method. .

[Explanation of symbols]

10: head gimbal assembly (thin film magnetic head device), 11: suspension, 12: gimbal, 1
3 ... head element, 14 ... slider, 14 a ... terminal, 15
... lead printed wiring, 15a ... lead terminals for output,
15b: Terminal for measurement, 15c: Enlarged portion, 16: Base plate, 17, 17A, 17B, 17C, 17D, 1
7E: short-circuit portion, 17a, 17b: solder bump, 20: press machine, 20a: press mechanism, 21: support, 21a: rail portion, 22: bed, 22a: receiving table, 23: slide base, 23a: base body , 23b ... slider, 2
4 movable arm, 24a horizontal arm portion, 24b vertical arm portion, 25, 25A, 25B press head, 25a,
25b, 25c, 25d, 25e: press surface, 26: lateral load spring means, 26a: case, 26b: protrusion, 26
c: retainer, 26d: compression spring, 27: stopper, 28: air cylinder, 28a: cylinder rod, 2
9 Shock absorber, 29a Cylinder rod.

Claims (18)

[Claims] An output wiring extending from a slider provided with a magnetoresistive head element has a short-circuit portion in a conductor portion located adjacent to each other, and the short-circuit portion is separated by heating or cutting. A thin-film magnetic head device provided for use as a short-circuit portion, wherein the short-circuit portion is joined in a state of being partially overlapped with each other by pressing and deforming a pair of conductive substances previously fixed to the conductor portion. A thin-film magnetic head device having a short-circuit portion for preventing electrostatic destruction, which is constituted. 2. The thin-film magnetic head device according to claim 1, wherein solder bumps are employed as said conductive materials. 3. The thin-film magnetic head device according to claim 1, wherein a solder containing a non-oxidizing metal is used as each of the conductive substances. Magnetic head device. 4. A method for forming a short circuit portion of a thin film magnetic head device according to claim 1, wherein one of said pair of conductive materials is pressed and deformed. The other conductive material is pressed and deformed, and a part of the other conductive material is overlapped and joined onto the pressed product of the one conductive material. Forming method. 5. The method according to claim 4, wherein each of the conductive substances is deformed by being pressed from above. 6. The method for forming a short-circuit portion according to claim 4, wherein at least one of said conductive substances is deformed by being pressed from above while applying a pressing force in a lateral direction. Of forming a short-circuit portion of a thin-film magnetic head device to be formed. 7. The method according to claim 4, wherein at least one of the conductive materials is deformed by pressing the conductive material while maintaining a predetermined angle with respect to the conductor portion. Of forming a short-circuit portion of a thin-film magnetic head device to be formed. 8. The method for forming a short-circuit portion according to claim 4, wherein the two conductive materials are pressed and deformed and joined in a state of being overlapped with each other, and then the two conductive materials in the joined state are joined. A method for forming a short-circuit portion of a thin-film magnetic head device, further comprising the step of: further deforming a conductive substance by pressing. 9. The method for forming a short circuit portion according to claim 4, wherein at least a part of the conductive material is melted and joined among the conductive materials joined by pressing deformation. A method for forming a short-circuit portion of a thin-film magnetic head device. 10. A method for forming a short-circuit portion according to claim 9, wherein the step from the step of pressing and deforming the conductive material to the step of fusion bonding is performed in a non-oxidizing atmosphere. The method of forming the part. 11. A forming apparatus for forming a short-circuit portion of a thin-film magnetic head device according to claim 1, wherein the slide base is supported on a support standing on a base so as to be slidable in a vertical direction. A drive means for sliding the slide base in the vertical direction; and a press provided on the slide base side to advance and retreat with respect to each conductive material of the conductor portion arranged on the bed by the slide operation of the slide base. An apparatus for forming a short circuit portion of a thin-film magnetic head device, comprising a head. 12. The forming apparatus according to claim 11, wherein
The device for forming a short-circuit portion of a thin-film magnetic head device, wherein the bed is configured to be movable in a direction in which the two conductive substances are arranged in series. 13. The forming apparatus according to claim 11, wherein
An apparatus for forming a short circuit portion in a thin film magnetic head device, wherein the press head is provided on a movable arm rotatably supported on the slide base in a vertical direction. 14. The forming apparatus according to claim 13, wherein
An apparatus for forming a short-circuit portion of a thin-film magnetic head device, wherein the movable arm includes adjusting means for adjusting a limit facing angle of the movable arm with respect to the slide base. 15. The forming apparatus according to claim 11, wherein
An apparatus for forming a short-circuit portion of a thin-film magnetic head device, wherein a press surface of the press head is configured to be parallel to the conductor portion receiving surface of the bed. 16. The forming apparatus according to claim 11, wherein
An apparatus for forming a short-circuit portion of a thin-film magnetic head device, wherein a press surface of the press head is configured to be inclined at a predetermined angle with respect to the conductor portion receiving surface of the bed. 17. The forming apparatus according to claim 15, wherein the press surface of the press head is a smooth surface, a flat or curved surface having a groove, or a surface composed of these surfaces. An apparatus for forming a short-circuit portion of a thin-film magnetic head device. 18. The forming apparatus according to claim 11, wherein
An apparatus for forming a short-circuit portion of a thin-film magnetic head device, comprising: a shock absorber for restricting a lowering operation of the slide base.