JP2002237429A - Laminated lead-through capacitor and array thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated lead-through capacitor which is capable of expanding a noise elimination frequency band in width and reducing its mounting space in area and mounting cost, and to provide a laminated lead-through capacitor array. SOLUTION: One end of each through electrode pattern 1a and 1b is led out to an input terminal 21 formed on a ceramic laminate 14, the other end of each through electrode pattern 1a and 1b is led out to an output terminal 22 formed on the ceramic laminate 14. Ground electrode patterns 2a and 2b are led out to a ground terminal 23. An electrostatic capacitance C1 is formed between the through electrode pattern 1a and the ground electrode pattern 2a to constitute a lead-through capacitor 3a. An electrostatic capacitance C2(<C1) is formed between the through electrode pattern 1b and the ground electrode pattern 2b to constitute a lead-through capacitor 3b.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer feedthrough capacitor, and more particularly, to a multilayer feedthrough capacitor and a multilayer feedthrough capacitor array which are incorporated in various electronic circuits and used as a noise filter.

[0002]

2. Description of the Related Art FIG. 13 shows the structure of a conventional multilayer feedthrough capacitor of this type. The multilayer feedthrough capacitor 60 includes:
A through electrode pattern 62 formed through a ceramic laminate 61 made of a ceramic dielectric material and penetrating through the ceramic laminate 61, and a ground electrode opposed to the through electrode pattern 62 with a dielectric layer 63 interposed therebetween. Pattern 6
4 are formed. One end of the through electrode pattern 62 is electrically connected to an input terminal 71 formed at the left end of the ceramic laminate 61, and the other end of the through electrode pattern 62 is formed at the right end of the ceramic laminate 61. Output terminal 72. The ground electrode pattern 64 is electrically connected to a ground terminal 73 formed so as to go around the outer periphery of the central portion of the ceramic laminate 61.

[0003] The multilayer feedthrough capacitor 6 having the above configuration
Numeral 0 indicates that the through electrode pattern 62 is connected between the input / output terminals 71 and 72 and the ground electrode pattern 64 is connected to the ground terminal 73 as shown in an equivalent circuit in FIG. A capacitance C is formed between the through electrode pattern 62 and the ground electrode pattern 64. Therefore, the input terminal 7 through the through electrode pattern 62
As for the noise that is going to pass from 1 to the output terminal 72, a frequency component within a noise removal band defined by the capacitance C is bypassed to the ground through the capacitance C.

[0004]

The conventional multilayer feedthrough capacitor 60 has a frequency component of noise removed by one capacitance C formed between the through electrode pattern 62 and the ground electrode pattern 64. Is defined. Therefore, when it is necessary to expand the frequency band of the noise to be removed, for example, as shown in the power supply system of the integrated circuit 74 in FIG. The capacitor 60 was connected in parallel.

However, connecting the two multilayer feed-through capacitors 60 in parallel in this manner requires a large mounting space, increases the number of mounting steps, and increases the cost of the product.

SUMMARY OF THE INVENTION An object of the present invention is to provide a multilayer feedthrough capacitor and a multilayer feedthrough capacitor array in which the noise removal frequency band is expanded and the mounting space and mounting cost are reduced.

[0007]

In order to achieve the above object, a multilayer feed-through capacitor according to the present invention comprises at least two dielectric layers having different capacitances. A capacitor is provided, wherein at least one of the capacitors is a feedthrough capacitor including a through electrode pattern and a ground electrode pattern facing each other with the dielectric layer interposed therebetween.

Here, the capacitors provided in the laminate are electrically connected in parallel between, for example, an input terminal and an output terminal. Further, each of the capacitors may be a feedthrough capacitor. Alternatively, at least one of the capacitors provided in the multilayer body may be a two-terminal capacitor including an internal electrode pattern and a ground electrode pattern that face each other with a dielectric layer interposed therebetween. Further, when different capacitances are provided between the capacitors provided in the laminate, for example, a dielectric layer having a different dielectric constant for each capacitor may be used,
Alternatively, the facing area of the electrode pattern is made different for each capacitor.

[0009] With the above structure, in one laminate,
At least two capacitors having different capacitances are formed. Each of these capacitors has a unique noise removal frequency band characteristic, and the noise removal frequency band can be expanded with one component.

