JP7081734B2 - Array type laminated ceramic electronic components and their mounting boards - Google Patents

Description

The present invention relates to an array type laminated ceramic electronic component and a mounting substrate thereof.

Electronic components that use ceramic materials include capacitors, inductors, piezoelectric elements, varistor, and thermistors.

Among the above-mentioned ceramic electronic components, multilayer ceramic capacitors (MLCCs, Multi-Layered Ceramic Capacitors) have the advantages of being compact, guaranteeing high capacity, and being easy to mount.

The laminated ceramic capacitors include video equipment such as liquid crystal displays (LCD, Liquid Crystal Display) and plasma display panel (PDP, Plasma Display Panel), computers, personal portable terminals (PDA, Personal Digital Assistants), and mobile phones. It is a chip-type capacitor that is mounted on the circuit board of various electronic products such as, and plays a role of charging or discharging electricity.

Such a laminated ceramic capacitor is manufactured by alternately laminating a plurality of dielectric layers and internal electrodes to form a laminated body, then firing the laminated body, and installing an external electrode. Generally, the capacity of the product is determined by the number of laminated internal electrodes.

On the other hand, in order to mount the multilayer ceramic capacitor on a printed circuit board, a certain area is required.

At this time, when a plurality of multilayer ceramic capacitors having various electrical characteristics are mounted on one printed circuit board, a certain space must be secured in order for each multilayer ceramic capacitor to operate normally. ..

Recently, with the trend of miniaturization of electronic products, ultra-miniaturization and ultra-high capacity are required for multilayer ceramic capacitors used in such electronic products.

However, when electronic products are slimmed down and miniaturized, the space in which multilayer ceramic capacitors can be mounted is limited, which makes product design difficult.

That is, when mounting a plurality of multilayer ceramic capacitors having various electrical characteristics together on one printed circuit board, there is a limit to reducing the size of electronic products.

Korean Publication No. 10-2005-0044083

An object of the present invention is to provide an array type laminated ceramic electronic component and a mounting substrate thereof.

In one embodiment of the present invention, a plurality of first dielectric layers and a plurality of second dielectric layers are laminated in the thickness direction, and the first and second main surfaces facing the thickness direction and the width direction are formed. A ceramic body having first and second side surfaces facing each other and first and second end faces facing each other in the length direction, and one first dielectric layer formed on the plurality of first dielectric layers. A third internal electrode formed on the plurality of second dielectric layers and arranged so as to face each other via one second dielectric layer and the first and second internal electrodes arranged so as to face each other. And the fourth internal electrode, the first external electrode formed on the first end surface of the ceramic body and connected to the first internal electrode, and the second internal electrode formed on the first side surface of the ceramic body. The second external electrode to be connected, the third external electrode formed on the second end surface of the ceramic body and connected to the third internal electrode, and the fourth inner surface formed on the second side surface of the ceramic body. It is possible to provide an array type laminated ceramic electronic component including a fourth external electrode connected to the electrode.

The first dielectric layer, the first and second internal electrodes can form a first capacitor portion, and the second dielectric layer, the third and fourth internal electrodes can form a second capacitor portion.

The second dielectric layer can be arranged below the first dielectric layer in the thickness direction.

The first internal electrode includes a first lead portion drawn out to the first end surface, the second internal electrode includes a second lead portion drawn out to the first side surface, and the third internal electrode includes the first lead portion. The second end surface may include a third lead portion drawn out, and the fourth internal electrode may include a fourth lead portion drawn out on the second side surface.

The number of layers of the first dielectric layer and the number of layers of the second dielectric layer can be different.

The first dielectric layer and the second dielectric layer can contain different materials.

The thicknesses of the first dielectric layer and the second dielectric layer can be different.

Another embodiment of the present invention is arranged at the lower portion in the thickness direction of the first capacitor portion including the plurality of first dielectric layers, the first and second internal electrodes, and the first capacitor portion, and the plurality of first embodiments are present. A hexahedron-shaped composite in which a two dielectric layer and a second capacitor portion including the third and fourth internal electrodes are coupled, and a hexahedral composite formed on the first end surface of the composite and connected to the first internal electrode. The first signal electrode, the first ground electrode formed on the first side surface of the complex and connected to the second internal electrode, and the second end surface of the complex formed and connected to the third internal electrode. It is possible to provide an array type laminated ceramic electronic component including a second signal electrode to be formed and a second ground electrode formed on the second side surface of the composite and connected to the fourth internal electrode.

The lowermost internal electrode of the first capacitor portion may be the second internal electrode, and the uppermost internal electrode of the second capacitor portion may be the fourth internal electrode.

The innermost electrode at the lowermost end of the first capacitor portion is the second internal electrode, the innermost electrode at the uppermost end of the second capacitor portion is the fourth internal electrode, and the innermost electrode at the lowermost end of the first capacitor portion and the first 2 The internal electrodes at the uppermost end of the capacitor portion can face each other via the monodielectric layer.

The first capacitor section and the second capacitor section can operate independently of each other.

The first capacitor section and the second capacitor section can have different capacities.

The current direction of the first capacitor section and the current direction of the second capacitor section can be opposite to each other.

The first and second internal electrodes are formed on a plurality of first dielectric layers so as to face each other via one first dielectric layer, and the third and fourth internal electrodes are one second dielectric. It can be formed on a plurality of second dielectric layers so as to face each other via the layer.

The first internal electrode includes a first lead portion drawn out to the first end surface, the second internal electrode includes a second lead portion drawn out to the first side surface, and the third internal electrode includes the first lead portion. The second end surface may include a third lead portion drawn out, and the fourth internal electrode may include a fourth lead portion drawn out on the second side surface.

In another embodiment of the present invention, the first capacitor unit that stabilizes the first power source supplied from the battery and supplies it to the power management unit is arranged below the first capacitor unit and the power management unit. A hexahedral composite in which a second capacitor unit that receives and stabilizes the second power supply converted in the above and supplies a drive power supply is coupled, and a battery formed on the first end surface of the composite. The first signal electrode connected to the first power source and transmitted to the first capacitor unit, and the second power source formed on the second end surface of the composite and connected to the power management unit to transfer the second power source to the second power supply unit. A second signal electrode transmitted to the capacitor portion, a first grounding electrode formed on the first side surface of the composite and for grounding the first capacitor portion, and a second ground electrode formed on the second side surface of the composite. It is possible to provide an array type laminated ceramic electronic component including a second grounding electrode for grounding a capacitor portion.

The first capacitor section may include a plurality of first dielectric layers, first and second internal electrodes, and the second capacitor section may include a plurality of second dielectric layers, third and fourth internal electrodes. ..

The first internal electrode is connected to the first signal electrode, the second internal electrode is connected to the first ground electrode, the third internal electrode is connected to the second signal electrode, and the fourth internal electrode is connected. Can be connected to the second ground electrode.

The lowermost internal electrode of the first capacitor portion may be the second internal electrode, and the uppermost internal electrode of the second capacitor portion may be the fourth internal electrode.

Another embodiment of the present invention includes a first capacitor unit that receives and stabilizes a first power source converted by a power management unit that converts a voltage supplied from a battery, and supplies a drive power source. A hexahedron-shaped composite in which a second capacitor unit that receives and stabilizes a second power supply converted by the power management unit and supplies a drive power supply is coupled, and a first end surface of the composite are formed. , The first signal electrode connected to the power management unit and transmitting the first power supply to the first capacitor unit, and the second end surface of the composite formed and connected to the power management unit. A second signal electrode that transmits power to the second capacitor section, a first grounding electrode formed on the first side surface of the composite, and a grounding electrode for grounding the first capacitor section, and a second side surface of the complex. It is possible to provide an array type laminated ceramic electronic component including a second grounding electrode formed and for grounding the second capacitor portion.

Yet another embodiment of the present invention is a printed circuit board having three or more electrode pads on the upper part, an array type laminated ceramic capacitor installed on the printed circuit board, and the electrode pads and the array type laminated. It is possible to provide a mounting board of an array type laminated ceramic electronic component including a solder for connecting ceramic electronic components.

According to one embodiment of the present invention, the substrate mounting area of an element can be reduced by coupling a plurality of capacitor portions having different capacities to one ceramic body.

Further, according to one embodiment of the present invention, the thickness of the ceramic body can be reduced and the parasitic capacitance can be easily controlled by omitting the buffer layer between the plurality of capacitors.

According to one embodiment of the present invention, the equivalent series inductance can be reduced by making the current directions of the first and second capacitors opposite to each other.

It is a perspective view schematically showing the array type laminated ceramic electronic component by one Embodiment of this invention. It is sectional drawing which follows the AA'line of FIG. It is a perspective view which showed the ceramic body of the array type laminated ceramic electronic component by one Embodiment of this invention. It is an exploded perspective view of the ceramic body of the array type laminated ceramic electronic component by one Embodiment of this invention. 2 is a cross-sectional view taken along the line BB'and CC'of FIG. 2 is a cross-sectional view taken along the line DD'and EE' in FIG. 2. It is a cross-sectional view taken along the line AA'in FIG. 1, and is the drawing which showed the 1st capacitor part and the 2nd capacitor part. It is a top view for showing the current path of the array type laminated ceramic electronic component by one Embodiment of this invention. It is a drawing for demonstrating the connection structure with the circuit wiring of the array type laminated ceramic electronic component by one Embodiment of this invention. It is a perspective view schematically showing the shape which the array type laminated ceramic electronic component by one Embodiment of this invention was mounted on a printed circuit board. FIG. 9 is a plan view of FIG. It is a circuit diagram which showed the drive power supply system by another embodiment of this invention. It is a circuit diagram which showed the drive power supply system by still another Embodiment of this invention.

Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the invention can be transformed into various other embodiments, and the scope of the invention is not limited to the embodiments described below. Also, embodiments of the invention are provided to more fully explain the invention to those with average knowledge in the art. Therefore, the shape and size of the elements in the drawings may be exaggerated for a clearer explanation.

Hereinafter, an array-type laminated ceramic electronic component according to an embodiment of the present invention, particularly an array-type laminated ceramic capacitor, will be described as an example, but the present invention is not limited thereto.

Array type laminated ceramic electronic component 100

1 is a perspective view schematically showing an array-type laminated ceramic electronic component 100 according to an embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line AA'of FIG. 1, and FIG. 3 is a cross-sectional view. FIG. 4 is a perspective view showing a ceramic body of an array-type laminated ceramic electronic component according to an embodiment of the present invention, and FIG. 4 is an exploded perspective view of a ceramic body of an array-type laminated ceramic electronic component according to an embodiment of the present invention.

In the array type laminated ceramic electronic component according to the embodiment of the present invention, the "length direction" is the "L" direction, the "width direction" is the "W" direction, and the "thickness direction" is the "T" direction. Define. Here, the "thickness direction" can be used in the same concept as the direction in which the dielectric layers of electronic products are stacked, that is, the "stacking direction".

Referring to FIGS. 1 to 4, in the array-type laminated ceramic electronic component 100 according to the embodiment of the present invention, a plurality of first dielectric layers 111a and a plurality of second dielectric layers 111b are laminated in the thickness direction. The first and second main surfaces 1 and 2 which are formed and face each other in the thickness direction, the first and second side surfaces 3 and 4 which face each other in the width direction, and the first and second end faces 5 and 6 which face each other in the length direction. The ceramic main body 110 having the above, and the first and second internal electrodes 121 and 122 formed on the plurality of first dielectric layers 111a and arranged so as to face each other via one first dielectric layer. The third and fourth internal electrodes 123 and 124 formed on the plurality of second dielectric layers 111b and arranged so as to face each other via one second dielectric layer, and the first end surface of the ceramic body. A first external electrode 131 formed in 5 and connected to the first internal electrode 121, and a second external electrode 132 formed on the first side surface 3 of the ceramic body 3 and connected to the second internal electrode 122. , A third external electrode 133 formed on the second end surface 6 of the ceramic body and connected to the third internal electrode 123, and formed on the second side surface 4 of the ceramic body 4 and connected to the fourth internal electrode 124. The fourth external electrode 134 and the like can be included.

In one embodiment of the present invention, the shape of the ceramic body 110 is not particularly limited, but can have, for example, a hexahedron shape as shown in the drawings.

In one embodiment of the present invention, the ceramic body 110 has first and second main surfaces 1 and 2 facing in the thickness (T) direction, and first and second side surfaces 3 and 4 facing the width (W) direction. And can have first and second end faces 5, 6 facing in the length (L) direction, the first and second main faces can also be shown on the upper and lower surfaces of the ceramic body 110.

Further, without being limited to this, when the thickness of the ceramic body is Tb and the width of the ceramic body is Wb, Tb> Wb can be obtained. When the ceramic body satisfies Tb> Wb, a high-capacity array-type laminated ceramic electronic component can be provided by increasing the number of laminated dielectric layers and internal electrodes.

According to one embodiment of the present invention, the raw materials for forming the first and second dielectric layers 111a and 111b are not particularly limited as long as a sufficient capacitance can be obtained. For example, it may be barium titanate (BaTIO ₃ ) powder.

The materials forming the first and second dielectric layers 111a and 111b are powders such as barium titanate (BaTIO ₃ ), transition metal oxides or carbides, rare earth elements, and magnesium (Mg), depending on the object of the present invention. ), Various kinds of additives such as aluminum (Al), organic solvents, plasticizers, binders, dispersants and the like can be added.

As shown in FIGS. 2 and 4, the plurality of second dielectric layers 111b can be formed below the plurality of first dielectric layers 111a. That is, after the plurality of second dielectric layers are laminated in the thickness direction, the plurality of first dielectric layers are laminated again in the thickness direction on the upper portion of the laminated second dielectric layers in the thickness direction. Can be done.

Referring to FIG. 4, a dielectric layer on which no internal electrode is formed is laminated on the upper portion of the first dielectric layer 111a in the thickness direction and the lower portion of the second dielectric layer 111b in the thickness direction. It is possible to form the upper cover layer and the lower cover layers 112 and 113 of the ceramic body, respectively.

The material forming the first to fourth internal electrodes 121, 122, 123, 124 is not particularly limited, but is, for example, a noble metal material such as palladium (Pd), a palladium-silver (Pd-Ag) alloy, and nickel (Ni). ), It can be formed by using a conductive paste composed of one or more substances of copper (Cu).

The first internal electrode 121 and the second internal electrode 122 can be laminated so as to face each other via the first dielectric layer 111a, and the third internal electrode 123 and the fourth internal electrode 124 are the second. It can be laminated so as to face each other via the dielectric layer 111b.

The first external electrode 131 is connected to the first internal electrode 121 and can be formed on the first end surface 5 of the ceramic body 110, and the second external electrode 132 is different from the first external electrode. It is polarly connected to the second internal electrode 122 and can be formed on the first side surface 3 of the ceramic body 110.

The third external electrode 133 can have the same polarity as the first external electrode, can be connected to the third internal electrode 123, and can be formed on the second end surface 6 of the ceramic body 110. The fourth external electrode 134 can be connected to the fourth internal electrode 124 with a polarity different from that of the third external electrode, and can be formed on the second side surface 4 of the ceramic body 110.

The first to fourth external electrodes 131, 132, 133, and 134 can be extended to at least a part of the second main surface, which is a mounting surface, for ease of substrate mounting.

The first external electrode 131 can be extended from the first end surface 5 to the first and second main surfaces 1 and 2 and the first and second side surfaces 3 and 4 while covering the angle in contact with the first end surface. .. Further, the third external electrode 133 is extended from the second end surface 6 to the first and second main surfaces 1 and 2 and the first and second side surfaces 3 and 4 while covering the angle in contact with the second end surface. Can be done.

The second external electrode 132 and the fourth external electrode 134 have polarities different from those of the first and third external electrodes 131 and 133, and are separated from the first external electrode and the third external electrode 131 and 133 by a predetermined distance. It can be arranged between the first external electrode and the third external electrode.

The second external electrode 132 can be formed on the first side surface 3 and can be extended from the first side surface 3 to the first and second main surfaces 1 and 2. Further, the fourth external electrode 134 can be formed on the second side surface 4, and can be extended from the second side surface 4 to the first and second main surfaces 1 and 2.

The first to fourth external electrodes 131, 132, 133, 134 can be formed of a conductive substance made of the same material as the first to fourth internal electrodes 121, 122, 123, 124. Without limitation, it can be formed of, for example, one or more conductive metals selected from the group consisting of copper (Cu), silver (Ag), nickel (Ni) and alloys thereof.

The first to fourth external electrodes 131, 132, 133, 134 can be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder and then firing. ..

5a and 5b are cross-sectional views taken along the lines BB', CC', DD', and EE' of FIG. 2, and are the first to fourth internal electrodes 121 according to the embodiment of the present invention. , 122, 123, 124 are plan views showing the shapes. Further, FIG. 6 is a cross-sectional view taken along the line AA'of FIG. 1, showing the first capacitor portion and the second capacitor portion.

Referring to FIGS. 5a and 5b, the first and second internal electrodes 121 and 122 can be alternately formed on the first dielectric layer 111a in the ceramic body 110, and the third and third internal electrodes 121 and 122 can be alternately formed on the first dielectric layer 111a. 4 The internal electrodes 123 and 124 can be alternately formed on the second dielectric layer 111b. Further, each of the internal electrodes 121, 122, 123, and 124 is divided into a main portion and a lead portion (in FIGS. 5a and 5b, the main portion and the main portion are shown in FIGS. 5a and 5b for convenience of understanding. The boundary with the lead is shown by a dotted line). The "main part" of the internal electrode is a part where the first and second internal electrodes facing each other or the third and fourth internal electrodes are superimposed when viewed from the stacking direction, and is a main part that contributes to capacitance. The "lead portion" of the internal electrode is a portion that extends from the main portion and provides a connection to the external electrode.

According to one embodiment of the present invention, as shown in FIG. 5a, the first internal electrode 121 is drawn out to the first end surface 5 of the ceramic body 110 and connected to the first external electrode 131. 1 Lead portion 121a can be included.

Further, the second internal electrode 122 can include a second lead portion 122a that is drawn out to the first side surface 3 and connected to the second external electrode 132.

Referring to FIG. 5b, the third internal electrode 123 can include a third lead portion 123a that is drawn out to the second end surface 6 and connected to the third external electrode 133.

The fourth internal electrode 124 can include a fourth lead portion 124a that is drawn out to the second side surface 4 and connected to the fourth external electrode 134.

As shown in FIG. 6, the first dielectric layer 111a, the first and second internal electrodes 121, 122 form the first capacitor portion C1, and the second dielectric layer 111b, the third, and the fourth are formed. The internal electrodes 123 and 124 can form the second capacitor portion C2, and the second capacitor portion C2 can be arranged below the first capacitor portion C1 in the thickness direction.

An upper cover layer can be arranged on the upper part of the first capacitor portion, and a lower cover layer can be arranged on the lower part of the second capacitor portion.

Further, the ceramic body 110 can be regarded as a complex in which the first capacitor portion C1 and the second capacitor portion C2 are coupled.

On the other hand, the first capacitor section C1 and the second capacitor section C2 can operate independently of each other.

The first capacitor portion C1 and the second capacitor portion C2 can have the same capacity.

According to one embodiment of the present invention, the first capacitor portion C1 and the second capacitor portion C2 can be configured so that the number of laminated dielectric layers and internal electrodes is different, and may have different capacities. can. In other words, the number of layers of the first dielectric layer 111a included in the first capacitor portion and the second dielectric layer 111b included in the second capacitor portion can be different. As a result, the number of layers of the first and second internal electrodes 121 and 122 and the number of layers of the third and fourth internal electrodes 123 and 124 are different, so that the capacities of the first capacitor portion C1 and the second capacitor portion C2 are different. Can be done.

Further, the first capacitor portion and the second capacitor portion have different thicknesses of the first dielectric layer and the second dielectric layer, or the first dielectric layer and the second dielectric layer are different from each other. By including the material, it can have different capacities.

At this time, each of the first and second capacitor portions may include a dielectric layer using a BT base material having a high dielectric constant, if necessary, and on the contrary, a CT having a low dielectric constant. It can be configured to include a dielectric layer whose main raw material is a base material.

Further, the first and second capacitor portions are all made of a dielectric layer having the same material, thickness and dielectric constant, or a part or all of the same material and a dielectric layer having a dielectric constant are included. Can be configured.

As another example, in consideration of the capacitance, each of the above-mentioned capacitor portions has a high-capacity capacitor portion including a dielectric layer using a BT base material having a high dielectric constant, and has a low-capacity capacitor portion. Can be configured to include a dielectric layer using a CT base material having a low dielectric constant.

However, in the capacitor section of the present invention, even if the capacitor section has a high capacity, in order to increase the ESR value, a dielectric layer having a low dielectric constant is used, and the number of laminated dielectric layers is increased. Can be modified by different forms and structures.

Therefore, according to one embodiment of the present invention, by adjusting the number of layers of the dielectric layer and the internal electrode for each capacitor portion, it is possible to realize a plurality of capacitor portions having different capacities on one chip.

FIG. 7 is a plan view for showing a current path of an array type laminated ceramic electronic component according to an embodiment of the present invention.

As shown in FIG. 7, the first capacitor section C1 can have a current path connecting the first external electrode 131 and the second external electrode 132, and the second capacitor section C2 has a third external electrode. It can have a current path connecting 133 and the fourth external electrode 134.

According to one embodiment of the present invention, the pair of external electrodes formed on each capacitor portion is not formed on the facing surfaces but is arranged on the adjacent surfaces, so that the current path is shortened and the equivalent of each capacitor portion is achieved. The series resistance (ESR) value can be reduced.

According to one embodiment of the present invention, the first and third external electrodes 131 and 133 can be signal electrodes that receive an external current supply, and the second and fourth external electrodes 132 and 134 are grounded. Can be a ground electrode for.

When the first and third external electrodes 131 and 133 are signal electrodes and the second and fourth external electrodes 132 and 134 are ground electrodes, the first capacitor portion changes from the first external electrode to the second external electrode. A current flows to form a capacitance, and in the second capacitor portion, a current flows from the third external electrode to the fourth external electrode to form the capacitance. In the above case, as shown in FIG. 7, the current directions of the first capacitor section and the second capacitor section can be opposite to each other. By forming the first capacitor portion and the second capacitor portion in opposite current directions, the magnetic fields due to the respective currents can be canceled out. As a result, the equivalent series inductance (ESL) of the array type laminated ceramic electronic component can be reduced.

On the other hand, as shown in FIG. 6, the internal electrode arranged at the lowermost end of the first and second internal electrodes 121 and 122 included in the first capacitor portion C1 is the second internal electrode. The internal electrode arranged at the uppermost end of the third and fourth internal electrodes 123 and 124 included in the second capacitor portion C2 can be the fourth internal electrode.

Further, according to one embodiment of the present invention, the second internal electrode arranged at the lowermost end of the first capacitor portion and the fourth internal electrode arranged at the uppermost end of the second capacitor portion are formed of a monodielectric layer. Can be arranged so as to face each other via.

Generally, when the first capacitor portion and the second capacitor portion are laminated in the thickness direction, in order to prevent the parasitic capacitance from being formed between the first capacitor portion and the second capacitor portion, the first capacitor is used. It is necessary to arrange a buffer layer in which no internal electrode is formed between the portion and the second capacitor portion.

However, according to one embodiment of the present invention, the second internal electrode 122 and the fourth internal electrode 124 connected to the ground electrodes 132 and 134 are arranged adjacent to each other in the region where the first capacitor portion and the second capacitor portion are in contact with each other. By doing so, the buffer layer arranged between the first capacitor portion C1 and the second capacitor portion C2 can be omitted.

In general, when internal electrodes of different polarities are arranged so as to face each other through a dielectric layer, a capacitance is formed, and unlike one embodiment of the present invention, the innermost electrode and the lowermost internal electrode of the first capacitor portion and the first capacitor portion are formed. When the internal electrodes at the uppermost end of the two-capacitor portion have different polarities, a parasitic capacitance is formed. However, if a thick buffer layer is formed between the first capacitor portion and the second capacitor portion in order to prevent the formation of such a parasitic capacitance, there arises a problem that the thickness of the ceramic body (composite) increases. ..

On the other hand, according to one embodiment of the present invention, the second internal electrode arranged at the lowermost end of the first capacitor portion, the fourth internal electrode arranged at the uppermost end of the second capacitor portion, and the monodielectric existing between them. Since the parasitic capacitance due to the layer (which may be formed to have the same thickness as the first or second dielectric layer) does not occur and these can serve as the buffer layer, the buffer layer can be omitted. Become.

FIG. 8 is a drawing for explaining a connection structure of an array type laminated ceramic electronic component with a circuit wiring according to an embodiment of the present invention.

According to one embodiment of the present invention, as shown in FIG. 8, even if the array type laminated ceramic electronic component of the present invention is connected to two parallel signal wirings, the wiring pattern does not bend and the circuit and the circuit. Can be connected.

Hereinafter, a method for manufacturing an array-type laminated ceramic electronic component according to an embodiment of the present invention will be described.

First, a plurality of first and second ceramic sheets are provided.

The first and second ceramic sheets are for forming the first and second dielectric layers of the ceramic body, and the ceramic powder, the binder, the solvent and the like are mixed to produce a slurry, and the slurry is used as a doctor blade. It can be manufactured into a sheet having a thickness of several μm by a method such as.

Next, the first and second internal electrodes are formed by printing a conductive paste with a predetermined thickness on one surface of each of the above first ceramic sheets, and a predetermined thickness is formed on one surface of each second ceramic sheet. The third and fourth internal electrodes are formed by printing the conductive paste in.

As the printing method of the conductive paste, a screen printing method, a gravure printing method, or the like can be used, and the conductive paste can include metal powder, ceramic powder, silica (SiO ₂ ) powder, and the like.

The metal powder includes precious metal materials such as silver (Ag), lead (Pb) and platinum, and nickel (Ni), manganese (Mn), chromium (Cr), cobalt (Co), aluminum (Al) and copper ( At least one of Cu) or an alloy thereof can be used.

After that, a plurality of first ceramic sheets on which the first and second internal electrodes are formed are laminated so that the first and second internal electrodes are arranged so as to face each other via the first ceramic sheet. Similarly, a plurality of second ceramic sheets on which the third and fourth internal electrodes are formed are laminated via the second ceramic sheet so that the third and fourth internal electrodes are arranged so as to face each other. And the second capacitor part is formed.

At this time, the first and second capacitor portions can be formed so as to have different capacities.

Further, the first and second capacitor portions may be formed on ceramic sheets having different dielectric constants, respectively. As a result, when each of the above-mentioned capacitor portions realizes different capacities due to the difference in dielectric constant of the ceramic sheet, more various combinations of capacities are possible in one array type laminated ceramic electronic component.

Next, the first and second capacitor portions are laminated in the thickness direction and pressurized to provide a laminated body including a plurality of capacitor portions arranged along the thickness direction.

Then, the laminate is cut and fired in a region corresponding to one chip to have first and second main surfaces in the opposite thickness direction and first and second end faces in the length direction. A ceramic body is provided in which the first to fourth internal electrodes are exposed on the first end surface, the first side surface, the second end surface, and the second side surface, respectively.

Next, first and third external electrodes are formed on the first and second end faces of the ceramic body so as to be connected to the first and third internal electrodes, and the first and second side surfaces of the ceramic body are formed. , The second and fourth external electrodes are formed so as to be connected to the second and fourth internal electrodes.

At this time, the first to fourth external electrodes can be formed by extending to a part of the first and second main surfaces of the ceramic body for mounting on the lower surface.

Further, the first to fourth external electrodes are one of the first and second main surfaces of the ceramic body by removing the directionality of the electronic component so that the direction of the mounting surface does not have to be considered at the time of mounting. It can be formed by extending to a portion.

On the other hand, a plating layer can be further formed on the mounting surface of the first to fourth external electrodes, if necessary. The plating layer is for increasing the adhesive strength between the completed array-type laminated ceramic electronic components when they are soldered onto a printed circuit board.

Mounting board 200 for array type laminated ceramic electronic components

9 is a perspective view schematically showing a shape in which an array-type laminated ceramic electronic component according to an embodiment of the present invention is mounted on a printed circuit board, and FIG. 10 is a plan view of FIG. 9.

Referring to FIGS. 9 and 10, the mounting board 200 of the array-type laminated ceramic electronic component 100 according to the present embodiment is mounted on the printed circuit board 210 on which the array-type laminated ceramic electronic component 100 is mounted and on the upper surface of the printed circuit board 210. Includes three or more electrode pads formed.

The electrode pad may consist of first to fourth electrode pads 221, 222, 223, 224 connected to the first to fourth external electrodes 131, 132, 133, 134 of the array type laminated ceramic electronic component, respectively. can.

That is, the first and third electrode pads 221 and 223 can be connected to the first and second signal electrodes, respectively, and the second and fourth electrode pads 222 and 224 are the first and second, respectively. It can be connected to the ground electrode.

At this time, the first to fourth external electrodes of the array-type laminated ceramic electronic component are electrically connected to the printed circuit board 210 by soldering in a state where they are positioned so as to be in contact with the first to fourth electrode pads, respectively. Can be done.

In particular, according to one embodiment of the present invention, the second and fourth electrode pads connected to the first and second ground electrodes can be continuously formed as one electrode pad.

Other Embodiment (1)

FIG. 11 is a circuit diagram showing a drive power supply system that supplies drive power to predetermined terminals that require drive power through a battery and a power management unit.

Referring to FIG. 11, the drive power supply system can include a battery 300, a first power supply stabilizing unit 400, a power management unit 500, and a second power supply stabilizing unit 600.

The battery 300 can supply power to the power management unit 500. Here, the power supplied by the battery 300 to the power management unit 500 is defined as the first power source.

The first power supply stabilizing unit 400 can stabilize the first power supply V1 and supply the stabilized first power supply to the power management unit 500. Specifically, the first power supply stabilizing unit 400 can include a capacitor C1 formed between the connection terminal of the battery 300 and the power management unit 500 and the ground. The capacitor C1 can reduce the noise contained in the first power supply.

Further, the capacitor C1 can be charged with an electric charge. Further, when the power management unit 500 momentarily consumes a large current, the capacitor C1 can suppress the voltage fluctuation of the power management unit 500 by discharging the charged charge.

The capacitor C1 can be a high-capacity capacitor.

The electric power management unit 500 has a role of converting the electric power input to the electronic device so as to be suitable for the electronic device, and distributing, charging, and controlling the electric power. Therefore, the power management unit 500 can generally include a DC / DC converter.

Further, the power management unit 500 can be embodied in a power management circuit (Power Management Integrated Circuit, PMIC).

The power management unit 500 can also be embodied by a low voltage drop regulator (Low Dropout Regulator, LDO).

The power management unit 500 can convert the first power supply V1 into a second power supply V2. The second power source V2 can be a power source required by a predetermined element that is connected to the output end of the power management unit 500 and receives a drive power supply.

The second power supply stabilizing unit 600 can stabilize the second power supply V2 and transmit the stabilized second power supply to the output end Vdd. A predetermined element that receives drive power from the power management unit 500 can be connected to the output end Vdd.

The second power supply stabilizing unit 600 can include the power management unit 500 and the capacitor C2 formed between the connection terminal of the output end Vdd and the ground.

The second power supply stabilizing unit 600 can reduce the noise contained in the second power supply V2. Further, the second power supply stabilizing unit 600 can stably supply power to the output end Vdd. The capacitor C2 can be a high-capacity capacitor.

In the array type laminated ceramic electronic component 100 according to the embodiment of the present invention, the first capacitor portion C1 and the second capacitor portion C2 can be configured as one chip. As a result, the degree of integration of the elements can be improved, and the wiring can be designed to be short and thick. Further, when the array type laminated ceramic electronic component of the present invention is connected to two parallel wirings, the wirings can be connected without bending.

Other embodiment (2)

FIG. 12 is a circuit diagram showing a drive power supply system according to still another embodiment of the present invention.

Referring to FIG. 12, the drive power supply system can include a battery 300, a first power supply stabilizing unit 400, a power management unit 500, a second power supply stabilizing unit 600, and a third power supply stabilizing unit 700.

The battery 300 can supply power to the power management unit 500.

The first power supply stabilizing unit 400 can stabilize the power supply V supplied from the battery to the power management unit and supply the stabilized power supply to the power management unit 500. Specifically, the first power supply stabilizing unit 400 can include a capacitor unit C formed between the connection terminal of the battery 300 and the power management unit 500 and the ground. The capacitor unit C can reduce noise contained in the power supply V supplied from the battery to the power management unit.

Further, the capacitor portion C can be charged with an electric charge. When the power management unit 500 momentarily consumes a large current, the capacitor unit C can suppress the voltage fluctuation of the power management unit 500 by discharging the charged charge.

The capacitor C is preferably a high-capacity capacitor.

