JPH0118572B2 - - Google Patents
Info
- Publication number
- JPH0118572B2 JPH0118572B2 JP217182A JP217182A JPH0118572B2 JP H0118572 B2 JPH0118572 B2 JP H0118572B2 JP 217182 A JP217182 A JP 217182A JP 217182 A JP217182 A JP 217182A JP H0118572 B2 JPH0118572 B2 JP H0118572B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- conductor
- dielectric
- laminate
- internal electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 claims description 11
- 239000004020 conductor Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 2
- 239000007787 solid Substances 0.000 claims description 2
- 230000010354 integration Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000011438 discrete method Methods 0.000 description 1
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Filters And Equalizers (AREA)
Description
【発明の詳細な説明】
本発明は、誘電体層と内部電極層とを積層して
成る積層コンデンサの表面、裏面又は表裏面に導
電体、抵抗体を持つ固体複合電子部品に依り、簡
単な構成で容易に低域通過フイルタを構成できる
固体複合電子部品を提供することを目的とするも
のである。DETAILED DESCRIPTION OF THE INVENTION The present invention utilizes a solid composite electronic component having a conductor and a resistor on the front and back surfaces of a multilayer capacitor formed by laminating a dielectric layer and an internal electrode layer. It is an object of the present invention to provide a solid-state composite electronic component that can easily constitute a low-pass filter.
一般に低域通過フイルタを構成する場合は、第
１図に示すように抵抗体R1，R2とコンデンサC1，
C2，C3とを用いてＲ−Ｃフイルタ回路Ｆを形成
することが知られている。ここでC4は独立端子
１をもつＣフイルタである。なお１〜５はフイル
タ回路Ｆの端子である。 Generally, when configuring a low-pass filter, resistors R 1 and R 2 and capacitors C 1 ,
It is known to form an RC filter circuit F using C 2 and C 3 . Here, C 4 is a C filter having an independent terminal 1. Note that 1 to 5 are terminals of the filter circuit F.
処で、従来は抵抗体R1，R2とコンデンサC1，
C2，C3とを別々につくり、それらを回路結線に
よつて接続することによりＲ−Ｃフイルタ回路Ｆ
を構成していたが、これは、コスト、集積密度、
端子数の点で有効的でないという欠点があつた。 Conventionally, resistors R 1 , R 2 and capacitor C 1 ,
By making C 2 and C 3 separately and connecting them through circuit wiring, an R-C filter circuit F is created.
This consisted of cost, integration density,
The drawback was that it was not effective in terms of the number of terminals.
そこで、従来の回路結線法に代わつて、Ｒ−Ｃ
フイルタ回路Ｆを複合部品として形成する技術が
開発されており、その例として第２図に示す如く
デイスクリート部品で構成したもの、或いは第３
図Ａ，Ｂに示す如く積層コンデンサに同時形成し
たもの等があげられる。しかし、第２図のデイス
クリート法のものは、コスト、集積密度の点で問
題があつた。また第３図Ａ，Ｂは、誘電体層６と
内部電極層７とを積層して積層体８を構成すると
共に、この積層体８の表面、裏面は表裏面に、こ
れよりも著しく低い誘電率を有する絶縁体層９を
形成し、この絶縁体層９の表面に直接導電体１０
抵抗体R1，R2を設け、内部にコンデンサC1，C2，
C3，C4を形成したものであるが、この場合、コ
ンデンサC2と抵抗体電極とを結線する電極端子
ａが必要となり、端子数・集積密度・コスト面で
有効的でなかつた。 Therefore, instead of the conventional circuit wiring method, R-C
Techniques have been developed to form the filter circuit F as a composite component, such as one constructed from discrete components as shown in Figure 2, or one constructed from a third component.
Examples include those formed simultaneously on a multilayer capacitor as shown in Figures A and B. However, the discrete method shown in FIG. 2 had problems in terms of cost and integration density. In addition, FIGS. 3A and 3B show that a dielectric layer 6 and an internal electrode layer 7 are laminated to form a laminate 8, and that the front and back surfaces of this laminate 8 have a significantly lower dielectric potential. A conductor 10 is formed directly on the surface of the insulator layer 9.
Resistors R 1 , R 2 are provided, and capacitors C 1 , C 2 ,
C 3 and C 4 are formed, but in this case, an electrode terminal a is required to connect the capacitor C 2 and the resistor electrode, which is not effective in terms of the number of terminals, integration density, and cost.
本発明は、このような従来の問題点を解消する
ようにしたものである。 The present invention is intended to solve these conventional problems.
以下、図示の実施例について本発明を詳述する
と、第４図Ａ，Ｂは本発明による複合部品の実施
例を示す。これは、表面の抵抗体接続用導電体１
０と接する絶縁体層９の一部又は全部分を除去し
て、この導電体１０が直接誘電体層６に接するよ
うに構成し、該導電体１０と誘電体層６間の内部
電極７との間に静電容量C1，C2，C3を持たせる
ことにより、Ｒ−Ｃフイルタ回路Ｆを同時形成し
たものである。 The invention will now be described in detail with reference to the illustrated embodiments. FIGS. 4A and 4B show embodiments of composite parts according to the invention. This is the conductor 1 for connecting the resistor on the surface.
