JPH0783039B2 - Wire bonding equipment - Google Patents
Wire bonding equipmentInfo
- Publication number
- JPH0783039B2 JPH0783039B2 JP63022790A JP2279088A JPH0783039B2 JP H0783039 B2 JPH0783039 B2 JP H0783039B2 JP 63022790 A JP63022790 A JP 63022790A JP 2279088 A JP2279088 A JP 2279088A JP H0783039 B2 JPH0783039 B2 JP H0783039B2
- Authority
- JP
- Japan
- Prior art keywords
- ball
- bonding
- contact
- electrode
- load
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48475—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
- H01L2224/48476—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area
- H01L2224/48477—Connecting portions connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball between the wire connector and the bonding area being a pre-ball (i.e. a ball formed by capillary bonding)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/494—Connecting portions
- H01L2224/4941—Connecting portions the connecting portions being stacked
- H01L2224/4942—Ball bonds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
- H01L2224/78344—Eccentric cams
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/85051—Forming additional members, e.g. for "wedge-on-ball", "ball-on-wedge", "ball-on-ball" connections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/852—Applying energy for connecting
- H01L2224/85201—Compression bonding
- H01L2224/85203—Thermocompression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、配線基板および半導体のワイヤボンデイング
装置に係り、特に単一の電極への複数本の導電線の接
合、および接合強度の安定性向上に好適なワイヤボンデ
イング装置に関するものである。Description: TECHNICAL FIELD The present invention relates to a wiring substrate and a semiconductor wire bonding apparatus, and more particularly to bonding a plurality of conductive wires to a single electrode and stability of bonding strength. The present invention relates to a wire bonding device suitable for improvement.
従来の技術については、特開昭56−30735号公報および
特開昭58−98937号公報などに記載されているように、
ボンデイング時において、荷重の制御を目ざしていた
が、導電線の先端のボールの変形量に関しては必ずしも
制御されていなかつた。Regarding the conventional technique, as described in JP-A-56-30735 and JP-A-58-98937,
The load was controlled at the time of bonding, but the amount of deformation of the ball at the tip of the conductive wire was not always controlled.
上記従来技術では、ボンデイングの際の荷重を制御して
いたが、ボールの変形量を制御して、常に一定の変形量
を与えるような配慮がないために、前記変形量の不均一
に基づく接合強度の不安定性という点に問題があつた。
特に、単一の電極へ複数の線材の端部（ボール）を積重
ねて接合する（以下、多重ボンデイングという）場合に
は、接合部の形状が一定とならず、良好な接合が得られ
なかつた。In the above-mentioned prior art, the load at the time of bonding was controlled. However, since there is no consideration that the deformation amount of the ball is controlled to always give a constant deformation amount, the joining based on the uneven deformation amount is not performed. There was a problem with the strength instability.
In particular, when the ends (balls) of a plurality of wire rods are stacked and joined to a single electrode (hereinafter referred to as multiple bonding), the shape of the joined portion is not constant and good joining cannot be obtained. .
本発明の目的は、このようなボンデイング時、特に、単
一の電極への多重ボンデイングにおけるボール変形量の
不均一に起因する接合強度の不安定性を解決して、常に
安定したボンデイングができるようなワイヤボンデイン
グ装置を提供することである。The object of the present invention is to solve the instability of the bonding strength due to the non-uniformity of the amount of deformation of balls in the case of such bonding, especially in the case of multiple bonding to a single electrode, so that stable bonding can be always performed. A wire bonding apparatus is provided.
