JPH01189112A - 電子部品の静電粉体外装方法 - Google Patents
電子部品の静電粉体外装方法Info
- Publication number
- JPH01189112A JPH01189112A JP63011867A JP1186788A JPH01189112A JP H01189112 A JPH01189112 A JP H01189112A JP 63011867 A JP63011867 A JP 63011867A JP 1186788 A JP1186788 A JP 1186788A JP H01189112 A JPH01189112 A JP H01189112A
- Authority
- JP
- Japan
- Prior art keywords
- leads
- electrostatic powder
- electronic component
- silicone resin
- powder paint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63011867A JPH01189112A (ja) | 1988-01-23 | 1988-01-23 | 電子部品の静電粉体外装方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63011867A JPH01189112A (ja) | 1988-01-23 | 1988-01-23 | 電子部品の静電粉体外装方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01189112A true JPH01189112A (ja) | 1989-07-28 |
| JPH0563095B2 JPH0563095B2 (https=) | 1993-09-09 |
Family
ID=11789672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63011867A Granted JPH01189112A (ja) | 1988-01-23 | 1988-01-23 | 電子部品の静電粉体外装方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01189112A (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6353554B1 (en) | 1995-02-27 | 2002-03-05 | Btg International Inc. | Memory apparatus including programmable non-volatile multi-bit memory cell, and apparatus and method for demarcating memory states of the cell |
-
1988
- 1988-01-23 JP JP63011867A patent/JPH01189112A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563095B2 (https=) | 1993-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0158971B1 (en) | Monolithic capacitor edge termination | |
| JPS6127688A (ja) | 電歪効果素子およびその製造方法 | |
| SE453367B (sv) | Polymerbelagd metallartikel vars yta prepaterats med en vetande hydrosol och ett kopplingsmedel, samt ett sett att framstella artikeln | |
| JPH01189112A (ja) | 電子部品の静電粉体外装方法 | |
| JPS59175176A (ja) | 電歪効果素子の製造方法 | |
| WO2006058833A1 (de) | Kontaktierung von vielschicht-piezoaktoren bzw. -sensoren | |
| JPH01189113A (ja) | 電子部品の静電粉体外装方法 | |
| JP2936194B2 (ja) | 回転電機のコア絶縁方法 | |
| JPH0256827B2 (https=) | ||
| JPS6132835B2 (https=) | ||
| JPH03158451A (ja) | 溶射用マスキングテープ | |
| JPS60178678A (ja) | セラミツク積層体電子部品の製造方法 | |
| JPH0786654A (ja) | 積層型電気・歪変換素子,積層型セラミックアクチュエータおよびその製造方法 | |
| CN220389487U (zh) | 一种包裹有柔性绝缘外层的立体螺旋转印电极 | |
| JP2003338551A (ja) | 電子部品及びその製造方法 | |
| JPS63169748A (ja) | 耐湿・絶縁化電子部品 | |
| JPH05182862A (ja) | チップ型フィルムコンデンサとその外装方法 | |
| JPS63288076A (ja) | 圧電セラミック積層体電子部品の製造方法 | |
| JPS6127687A (ja) | 電歪効果素子の製造方法 | |
| JPS6318352B2 (https=) | ||
| JP2003347621A (ja) | 積層圧電アクチュエータの製造方法 | |
| JPH07297556A (ja) | 多層セラミック電子部品の製造方法 | |
| JPH04105375A (ja) | 圧電積層体の製造方法 | |
| JPS61139090A (ja) | 防湿絶縁性実装回路板 | |
| JPS5992510A (ja) | 外装皮膜を有する電子部品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |