JPH01198097A - Solid state relay - Google Patents

Abstract

PURPOSE:To improve dissipation from a TRIAC and insulating properties between input and output terminals, by providing a first insulating substrate on a metallic substrate and further providing a second insulating substrate on the first substrate. CONSTITUTION:A solid state relay according to the invention comprises a first insulating substrate 11 provided on a metallic substrate 2 and having circuit patterns connected to a photocoupler 3 and to a TRIAC 4, and a second insulating substrate 12 provided on the insulating substrate 11 and having circuit patterns including an input signal circuit. In this solid state relay, thickness of the insulating layer (the insulating substrate 11) below the TRIAC 4 can be about 100mum while thickness of the insulating layer (the insulating substrates 11 and 12) below the photocoupler 3 can be adapted to European Insulation Standard (0.5mm or more). Accordingly, it is possible to obtain improved heat conductivity between the metallic substrate 2 and the TRIAC 4 as well as improved insulating properties between input and output terminals 7 and 8.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid-state relay that includes a photocoupler that optically insulates input and output, and a triac that performs 0N10FF by a signal from the photocoupler.

[Conventional technology]

Conventionally, this type of solid state relay (hereinafter referred to as SSR) has been configured as shown in FIG. To explain this based on the same figure, in the same figure, what is indicated by reference numeral 1 is a copper foil pattern (not shown) provided on a metal substrate 2 such as aluminum, and as a wiring pattern connected to a photocoupler 3 and a triac 4. ), 5 is a cylindrical case provided on the insulating substrate 1 and surrounding the photocoupler 3 and the triac 4;
6 is an epoxy resin filled in the case 5. Note that 7 and 8 are input terminals and output terminals connected to the photocoupler 3 and the triac 4, respectively.

In the SSR configured in this way, a thin insulating substrate 1 is bonded onto a metal substrate 2, and electrical components such as a photocoupler 3 and a triac 4 and input/output terminals 7.8 are soldered onto this insulating substrate 1. , it can be assembled by attaching the case 5 and then injecting the resin 6.

[Problem to be solved by the invention]

By the way, in this type of SSR, triac 4
In order to efficiently dissipate the heat generated from the metal substrate 2 to the outside, it is necessary to set the thickness of the insulating substrate 1 to a thin dimension of about 100 μm. Conditions in which the insulation distance (thickness of the insulation layer on the metal substrate l) between the terminal 7 and the output terminal 8 connected to the output signal circuit complies with European insulation standards (0.5 m or more)
There was a problem in that it was not possible to set the dimensions to satisfy the requirements.

The present invention was made in view of the above circumstances, and improves the thermal conductivity between the triac and the metal substrate and the insulation between the input and output terminals, thereby improving the dissipation performance from the triac and the TA 8 & conductivity between the input and output terminals. This provides excellent SSR.

[Means to solve the problem]

The SSR according to the present invention includes a first insulating substrate provided on a metal substrate and having a wiring pattern connected to a photocoupler and a triac, and a second insulating substrate provided on the insulating substrate and having a wiring pattern including an input signal circuit. It is equipped with a substrate.

[For production]

In the present invention, the thickness of the insulating layer below the triac can be set to about 100 μm, and
The thickness of the insulation layer below the photocoupler can be dimensioned to comply with European insulation standards.

〔Example〕

FIG. 1 is a sectional view showing the SSR according to the present invention, in which the same members as in FIG. 2 are denoted by the same reference numerals.
Detailed explanation will be omitted. In the figure, the reference numeral 11 indicates a first insulating substrate having a thickness of about 100 μm, which is provided on the metal substrate 2, and is connected to the photocoupler 3 and the triac 4 on the - side surface. A wiring pattern (not shown) is formed. 12 is the second
The insulating substrate is provided on the first insulating substrate ll, and a wiring pattern (not shown) containing only an input signal circuit is formed on the surface opposite to the metal substrate 2. . The thickness of the 8M chemical substrate 12 is set such that the sum of the thickness of the first insulating substrate 11 is 0.5 or more.

In the SSR configured in this way, the thickness of the insulating layer (insulating substrate 11) below the triac 4 is set to about 100 μm, and the thickness of the insulating layer (insulating substrate 11 and insulating substrate 12) below the photocoupler 3 is set to about 100 μm. Since the thickness can be set to a size that complies with European insulation standards (0.5 mm or more), the thermal conductivity between the metal substrate 2 and the triac 4 and the insulation between the input and output terminals 7 and 8 are good. become.

In this embodiment, the wiring pattern (not shown) on the second insulating substrate 12 is shown as containing only an input signal circuit, but the present invention is not limited to this, and the wiring pattern (not shown) on the second insulating substrate 12 is It may also include a part of the circuit on the terminal 8 side.

〔Effect of the invention〕

As explained above, according to the present invention, the first insulating substrate has a wiring pattern provided on a metal substrate and connected to a photocoupler and a triac, and a wiring pattern provided on this insulating substrate and including an input signal circuit. Since the second insulating substrate is provided, the thickness of the insulating layer below the triac can be set to about 100 μm, and the thickness of the insulating layer below the photocoupler can be set to 0.5 mm or more. can do. Therefore, the thermal conductivity between the triac and the metal substrate and the insulation between the input and output terminals are improved, and an SSR with excellent dissipation from the triac and excellent insulation between the input and output terminals can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing an SSR according to the present invention, and FIG. 2 is a sectional view showing a conventional SSR. 2... Metal substrate, 3... Photocoupler, 4...
・Triac, 11...first insulating substrate, 12.
...Second insulating substrate.

Claims (1)

[Claims] A first insulating substrate provided on a metal substrate and having a wiring pattern connected to a photocoupler and a triac, and a second insulating substrate provided on this insulating substrate and having a wiring pattern including an input signal circuit. Features solid state relay.