Further, in the multilayer feedthrough capacitor according to the present invention, at least two capacitors provided in the multilayer body are stacked in the thickness direction of the dielectric layer, and an intermediate layer made of an insulator is provided between adjacent capacitors. It is characterized by.
According to the above configuration, when a dielectric material having a different dielectric constant is used for each capacitor, mutual diffusion of the materials of the dielectric layers constituting the capacitors on both sides of the intermediate layer in the intermediate layer, The difference in the contraction rate of the body layer is absorbed.
Thereby, peeling and warpage between layers of the laminate are suppressed.

Further, the multilayer feedthrough capacitor array according to the present invention comprises a plurality of capacitor elements formed by electrically connecting at least two capacitors having mutually different capacitances in parallel between an input terminal and an output terminal. Were arranged in an array in a laminate formed by laminating dielectric layers, and each of the capacitor elements was constituted by a through electrode pattern and a ground electrode pattern facing each other with the dielectric layer interposed therebetween. It is characterized by having at least one feedthrough capacitor. With the above configuration, a through capacitor array having a plurality of built-in capacitor elements having a large noise removal frequency band can be obtained.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a multilayer feedthrough capacitor and a multilayer feedthrough capacitor array according to the present invention will be described below with reference to the accompanying drawings.

[First Embodiment, FIGS. 1 to 5] As shown in FIG. 1, a multilayer feedthrough capacitor 10 includes a dielectric sheet 1 having through-electrode patterns 1a and 1b formed on the surface thereof, respectively.
1a and 11b, and dielectric sheets 12a and 12b each having ground electrode patterns 2a and 2b formed on the surface thereof,
An intermediate sheet 16 disposed between the dielectric sheets 11a and 11b, a dielectric sheet 13 for exterior, and the like are laminated and integrally formed of a ceramic laminate 14 (see FIG. 2). The dielectric sheets 11a and 11b on which the through electrode patterns 1a and 1b are respectively formed are stacked with the intermediate sheet 16 interposed therebetween. Above the dielectric sheet 11a and 11b, the dielectric sheet 12a on which the ground electrode pattern 2a is formed and the dielectric for exterior are provided. The body sheet 13 is laminated. Under the dielectric sheet 11b, a dielectric sheet 12b on which the ground electrode pattern 2b is formed and a dielectric sheet 13 for exterior are laminated.

The dielectric sheets 11a, 11b, 12a, 1
Each of 2b and 13 is made of a ceramic dielectric material. However, the ceramic dielectric material of the dielectric sheets 11a and 12a is different from the ceramic dielectric material of the dielectric sheets 11b and 12b, and has a different dielectric constant. That is, in the first embodiment, the ceramic dielectric material of the dielectric sheets 11a and 12a has a larger dielectric constant than the ceramic dielectric material of the dielectric sheets 11b and 12b in order to remove noise in a low frequency band. Ceramic materials are used.

[0015] As shown in FIG.
a, 1b is electrically connected to an output terminal 22 formed at the right end of the ceramic laminate 14, and the other end of each of the through electrode patterns 1a, 1b is connected to the other end of the ceramic laminate 14. It is electrically connected to an input terminal 21 formed at the left end. Each of the ground electrode patterns 2a and 2b is electrically connected to a ground terminal 23 formed so as to go around the outer periphery of the central portion of the ceramic laminate 14 through the lead portions 2ac and 2bc drawn toward the near side and the far side. It is connected.

In the multilayer feedthrough capacitor 10 having the above structure, as shown in an equivalent circuit of FIG. 3, two through electrode patterns 1a and 1b are connected between the input / output terminals 21 and 22, and two Ground electrode patterns 2a, 2
b is connected to the ground terminal 23. The capacitance C1 is formed between the through electrode pattern 1a and the ground electrode pattern 2a, and constitutes one through capacitor 3a. Similarly, the capacitance C2 is also formed between the through electrode pattern 1b and the ground electrode pattern 2b, and constitutes another through capacitor 3b. Accordingly, the feedthrough capacitors 3a and 3b constitute a parallel circuit.