The conductor 10 is configured to directly contact the dielectric layer 6 by removing part or all of the insulator layer 9 that is in contact with the conductor 10 and the internal electrode 7 between the conductor 10 and the dielectric layer 6. By providing capacitances C 1 , C 2 , and C 3 between them, an RC filter circuit F is simultaneously formed.
このような構成の本発明によれば、内部層にコ
ンデンサC1，C2，C3を形成する必要がなくなり、
またコンデンサC2が同時形成されるため、従来
のコンデンサC2結線用の電極端子ａが不要とな
ることなどから、コストダウン、高集積密度化、
端子数の削減に非常に有効であり、優れた複合電
子部品を提供することができる。 According to the present invention having such a configuration, it is no longer necessary to form capacitors C 1 , C 2 , and C 3 in the internal layer.
In addition, since capacitor C 2 is formed at the same time, the conventional electrode terminal a for connecting capacitor C 2 is no longer required, resulting in cost reduction, high integration density, and
It is very effective in reducing the number of terminals, and can provide excellent composite electronic components.
第１図はＲ−Ｃフイルタ回路の回路図、第２図
はデイスクリート部品で構成した複合部品を示す
平面図、第３図Ａは積層コンデンサに同時形成し
た複合部品を示す平面図、同Ｂは同断面図、第４
図Ａは本発明の一実施例を示す複合部品の断面
図、同Ｂは同平面図である。
６は誘電体層、７は内部電極層、８は積層体、
９は絶縁体層、１０は導電体、R1，R2は抵抗体、
C1〜C4はコンデンサ、ＦはＲ−Ｃフイルタ回路
である。
Figure 1 is a circuit diagram of an R-C filter circuit, Figure 2 is a plan view showing a composite component made up of discrete components, Figure 3 A is a plan view showing a composite component formed simultaneously on a multilayer capacitor, and Figure 3 B is a plan view showing a composite component formed simultaneously with a multilayer capacitor. is the same cross-sectional view, the fourth
Figure A is a sectional view of a composite part showing an embodiment of the present invention, and Figure B is a plan view thereof. 6 is a dielectric layer, 7 is an internal electrode layer, 8 is a laminate,
9 is an insulator layer, 10 is a conductor, R 1 and R 2 are resistors,
C1 to C4 are capacitors, and F is an RC filter circuit.
Claims (1)
た少なくともひとつのコンデンサ機能を有する積
層体の表面・裏面又は表裏面に、該積層体より著
しく低い誘電率を有する絶縁体層を設け、この絶
縁体層の表面に直接導電体・抵抗体を形成して成
るCR複合電子部品において表面の導電体と接す
る絶縁体層の一部又は全部分を除去して、該導電
体が直接誘電体層に接するように構成し、この部
分と誘電体層間の内部電極との間に静電容量を持
たせることによりＲ−Ｃフイルタ回路を同時に構
成したことを特徴とする固体複合電子部品。1. An insulating layer having a dielectric constant significantly lower than that of the laminate is provided on the front and back surfaces or the front and back surfaces of a laminate having at least one capacitor function and configured by laminating a dielectric layer and an internal electrode layer, In CR composite electronic components in which a conductor/resistor is formed directly on the surface of this insulator layer, a part or all of the insulator layer in contact with the surface conductor is removed, so that the conductor is directly connected to the dielectric. What is claimed is: 1. A solid composite electronic component characterized in that an R-C filter circuit is simultaneously configured by being configured so as to be in contact with the dielectric layer and providing capacitance between this portion and an internal electrode between the dielectric layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP217182A JPS58119624A (en) | 1982-01-08 | 1982-01-08 | Solid state composite electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP217182A JPS58119624A (en) | 1982-01-08 | 1982-01-08 | Solid state composite electronic part |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58119624A JPS58119624A (en) | 1983-07-16 |
| JPH0118572B2 true JPH0118572B2 (en) | 1989-04-06 |
Family
ID=11521912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP217182A Granted JPS58119624A (en) | 1982-01-08 | 1982-01-08 | Solid state composite electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58119624A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6197825U (en) * | 1984-12-04 | 1986-06-23 | ||
| JPS61196518U (en) * | 1985-05-28 | 1986-12-08 | ||
| JP2504301B2 (en) * | 1990-07-05 | 1996-06-05 | 株式会社村田製作所 | Composite parts |
| US5430605A (en) * | 1992-08-04 | 1995-07-04 | Murata Erie North America, Inc. | Composite multilayer capacitive device and method for fabricating the same |
| US5227951A (en) * | 1992-08-04 | 1993-07-13 | Murata Erie North America, Inc. | Composite multilayer capacitive device and method for fabricating the same |
-
1982
- 1982-01-08 JP JP217182A patent/JPS58119624A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58119624A (en) | 1983-07-16 |
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