上記課題を解決するための本発明に係るワイヤボンデイ
ング装置の構成は、導電線の先端に形成されたボール
を、キヤピラリもしくはボンデイングツールによつて電
極上へ熱圧着するようにしたワイヤボンデイング装置に
おいて、熱圧着の初期に、キヤピラリもしくはボンデイ
ングツールとボールと電極とが接触状態になつたことを
検知することができる接触検出装置と、そのボールに、
前記状態から、予め設定した荷重，変形量を与えること
ができる負荷装置と前記接触検出装置から接触信号を入
力したとき、前記負荷装置をONにすることができる制御
装置とを具備するようにしたものである。The structure of the wire bonding apparatus according to the present invention for solving the above-mentioned problems is a ball bonding apparatus in which a ball formed at the tip of a conductive wire is thermocompression bonded onto an electrode by a capillary or a bonding tool. In the initial stage of thermocompression bonding, a contact detection device capable of detecting that the capillary or bonding tool, the ball and the electrode are in contact with each other, and the ball,
A load device capable of applying a preset load and deformation amount from the above state and a control device capable of turning on the load device when a contact signal is input from the contact detection device are provided. It is a thing.
さらに詳しくは、ボンデイング装置に、ボンデイングツ
ールあるいはキヤピラリを低荷重の下にボールに向けて
駆動すると共に、それ等がボールに接触したことを検出
する機構及びボンデイングツール等がボールに接触した
後、最適荷重の下に予め定められた量だけボールを変形
させる機構を設けるようにしたものである。すなわち、
配線基板上の電極にボールを接触し、接合するキヤピラ
リを一端に保持し、支点を介して他端側に揺動カムロー
ラ、ばね、ストツパを保有する揺動アームは、本装置の
制御装置によつて制御されている。キヤピラリ先端部の
ボールが電極に接触した瞬間に接触検出装置が、それを
検出し、制御装置に伝達する。制御装置は、予め指定さ
れた荷重でボールを押圧する。この際の押圧力はシリン
ダによるばね力とパルスモータを介したストツパとの調
整によつて、所定の値をとることができる。例えば、キ
ヤピラリ先端のボールの変位量をδと設定すれば、スト
ツパと揺動アームとのギヤツプの変位量δ0をδに相当
するように調整しておけばよい。More specifically, the bonding device drives the bonding tool or the capillaries toward the ball under a low load, and the mechanism that detects that they are in contact with the ball and after the bonding tool, etc. contacts the ball is optimal. A mechanism for deforming the ball under a load by a predetermined amount is provided. That is,
The oscillating arm that holds the piezo that contacts and joins the ball to the electrode on the wiring board at one end and has the oscillating cam roller, the spring, and the stopper on the other end through the fulcrum is controlled by the controller of this device. Controlled. At the moment when the ball at the tip of the capillary comes into contact with the electrode, the contact detection device detects it and transmits it to the control device. The control device presses the ball with a load designated in advance. The pressing force at this time can take a predetermined value by adjusting the spring force of the cylinder and the stopper via the pulse motor. For example, if the amount of displacement of the ball at the tip of the capillary is set to δ, the amount of displacement δ 0 of the gear between the stopper and the swing arm may be adjusted to correspond to δ.
制御装置に、予め所定の押圧力、ボールの変位量を指示
してやれば、常にボールを一定量だけ変位させることが
できるので、均一な形状で、接合強度の一定な接合が得
られる。If the controller is instructed in advance with a predetermined pressing force and the amount of displacement of the ball, the ball can always be displaced by a certain amount, so that a joint having a uniform shape and a constant joint strength can be obtained.
以下本発明の一実施例を、第１図〜第６図を用いて説明
する。An embodiment of the present invention will be described below with reference to FIGS.
第１図は、本発明の一実施例に係るワイヤボンデイング
装置の構成を示す縦断面図、第２図は、第１図のボンデ
イング個所の単層のボール（キヤピラリによる）の接合
部の変位量を示す拡大断面図、第３図は、第１図のボン
デイング個所の２層のボール（ボンデイングツールによ
る）の接合部の変位量を示す拡大断面図、第４図は、第
１図のワイヤボンデイング装置の動作の第１段階を示
し、揺動アーム（後述する）先端のキヤピラリまたはボ
ンデイングツールが、配線基板または半導体装置の上方
に位置した状態の断面略示図、第５図は、同上の第２段
階を示し、キヤピラリ等が、配線基板面等と接触した位
置の断面略示図、第６図は、同上の第３段階を示し、キ
ヤピラリ等の先端のボールが所定量だけ変形し、配線基
板面等と接合した位置の断面略示図である。FIG. 1 is a longitudinal sectional view showing the structure of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a displacement amount of a joint portion of a single-layer ball (by a capillary) at a bonding portion in FIG. FIG. 3 is an enlarged cross-sectional view showing the displacement of the joint portion of the two-layer ball (by the bonding tool) at the bonding point in FIG. 1, and FIG. 4 is the wire bonding in FIG. FIG. 5 shows a first stage of the operation of the device, showing a cross-sectional schematic view of a state in which a capillary or a bonding tool at the tip of a swing arm (described later) is located above a wiring board or a semiconductor device, and FIG. FIG. 6 shows two stages, and a schematic sectional view of a position where the capillaries and the like come into contact with the wiring board surface and the like, and FIG. 6 shows the third stage of the same. The position where it is bonded to the substrate surface, etc. Of a schematic cross section.
本実施例における構成を第１図〜第３図を用いて説明す
る。The configuration of this embodiment will be described with reference to FIGS.
第１図において、１および２は夫々キヤピラリおよびボ
ンデイングツールであり、導電線先端のボールを電極面
に熱圧着させる治具である。３は、枠構造物20上に付設
された支持台の支点を中心に移動することができる揺動
アームであり、その一端にはキヤピラリ１またはボンデ
イングツール２（以下、キヤピラリ１で代表する）を保
持し、他端側には揺動カム４のローラ受部，シリンダ５
（詳細後述）に連なるばね６の係止部が設けられてい
る。４は、偏心回転する揺動カムであり、この揺動カム
が、前記ローラ受部と当接して、揺動アーム３を駆動す
ることができるようになつている。前記シリンダ５は、
下端が前記係止部にとめられた引張りばね６の上端を、
そのロツドの先端に引掛け、前記ロツドの上下動にとも
ない、引張りばね６に所定の引張力を負荷することがで
きるようになつている。７は、その送りねじ８の回転に
よつてこれと噛み合うストツパ19を上下動させることに
より、揺動アーム３の揺動ストロークを制限することが
できるパルスモータである。In FIG. 1, 1 and 2 are a capillary and a bonding tool, respectively, which are jigs for thermocompression bonding the balls at the tips of the conductive wires to the electrode surface. Reference numeral 3 denotes a swinging arm that can move around a fulcrum of a support attached to the frame structure 20, and has a capillary 1 or a bonding tool 2 (hereinafter, represented by the capillary 1) at one end thereof. The roller receiving portion of the swing cam 4 and the cylinder 5 are held on the other end side.
An engaging portion for the spring 6 is provided (described in detail later). Reference numeral 4 denotes an oscillating cam that rotates eccentrically, and the oscillating cam can contact the roller receiving portion to drive the oscillating arm 3. The cylinder 5 is
The upper end of the tension spring 6 whose lower end is fixed to the locking portion,
By hooking on the tip of the rod, a predetermined tension force can be applied to the tension spring 6 as the rod moves up and down. A pulse motor 7 can limit the swing stroke of the swing arm 3 by vertically moving a stopper 19 that meshes with the feed screw 8 by rotating the feed screw 8.
９は、揺動アーム３に保持されたキヤピラリと、配線基
板15または半導体装置14（以下、配線基板で代表する）
との接触状況を、即刻捕捉するための接触検出装置であ
り、これにより、キヤピラリ１先端に位置する導電線の
ボールが第２図（Ａ）または第３図（Ａ）の状態になつ
た瞬間に、これを検出することができる。10は、接触検
出装置９からの、キヤピラリとボールと電極16とが接触
状態になつたという信号を入力したとき、その信号を、
シリンダ5,パルスモータ７へ出力し、ばね６を高い引張
力の状態にするとともに、前記ボールに所定量δだけの
変形を与えることができるように揺動アーム３の揺動ス
トローク量を制限する位置へ、ストツパ19を位置ぎめす
ることができる制御装置である。Reference numeral 9 denotes a capillary held by the swing arm 3 and a wiring board 15 or a semiconductor device 14 (hereinafter, represented by a wiring board).
This is a contact detection device for instantly capturing the contact situation with the contact point, whereby the ball of the conductive wire located at the tip of the capillary 1 is brought into the state of FIG. 2 (A) or FIG. 3 (A). And this can be detected. When a signal from the contact detection device 9 that the capillary, the ball, and the electrode 16 are in contact with each other is input, the signal 10 is
It outputs to the cylinder 5 and the pulse motor 7 to bring the spring 6 into a state of high tension and limits the swing stroke of the swing arm 3 so that the ball can be deformed by a predetermined amount δ. It is a control device that can position the stopper 19 to a position.
配線基板15上の電極16と、ボールを介して接合するため
の導電線13は、枠構造物20の上部に取付けられた導電線
リレー（示せず）からキヤピラリ１直上に位置するスプ
ール12を経て、キヤピラリ１に送り出され、配線基板15
上の電極16に熱圧着法によつて接合できるようになつて
いる。この配線基板15は、フレーム17に付設されたXYテ
ーブル18上に保持されている。さらに、クレーム17上に
は、前記枠構造物20も組込まれている。An electrode 16 on the wiring board 15 and a conductive wire 13 for joining via a ball are passed from a conductive wire relay (not shown) mounted on the upper part of the frame structure 20 through a spool 12 located immediately above the capillary 1. , Sent to the capillary 1 and the wiring board 15
It can be joined to the upper electrode 16 by a thermocompression bonding method. The wiring board 15 is held on an XY table 18 attached to a frame 17. Further, the frame structure 20 is incorporated in the claim 17.
つぎに、本実施例の動作について、主として第４図〜第
６図を用いて説明する。Next, the operation of this embodiment will be described mainly with reference to FIGS.
第４図は、動作の第１段階の状態を示すものである。ま
ず、スイツチを入れると、制御装置10が作動し、その指
示に従つてシリンダ５を介してばね６に弱い張力が加わ
る。揺動カム４は揺動アーム側のカムローラと接触した
状態を保ち、揺動アーム３の先端にあるキヤピラリ１
は、ばね６による力により、揺動カム４で支えられなが
ら、揺動アーム３の支点を軸に、若干上方へ上る。配線
基板15上の電極16の上に位置をとるキヤピラリ１と電極
16とは離れた状態にある。FIG. 4 shows the state of the first stage of operation. First, when the switch is put in, the control device 10 operates, and a weak tension is applied to the spring 6 via the cylinder 5 in accordance with the instruction. The rocking cam 4 is kept in contact with the cam roller on the rocking arm side, and the capillary 1 at the tip of the rocking arm 3 is held.
While being supported by the rocking cam 4 by the force of the spring 6, it moves slightly upward about the fulcrum of the rocking arm 3. Capillary 1 and electrodes positioned above electrodes 16 on wiring board 15
It is far from 16.
第５図は、第２段階の状態を示すものである。FIG. 5 shows the state of the second stage.