Therefore, the noise that is going to pass from the input terminal 21 to the output terminal 22 through the through electrode patterns 1a and 1b has a frequency component within a noise removal band defined by the capacitances C1 and C2. These capacitors 3a and 3b are bypassed to ground. As described above, the dielectric sheets 11a and 12a forming the feedthrough capacitor 3a are made of a ceramic material having a higher dielectric constant than the dielectric sheets 11b and 12b forming the feedthrough capacitor 3b. Therefore, C1> C2.

That is, in the multilayer feedthrough capacitor 10, capacitors 3a and 3b having different capacitances C1 and C2 are formed in one ceramic laminate 14. Each of these capacitors 3a and 3b is shown in FIG.
Respectively, as shown by h1 and h2, the capacitance C
1 and C2 have different noise removal characteristics. The total noise elimination characteristics of the multilayer feedthrough capacitor 10 are shown in FIG. 5 where these noise elimination characteristics are superimposed.
As shown by, the noise removal frequency band is expanded. Therefore, according to the first embodiment, the multilayer feedthrough capacitor 1 having a small size and a wide noise removal frequency band is provided.
0 can be obtained.

In the first embodiment, the feedthrough capacitors 3a and 3b have a structure in which the sheets 11a to 13b are stacked in the thickness direction. An intermediate sheet 16 is arranged between the adjacent feedthrough capacitors 3a and 3b. That is, the intermediate sheet 16 made of an insulating material (for example, a glass ceramic material) is disposed between the dielectric sheet 11a on which the through electrode pattern 1a is formed and the dielectric sheet 11b on which the through electrode pattern 1b is formed. This intermediate sheet 16 is made of another dielectric sheet 11a,
It is formed thinner than 11b, 12a, 12b and the like.
Then, the material of the upper dielectric sheets 11a and 12a and the lower dielectric sheet 1 are formed by the intermediate sheet 16.
The materials 1b and 12b are made to absorb the difference between the diffusion and the shrinkage. For this reason, the peeling and warping at the joining portions of the dielectric sheets 11a and 11b of different materials are absorbed, and a highly reliable and high quality multilayer feedthrough capacitor can be obtained.

[Second Embodiment, FIG. 6] As shown in FIG. 6, the multilayer feedthrough capacitor 10a is a multilayer feedthrough capacitor 10a according to the first embodiment described with reference to FIGS.
, The dielectric sheets 11a, 11b, 12a, 12
Each of b and 13 is made of the same ceramic dielectric material and has the same dielectric constant. The ground electrode pattern 2a and the penetrating electrode pattern 1a have opposing areas for removing noise in a low frequency band. Is larger than the facing area of the ground electrode pattern 2b and the through electrode pattern 1b.

As a result, the ceramic laminate 14 can be made of the same ceramic material, and the occurrence of peeling and warpage between the layers of the ceramic laminate 14 can be suppressed without using the intermediate sheet 16. In FIG. 6, portions corresponding to those in FIG. 1 are denoted by the same reference numerals, and duplicate description will be omitted.

[Third Embodiment, FIGS. 7 to 9] As shown in FIGS. 7 and 8, the multilayer feedthrough capacitor 10b is a multilayer feedthrough capacitor of the first embodiment described with reference to FIGS. In the feedthrough capacitor 10, an internal electrode pattern 1c is formed instead of the feedthrough electrode pattern 1b.

The multilayer feedthrough capacitor 10b includes an internal electrode pattern 1c and a ground electrode pattern 2 opposed thereto.
b and the dielectric sheet 11b located between
A terminal capacitor 3c is formed, and has an equivalent circuit as shown in FIG. The two-terminal capacitor 3c is electrically connected to the input terminal 21 and has a capacitance C3 (>
C1). And this two-terminal capacitor 3
c is provided with a noise removal function in a low frequency band, and the feedthrough capacitor 3a is provided with a noise removal function in a high frequency band, thereby further expanding the band of the noise removal frequency.

The reason why the two-terminal capacitor 3c has the function of removing noise in the low-frequency band is that the effect of the residual inductance is small in the low-frequency band, and the two-terminal capacitor 3c has a relatively large residual inductance. This is because no significant difference appears in the removability.

In the third embodiment, the two-terminal capacitor 3c is arranged below the ceramic laminate 14 so as to be close to the ground, so that residual inductance is hardly generated. 7 and FIG. 8, parts corresponding to those in FIG. 1 and FIG. 2 are denoted by corresponding reference numerals, and redundant description will be omitted.

[Fourth Embodiment, FIGS. 10 to 12] In a fourth embodiment, a multilayer feedthrough capacitor array will be described. As shown in FIG. 10, the multilayer feedthrough capacitor array 30 has through electrode patterns 35 a to 37 a and 35 b to 3.
Dielectric sheets 31a, 3 each having a surface 7b formed thereon
1b, dielectric sheets 32a and 32b having ground electrode patterns 38a and 38b formed on the surface thereof, and an intermediate sheet 33 disposed between the dielectric sheets 31a and 31b.
And a dielectric sheet (not shown) for exterior and the like are laminated,
Ceramic laminate 50 integrally fired (see FIG. 11)
It is composed of Through electrode patterns 35a to 37
a, and the dielectric sheets 31a and 31b on which 35b to 37b are respectively formed are stacked with the intermediate sheet 33 interposed therebetween.
On the upper side, a dielectric sheet 32a on which a ground electrode pattern 38a is formed and a dielectric sheet for exterior are laminated. On the lower side of the dielectric sheet 31b,
The dielectric sheet 32b on which the ground electrode pattern 38b is formed and the dielectric sheet for exterior are laminated.

The dielectric sheets 31a, 31b, 32a, 3
Each of 2b is made of a ceramic dielectric material. However, the ceramic dielectric material of the dielectric sheets 31a and 32a is different from the ceramic dielectric material of the dielectric sheets 31b and 32b, and their dielectric constants are different. That is, in the fourth embodiment, the ceramic dielectric material of the dielectric sheets 31a and 32a is used to remove noise in a low frequency band.
Ceramic materials having a higher dielectric constant than the ceramic dielectric materials b and 32b are used.

As shown in FIG. 11, the through electrode pattern 3
One end of each of 5a and 35b is electrically connected to an output terminal 51b formed on the right end of ceramic laminate 50. The other end of each of through electrode patterns 35a and 35b is It is electrically connected to an input terminal 51a formed at the left end. Similarly, one end of each of the through electrode patterns 36a and 36b is connected to the output terminal 5
2b, and the other end is electrically connected to the input terminal 52a. Also, the through electrode patterns 37a,
One end of each of the terminals 37b is electrically connected to the output terminal 53b, and the other end is electrically connected to the input terminal 53a.

Ground electrode patterns 38a and 38b
Are electrically connected to a ground terminal 55 formed so as to go around the outer periphery of the central portion of the ceramic laminate 50 through a lead portion drawn toward the front side and the back side.

As shown in the equivalent circuit of FIG. 12, the multilayer feed-through capacitor array 30 having the above-described structure has two through-electrode patterns 35 between the input / output terminals 51a and 51b.
a and 35b are connected, and the two ground electrode patterns 38a and 38b are connected to the ground terminal 55. The capacitance C1 is formed between the through electrode pattern 35a and the ground electrode pattern 38a, and constitutes one through capacitor 41a. Similarly, the through electrode pattern 35b and the ground electrode pattern 3
A capacitance C2 (<C1) is also formed between the capacitors 8b, and constitutes another feedthrough capacitor 41b.
The feedthrough capacitors 41a and 41b are connected in parallel to form a capacitor element 46.

Two through electrode patterns 36a and 36b are connected between the input / output terminals 52a and 52b. A capacitance C1 is formed between the through electrode pattern 36a and the ground electrode pattern 38a.
This constitutes one feedthrough capacitor 42a. Similarly,
Through electrode pattern 36b and ground electrode pattern 38b
The capacitance C2 (<C1) is also formed between them, and constitutes another feedthrough capacitor 42b. The feedthrough capacitors 42a and 42b are connected in parallel to form a capacitor element 47.

Further, two through electrode patterns 37a and 37b are connected between the input / output terminals 53a and 53b. A capacitance C1 is formed between the through electrode pattern 37a and the ground electrode pattern 38a.
One feedthrough capacitor 43a is configured. Similarly,
Through electrode pattern 37b and ground electrode pattern 38b
The capacitance C2 (<C1) is also formed between them, and constitutes another feedthrough capacitor 43b. The feedthrough capacitors 43a and 43b are connected in parallel to form a capacitor element 48.

That is, the multilayer feedthrough capacitor array 30
Are capacitors 41a to 41a having different capacitances C1 and C2 in one ceramic laminate 50, respectively.
3a, capacitor element 4 composed of 41b to 43b
6 to 48 are formed. Each of these capacitor elements 46 to 48 has an expanded noise removal frequency band. Therefore, according to the fourth embodiment, the multilayer feedthrough capacitor array 30 having a small size and a wide noise removal frequency band can be obtained.

In the fourth embodiment, the capacitance C is varied by changing the dielectric constant of the ceramic dielectric material.
1 and C2 are different from each other, but the present invention is not limited to this. The capacitances C1 and C2 can be changed by changing the facing areas of the facing electrode patterns or the thickness of the dielectric sheet. It may be different.

The chip size of the feedthrough capacitor array 30 containing three elements is almost the same as the chip size of the feedthrough capacitor containing one element. 1. Capacitor
The dimension may be five to two times as large. Further, although the shapes of the through electrode patterns 35a to 37b and the ground electrode patterns 38a and 38b of the through capacitor array 30 are all linear, the through electrode pattern may be meandering, spiral, or spiral. A wide cross may be used. Further, the through electrode pattern and the ground electrode pattern may be opposed to each other in substantially the same shape. For example, this is a case where a meandering through electrode pattern and a meandering ground electrode pattern face each other.

[Other Embodiments] The present invention is not limited to the above embodiment, but can be variously modified within the scope of the gist.

For example, three or more capacitors may be formed inside one ceramic laminate. When there are three or more capacitors, the dielectric constant of the dielectric layer does not need to be different for each capacitor. For example, the dielectric constant of any two capacitors may be the same.

In the first embodiment, the through electrode patterns 1a and 1b or the internal electrode patterns 1c are linear and the ground electrode patterns 2a and 2b are cross-shaped. If you are satisfied, you are not limited to this shape.

Further, in the above embodiment, the dielectric sheets on which the electrode patterns are formed are laminated and then integrally fired, but the invention is not necessarily limited to this. A dielectric sheet that has been fired in advance may be used. Further, a multilayer feedthrough capacitor may be manufactured by a manufacturing method described below. After forming a dielectric layer with a paste-like dielectric material by a method such as printing, a paste-like conductive material is applied to the surface of the dielectric layer to form an electrode pattern. Next, a paste-like dielectric material is applied from above to form a dielectric layer. Similarly, a feedthrough capacitor having a laminated structure can be obtained by successively coating.

[0040]

As is apparent from the above description, according to the present invention, a plurality of capacitors having different capacitances are formed in one laminated body, and each of these capacitors corresponds to the capacitance. Therefore, the total noise elimination characteristics are superimposed on these noise elimination characteristics, so that a multilayer feedthrough capacitor or a multilayer feedthrough capacitor array having a small and wide noise elimination frequency band can be used. Obtainable.

Further, by stacking at least two capacitors provided in the laminate in the thickness direction of the dielectric layer and providing an intermediate layer made of an insulator between adjacent capacitors, each capacitor has a different dielectric constant. When the dielectric material is used, the intermediate layer can absorb the mutual diffusion of the materials of the dielectric layers constituting the capacitors on both sides thereof, and the difference in the contraction rate of the dielectric layer, Peeling and warpage between the layers of the multilayer body are absorbed, so that a multilayer feedthrough capacitor or a multilayer feedthrough capacitor array having high quality and high reliability can be obtained.

Further, by making the facing areas of the electrode patterns different for each capacitor, the entire laminate can be made of the same dielectric material, and there is no occurrence of peeling or warpage between layers of the laminate and reliability. A multilayer feed-through capacitor or a multilayer feed-through capacitor array having high quality and good quality can be obtained.

Further, by forming a two-terminal capacitor, the two-terminal capacitor can be provided with a noise removing function in a low frequency band, and the noise removing frequency band can be expanded.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing the configuration of a first embodiment of a multilayer feedthrough capacitor according to the present invention.

FIG. 2 is a partially cutaway perspective view of the multilayer feedthrough capacitor shown in FIG. 1;

FIG. 3 is an electrical equivalent circuit diagram of the multilayer feedthrough capacitor shown in FIG. 2;

FIG. 4 is a graph showing frequency-impedance characteristics of each of the capacitors incorporated in the multilayer feedthrough capacitor shown in FIG. 2;

FIG. 5 is a graph showing the overall frequency-impedance characteristics of the multilayer feedthrough capacitor shown in FIG. 2;

FIG. 6 is an exploded perspective view showing a configuration of a multilayer feedthrough capacitor according to a second embodiment of the present invention.

FIG. 7 is an exploded perspective view showing a configuration of a multilayer feedthrough capacitor according to a third embodiment of the present invention.

FIG. 8 is a longitudinal sectional view of the multilayer feedthrough capacitor shown in FIG. 7;

FIG. 9 is an electric equivalent circuit diagram of the multilayer feedthrough capacitor shown in FIG. 8;

FIG. 10 is an exploded perspective view showing a configuration of a multilayer feedthrough capacitor array according to the present invention.

FIG. 11 is an external perspective view of the multilayer feedthrough capacitor array shown in FIG. 10;

FIG. 12 is an electric equivalent circuit diagram of the multilayer feedthrough capacitor array shown in FIG. 11;

FIG. 13 is a longitudinal sectional view showing a configuration of a conventional multilayer feedthrough capacitor.

14 is an electrical equivalent circuit diagram of the multilayer feedthrough capacitor shown in FIG.

FIG. 15 is an explanatory diagram of a conventional multilayer feedthrough capacitor.

[Explanation of symbols]

 1a, 1b: Through electrode pattern 1c: Internal electrode pattern 2a, 2b: Ground electrode pattern 3a, 3b: Through capacitor 3c: Two-terminal capacitor 10, 10a, 10b: Multilayer type through capacitor 11a, 11b, 12a, 12b, 13 ... Dielectric sheet 14 Ceramic laminate 16 Intermediate sheet 21, 22 Input / output terminal 23 Ground terminal 30 Multilayer feedthrough capacitor array 31a, 31b, 32a, 32b Dielectric sheet 33 Intermediate sheet 35a to 37a, 35b ... 37b ... through-electrode pattern 38a, 38b ... ground electrode pattern 41a-43a, 41b-43b ... through capacitor 46-48 ... capacitor element 50 ... ceramic laminate 51a-53a, 51b-53b ... input / output terminal 55 ... ground terminal C1 ~ C3 ... Capacitance

Claims (8)

[Claims] 1. A laminated body formed by laminating dielectric layers, wherein at least two capacitors having different capacitances are provided, and at least one of the capacitors faces each other with the dielectric layer interposed therebetween. Characterized in that it is a feedthrough capacitor comprising a through electrode pattern and a ground electrode pattern. 2. The multilayer feed-through according to claim 1, wherein at least two capacitors provided in the multilayer body are electrically connected in parallel between an input terminal and an output terminal. Capacitors. 3. The multilayer feedthrough capacitor according to claim 1, wherein at least two capacitors provided in the multilayer body are feedthrough capacitors. 4. A capacitor according to claim 1, wherein at least one of the capacitors provided in the multilayer body is a two-terminal capacitor including an internal electrode pattern and a ground electrode pattern facing each other with the dielectric layer interposed therebetween. The multilayer feedthrough capacitor according to claim 1 or 2, wherein 5. The capacitor according to claim 1, wherein the dielectric layers have different dielectric constants.
8. The multilayer feedthrough capacitor according to any one of the above. 6. A method according to claim 1, wherein at least two capacitors provided in the laminate have a structure in which the capacitors are stacked in a thickness direction of the dielectric layer, and an intermediate layer made of an insulator is provided between adjacent capacitors. The multilayer feedthrough capacitor according to claim 5, wherein: 7. The multilayer feed-through capacitor according to claim 1, wherein the capacitors have different facing areas of electrode patterns facing each other. 8. A laminate comprising a plurality of capacitor elements formed by electrically connecting at least two capacitors having mutually different capacitances in parallel between an input terminal and an output terminal by stacking dielectric layers. Arranged in an array in the body, each of the capacitor elements has at least one feedthrough capacitor formed of a through electrode pattern and a ground electrode pattern facing each other with the dielectric layer interposed therebetween. A multilayer feedthrough capacitor array characterized by the following.