The electric power management unit 500 has a role of converting the electric power input to the electronic device so as to be suitable for the electronic device, and distributing, charging, and controlling the electric power. Therefore, the power management unit 500 can generally include a DC / DC converter.

Further, the power management unit 500 can be embodied in a power management circuit (Power Management Integrated Circuit, PMIC).

The power management unit 500 can also be embodied by a low voltage drop regulator (Low Dropout Regulator, LDO).

The power management unit 500 can convert the power supply V supplied from the battery to the power management unit into the first power supply V3 and the second power supply V4. The first power supply V3 and the second power supply V4 can be power supplies required by predetermined elements supplied with drive power supplies, respectively.

The second power supply stabilizing unit 600 can stabilize the first power supply V3 and transmit the stabilized first power supply to the first integrated circuit 800. The second power supply stabilizing unit 600 can include a capacitor unit C1 formed between the power management unit 500 and the first integrated circuit 800, and is included in the second power supply stabilizing unit in the present embodiment. The capacitor unit can be defined as the first capacitor unit C1.

The second power supply stabilizing unit 600 can reduce the noise contained in the first power supply V3. Further, the second power supply stabilizing unit 600 can stably supply power to the first integrated circuit 800.

The third power supply stabilizing unit 700 can stabilize the second power supply V4 and transmit the stabilized second power supply to the second integrated circuit 900. The third power supply stabilizing unit 700 can include yet another capacitor unit C2 formed between the power management unit 500 and the second integrated circuit 900, and in the present embodiment, the third power supply stabilizing unit is used. The included capacitor portion can be defined as the second capacitor portion C2.

The third power supply stabilizing unit 700 can reduce the noise contained in the second power supply V4. Further, the third power supply stabilizing unit 700 can stably supply power to the second integrated circuit 900.

The first and second capacitor portions C1 and C2 can be high-capacity capacitors.

In the array type laminated ceramic electronic component 100 according to the embodiment of the present invention, the first capacitor portion C1 and the second capacitor portion C2 can be configured as one chip. As a result, the degree of integration of the elements can be improved, and the wiring can be designed to be short and thick. Further, when the array type laminated ceramic electronic component of the present invention is connected to two parallel wirings, the wirings can be connected without bending.

Although the embodiments of the present invention have been described in detail above, the scope of rights of the present invention is not limited to this, and various modifications and modifications are made within the scope of the technical idea of the present invention described in the claims. It is clear to those with ordinary knowledge in the art that the transformation is possible.

100 Array type laminated ceramic electronic component 110 Ceramic main body 111a, 111b First and second dielectric layers 112, 113 Cover layers 121, 122, 123, 124 First to fourth internal electrodes 131, 132, 133, 134 From the first 4th External Electrode 210 Printed Circuit Board 221, 222, 223, 224 1st to 4th Electrode Pads

Claims (20)