制御装置10からの信号を受けて、シリンダ５を介してば
ね６にやや強い張力を加えると同時に、揺動カム４は矢
印方向に回転して、静かに揺動アーム側のカムローラか
ら離れるように作動して、揺動アーム３の先端部にある
キヤピラリ１のボールは配線基板15上の電極16に接触
し、第２図（Ａ），第３図（Ａ）のような状態となる。
その瞬間に、接触検出装置９は、この接触状態を検出
し、制御装置10が先の信号を受けて、第６図に示すよう
に、シリンダ５を矢印の方向に作動させて、ばね６によ
り上向きの強い張力を与えて、支点を介して（揺動カム
は離れた状態のまま）揺動アーム３の他端に下向きの力
を与えるので、その先端部キヤピラリ１のボールは所定
の荷重（予め制御装置に指示した最適な値）により押圧
されて電極16面に接合される。これと同時に、制御装置
10からの信号をパルスモータ７に伝え、送りねじ８を介
してストツパ19を下方に移動させ、揺動アーム３とスト
ツパ19とのギヤツプδ0が、キヤピラリ１の先端のボー
ルの変位δに相当する変位となるようにする。第２図
（Ａ），（Ｂ）に示すように、ボールの変位量δとスト
ツパ19側から与えるδ0の関係は、予め十分に調整をと
り、制御装置10に指示しておくことによつて、所期の目
的値を得ることができる。以上の第１段階（第４図）、
第２段階（第５図）、第３段階（第６図）の動作を繰返
して実施することにより、予め設定した一定量δだけボ
ールを変形させた状態での接合が継続して実施されるこ
とになる。Upon receiving a signal from the control device 10, a slightly strong tension is applied to the spring 6 via the cylinder 5, and at the same time, the swing cam 4 rotates in the direction of the arrow so as to be gently separated from the cam roller on the swing arm side. When actuated, the balls of the capillary 1 at the tip of the swing arm 3 come into contact with the electrodes 16 on the wiring board 15, and the states shown in FIGS. 2 (A) and 3 (A) are obtained.
At that moment, the contact detection device 9 detects this contact state, and the control device 10 receives the previous signal and operates the cylinder 5 in the direction of the arrow as shown in FIG. A strong upward tension is applied and a downward force is applied to the other end of the swing arm 3 via the fulcrum (while the swing cam is in a separated state), so that the ball of the tip end capillary 1 has a predetermined load ( It is pressed by the optimum value which is previously instructed to the control device) and bonded to the electrode 16 surface. At the same time, the control device
The signal from 10 is transmitted to the pulse motor 7, the stopper 19 is moved downward via the feed screw 8, and the gear tap δ 0 between the swing arm 3 and the stopper 19 corresponds to the displacement δ of the ball at the tip of the capillary 1. So that the displacement becomes As shown in FIGS. 2 (A) and 2 (B), the relationship between the displacement amount δ of the ball and δ 0 given from the stopper 19 side should be sufficiently adjusted in advance and instructed to the control device 10. Therefore, the desired target value can be obtained. The above first stage (Fig. 4),
By repeating the operations of the second stage (FIG. 5) and the third stage (FIG. 6), the joining is continuously performed while the ball is deformed by a predetermined constant amount δ. It will be.
一方、XYテーブル18上に設定された配線基板15上の電極
16は、予め与えられたプログラムにしたがつて、逐次X,
Y方向に移動することによつて、新しいボールが逐次、
次の電極16へ接合されて、すべての電極16への接続を終
了したとき、ワイヤボンデイング装置がOFFになる。On the other hand, the electrodes on the wiring board 15 set on the XY table 18
16 is a sequential X, according to the program given in advance.
By moving in the Y direction, new balls are successively
When bonded to the next electrode 16 and the connection to all electrodes 16 is completed, the wire bonding device is turned off.
本実施例における効果としては、 （１）ボールの変位量δと押圧力を、予め任意に設定
し、制御装置内に記憶させておけば、常に一定形状の表
面積の接合点が得られるので、安定した電流および接合
強度の接合点が提供できる。The effects of the present embodiment are as follows: (1) If the displacement amount δ of the ball and the pressing force are arbitrarily set in advance and stored in the control device, a joint point having a constant surface area can always be obtained. It is possible to provide a junction with stable current and junction strength.
（２）第３図に示すように、単一の電極への多重ボンデ
イングを行なう場合には、制御装置への指示により、常
に安定した、一定形状の接合ができる。(2) As shown in FIG. 3, when performing multiple bonding to a single electrode, it is possible to always perform stable and constant-shape bonding by instructing the control device.
その他に、単一の電極へ複数の線材のボールを積重ねて
接合する場合にも、第３図（Ａ），（Ｂ）に示すよう
に、電極に接合した１層目のボール上に重ねて、ボンデ
イングツールで２層目のボールを接合する場合にも、予
め制御装置10上に押圧力、ボールの変位量を指示してお
けば、上記と同様な動作によつて、接合部形状を均一な
ものとすることができる。In addition, when a plurality of wire balls are stacked and bonded to a single electrode, as shown in FIGS. 3 (A) and 3 (B), they are stacked on the first layer ball bonded to the electrode. Even when joining the second layer of the ball with the bonding tool, if the pressing force and the amount of displacement of the ball are instructed in advance on the control device 10, the joint shape can be made uniform by the same operation as above. It can be anything.
なお、第３図に示すような多重ボンデイングの場合に
は、制御装置に指示して、各ボール毎に変位量δの異つ
た値とすることもできる。In the case of multiple bonding as shown in FIG. 3, it is possible to instruct the control device to set different values of the displacement amount δ for each ball.
さらに、本実施例では、負荷の方法として、１つのばね
の強弱によつて行なつたが、ばね力の異なる２つのばね
の引張力を相互に組合わせて作用させる方法を用いるこ
ともできる。Further, in the present embodiment, as the loading method, the strength of one spring is used, but a method of applying the pulling forces of two springs having different spring forces in combination with each other can also be used.
本発明によれば、接合部の形状を予め定めた、バラツキ
の少ない均一なものとすることができるので、同一電極
に複数の線材を積重ねて接合する、多重ボンデイングの
場合にも良好な接合を得ることができるので、配線基板
の高密度実装を可能にするという効果がある。また、ボ
ールの変形量の制御と接合のための加圧の制御とを分離
することができるので、接合面積の安定化、接合加圧条
件の最適化が可能となり、安定した接合強度を得ること
ができる。According to the present invention, it is possible to make the shape of the joint part predetermined and uniform with less variation, so that good joining can be achieved even in the case of multiple bonding by stacking a plurality of wire rods on the same electrode. Since it can be obtained, there is an effect of enabling high-density mounting of the wiring board. Further, since it is possible to separate the control of the amount of deformation of the ball and the control of the pressure for joining, it becomes possible to stabilize the joining area and optimize the joining pressurizing condition, and obtain stable joining strength. You can
以上要するに、ボンデイングの際に、特に、単一の電極
への多重ボンデイングにおけるボール変形量の不均一に
起因する接合強度の不安定性を解決して、常に安定した
ボンデイングができるようなワイヤボンデイング装置を
提供することができる。In summary, during bonding, a wire bonding device capable of always performing stable bonding by solving the instability of the bonding strength due to the non-uniformity of the amount of ball deformation in multiple bonding to a single electrode Can be provided.
第１図は、本発明の一実施例に係るワイヤボンデイング
装置の構成を示す縦断面図、第２図は、キヤピラリボン
デイング（単層）のボール接合部の変位量を示す拡大断
面図、第３図は、ボンデイングツールによる２層ボンデ
イングのボール接合部の変位量を示す拡大断面図、第４
図は、第１図のワイヤボンデイング装置の動作の第１段
階（ボール未接触）状態の断面略示図、第５図は、同上
の第２段階（ボール接触）状態の断面略示図、第６図
は、同上の第３段階（ボール接合）状態の断面略示図で
ある。 １…キヤピラリ、２…ボンデイングツール、３…揺動ア
ーム、６…ばね、９…接触検出装置、10…制御装置、13
…導電線、14…半導体装置、15…配線基板、16…電極、
19…ストツパ。FIG. 1 is a vertical cross-sectional view showing the structure of a wire bonding apparatus according to an embodiment of the present invention, and FIG. 2 is an enlarged cross-sectional view showing the amount of displacement of a ball-bonding portion of a capillarity ribbon-deing (single layer). FIG. 3 is an enlarged cross-sectional view showing the amount of displacement of the ball joint portion of the two-layer bonding by the bonding tool, FIG.
FIG. 5 is a schematic sectional view of the wire bonding apparatus of FIG. 1 in a first stage (ball non-contact) state, and FIG. 5 is a sectional schematic diagram of a second stage (ball contact) state of the same. FIG. 6 is a schematic cross-sectional view of the same third stage (ball joining) state as above. DESCRIPTION OF SYMBOLS 1 ... Capillary, 2 ... Bonding tool, 3 ... Oscillating arm, 6 ... Spring, 9 ... Contact detection device, 10 ... Control device, 13
... Conductive wire, 14 ... Semiconductor device, 15 ... Wiring board, 16 ... Electrode,
19 ... Stopper.
Claims (2)
ピラリもしくはボンデイングツールによつて電極上へ熱
圧着するようにしたワイヤボンデイング装置において、
熱圧着の初期に、キヤピラリもしくはボンデイングツー
ルとボールと電極とが接触状態になつたことを検知する
ことができる接触検出装置と、そのボールに、前記状態
から、予め設定した荷重，変形量を与えることができる
負荷装置と前記接触検出装置から接触信号を入力したと
き、前記負荷装置をONにすることができる制御装置とを
具備したことを特徴とするワイヤボンデイング装置。1. A wire bonding apparatus in which a ball formed at the tip of a conductive wire is thermocompression-bonded onto an electrode by a capillary or a bonding tool.
In the initial stage of thermocompression bonding, a contact detection device capable of detecting that the capillaries or bonding tools, the ball and the electrode are in contact with each other, and the ball is given a preset load and deformation amount from the above state. A wire bonding apparatus, comprising: a load device capable of operating and a control device capable of turning on the load device when a contact signal is input from the contact detection device.
ングツールとボールと電極とが接触状態になつたとき
は、接触検出装置からの信号を受けた制御装置の指示に
より、揺動アームを制御できるシリンダを作動させて、
ばねに弱い荷重を与え、また、熱圧着による接合には、
前記制御装置の指示により、前記シリンダを介して前記
ばねに強い荷重を与えると同時に、パルスモータを駆動
してストツパにより、所定の変位をボールに与えること
ができる負荷装置にしたことを特徴とする特許請求の範
囲第１項記載のワイヤボンデイング装置。2. A cylinder capable of controlling a swing arm according to an instruction of a control device which receives a signal from a contact detection device when a loading device is brought into contact with a capillarity or a bonding tool, a ball and an electrode. Activate it,
A weak load is applied to the spring, and for joining by thermocompression bonding,
According to an instruction from the control device, a strong load is applied to the spring through the cylinder, and at the same time, a pulse motor is driven so that a predetermined displacement can be applied to the ball by the stopper. The wire bonding apparatus according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63022790A JPH0783039B2 (en) | 1988-02-04 | 1988-02-04 | Wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63022790A JPH0783039B2 (en) | 1988-02-04 | 1988-02-04 | Wire bonding equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01199443A JPH01199443A (en) | 1989-08-10 |
| JPH0783039B2 true JPH0783039B2 (en) | 1995-09-06 |
Family
ID=12092476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63022790A Expired - Lifetime JPH0783039B2 (en) | 1988-02-04 | 1988-02-04 | Wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0783039B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5938952A (en) * | 1997-01-22 | 1999-08-17 | Equilasers, Inc. | Laser-driven microwelding apparatus and process |
| KR100823015B1 (en) * | 2001-09-27 | 2008-04-17 | 주식회사 포스코 | Mash-seam Welding Parts Continuity Test Apparatus |
| KR100632258B1 (en) * | 2005-01-14 | 2006-10-12 | 우리마이크론(주) | Sample tester for semiconductor |
| JP5481769B2 (en) * | 2006-11-22 | 2014-04-23 | 日亜化学工業株式会社 | Semiconductor device and manufacturing method thereof |
| JP4722117B2 (en) * | 2007-12-21 | 2011-07-13 | 株式会社シンアペックス | Wire bonding equipment |
| JP5062283B2 (en) | 2009-04-30 | 2012-10-31 | 日亜化学工業株式会社 | Semiconductor device and manufacturing method thereof |
| TWI649816B (en) * | 2016-08-23 | 2019-02-01 | 日商新川股份有限公司 | Threading method and device |
-
1988
- 1988-02-04 JP JP63022790A patent/JPH0783039B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01199443A (en) | 1989-08-10 |
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