A plurality of first dielectric layers and a plurality of second dielectric layers are laminated and formed in the thickness direction, and the first and second main surfaces facing the thickness direction and the first and second surfaces facing each other in the width direction are formed. A ceramic body having first and second end faces facing the sides and lengthwise, and
The first and second internal electrodes which are alternately formed on the plurality of first dielectric layers and are arranged so as to face each other via one first dielectric layer.
With the third and fourth internal electrodes formed alternately on the plurality of second dielectric layers and arranged so as to face each other via one second dielectric layer,
A first external electrode formed on the first end surface of the ceramic body and connected to the first internal electrode, and a first external electrode.
A second external electrode formed on the first side surface of the ceramic body and connected to the second internal electrode,
A third external electrode formed on the second end surface of the ceramic body and connected to the third internal electrode, and a third external electrode.
A fourth external electrode formed on the second side surface of the ceramic body and connected to the fourth internal electrode is included.
The first dielectric layer, the first and second internal electrodes form a first capacitor portion, and the second dielectric layer, the third and fourth internal electrodes form a second capacitor portion.
When the first capacitor portion is arranged on the upper portion of the second capacitor portion, the second internal electrode is arranged at the lowermost end of the first capacitor portion, and the second internal electrode is arranged at the uppermost end of the second capacitor portion. A fourth internal electrode having the same polarity as the internal electrode is arranged,
The distance between the second internal electrode arranged at the lowermost end of the first capacitor portion and the fourth internal electrode arranged at the uppermost end of the second capacitor portion is the distance of the first dielectric layer. It is substantially the same as the thickness of the layer and the layer of the second dielectric layer.
Array type laminated ceramic electronic components. The dielectric layer existing between the second internal electrode and the fourth internal electrode has the same thickness as any one layer of the plurality of first dielectric layers or any one layer of the plurality of second dielectric layers. The array-type laminated ceramic electronic component according to claim 1. The first internal electrode includes a first lead portion drawn out to the first end surface, the second internal electrode includes a second lead portion drawn out to the first side surface, and the third internal electrode includes the first lead portion. The array-type laminated ceramic electronic component according to claim 1 or 2, wherein the fourth internal electrode includes a third lead portion drawn out on two end faces, and the fourth internal electrode includes a fourth lead portion drawn out on the second side surface. The array-type laminated ceramic electronic component according to any one of claims 1 to 3, wherein the number of layers of the first dielectric layer and the number of layers of the second dielectric layer are different. The array-type laminated ceramic electronic component according to any one of claims 1 to 4, wherein the first dielectric layer and the second dielectric layer contain different materials. The array-type laminated ceramic electronic component according to any one of claims 1 to 5, wherein the thickness of the first dielectric layer and the thickness of the second dielectric layer are different. A plurality of first dielectric layers and first and second internal electrodes which are alternately formed on the plurality of first dielectric layers and are arranged so as to face each other via one first dielectric layer. The first capacitor portion including the first capacitor portion and the lower portion of the first capacitor portion in the thickness direction are arranged, and are alternately formed on the plurality of second dielectric layers and the plurality of second dielectric layers, and one second. A hexahedron-shaped composite in which a second capacitor portion including a third and fourth internal electrodes arranged so as to face each other via a dielectric layer is coupled is bonded.
A first signal electrode formed on the first end surface of the complex, connected to the first internal electrode, and input with the first signal,
A first ground electrode formed on the first side surface of the complex and connected to the second internal electrode,
A second signal electrode formed on the second end surface of the complex, connected to the third internal electrode, and input with a second signal different from the first signal,
A second ground electrode formed on the second side surface of the complex and connected to the fourth internal electrode, and comprises.
The innermost electrode at the lowermost end of the first capacitor portion is the second internal electrode, and the innermost electrode at the uppermost end of the second capacitor portion is the fourth internal electrode.
The distance between the second internal electrode arranged at the lowermost end of the first capacitor portion and the fourth internal electrode arranged at the uppermost end of the second capacitor portion is the distance of the first dielectric layer. It is substantially the same as the thickness of the layer and the layer of the second dielectric layer.
Array type laminated ceramic electronic components. The dielectric layer existing between the second internal electrode and the fourth internal electrode has the same thickness as any one layer of the plurality of first dielectric layers or any one layer of the plurality of second dielectric layers. The array-type laminated ceramic electronic component according to claim 7. The array-type laminated ceramic electronic component according to claim 7, wherein the number of layers of the first dielectric layer and the number of layers of the second dielectric layer are different. The array-type laminated ceramic electronic component according to any one of claims 7 to 9, wherein the first dielectric layer and the second dielectric layer contain different materials. The array-type laminated ceramic electronic component according to any one of claims 7 to 10, wherein the thickness of the first dielectric layer and the thickness of the second dielectric layer are different. The array-type stacking according to any one of claims 7 to 11, wherein the innermost electrode of the first capacitor portion and the innermost electrode of the uppermost end of the second capacitor portion face each other via a monodielectric layer. Ceramic electronic components. The array-type laminated ceramic electronic component according to any one of claims 7 to 12, wherein the first capacitor portion and the second capacitor portion operate independently of each other. The array-type laminated ceramic electronic component according to any one of claims 7 to 13, wherein the first capacitor portion and the second capacitor portion have different capacities. The array-type laminated ceramic electronic component according to any one of claims 7 to 14, wherein the current direction of the first capacitor portion and the current direction of the second capacitor portion are opposite to each other. The first and second internal electrodes are formed on a plurality of first dielectric layers so as to face each other via one first dielectric layer, and the third and fourth internal electrodes are one second dielectric layer. The array-type laminated ceramic electronic component according to any one of claims 7 to 15, which is formed on a plurality of second dielectric layers so as to face each other through the layer. The first internal electrode includes a first lead portion drawn out to the first end surface, the second internal electrode includes a second lead portion drawn out to the first side surface, and the third internal electrode includes the first lead portion. The array-type laminated ceramic according to any one of claims 7 to 16, further comprising a third lead portion drawn out on two end faces, and the fourth internal electrode including a fourth lead portion drawn out on a second side surface. Electronic components. The first capacitor unit that stabilizes the first power supply supplied from the battery and supplies it to the power management unit and the second power supply that is arranged under the first capacitor unit and converted by the power management unit are supplied. A hexahedral complex in which a second capacitor that receives, stabilizes, and supplies drive power is coupled, and
A first signal electrode formed on the first end surface of the complex, connected to the battery, and transmitting the first power source to the first capacitor portion.
A second signal electrode formed on the second end surface of the complex, connected to the power management unit, and transmitted the second power source to the second capacitor unit.
A first grounding electrode formed on the first side surface of the complex and for grounding the first capacitor portion,
A second grounding electrode formed on the second side surface of the complex and for grounding the second capacitor portion is included.
The first capacitor portion is formed alternately on the plurality of first dielectric layers and the plurality of first dielectric layers, and is arranged so as to face each other via one first dielectric layer. The second capacitor portion includes a second internal electrode, is formed alternately on the plurality of second dielectric layers and the plurality of second dielectric layers, and faces each other via one second dielectric layer. Includes 3rd and 4th internal electrodes arranged so as to
The first internal electrode is connected to the first signal electrode, the second internal electrode is connected to the first ground electrode, the third internal electrode is connected to the second signal electrode, and the fourth internal electrode is connected. Is connected to the second ground electrode and
The innermost electrode at the lowermost end of the first capacitor portion is the second internal electrode, and the innermost electrode at the uppermost end of the second capacitor portion is the fourth internal electrode.
The distance between the second internal electrode arranged at the lowermost end of the first capacitor portion and the fourth internal electrode arranged at the uppermost end of the second capacitor portion is the distance of the first dielectric layer. It is substantially the same as the thickness of the layer and the layer of the second dielectric layer.
Array type laminated ceramic electronic components. The dielectric layer existing between the second internal electrode and the fourth internal electrode has the same thickness as any one layer of the plurality of first dielectric layers or any one layer of the plurality of second dielectric layers. The array-type laminated ceramic electronic component according to claim 18. A printed circuit board with three or more electrode pads on the top,
The array-type laminated ceramic electronic component according to any one of claims 1 to 19 installed on the printed circuit board.
A mounting substrate for an array-type laminated ceramic electronic component, which comprises a solder for connecting the electrode pad and the array-type laminated ceramic electronic component.

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