JP5156637B2 - Electrical element - Google Patents

Description

The present invention relates to an electric element, and in particular, a noise filter function having a wide band and excellent high frequency characteristics.
It is related with the electric element which has.

Conventionally, a feedthrough three-terminal capacitor is known as a multilayer electronic component (Patent Document 1).
FIG. 21 is a perspective view of a conventional feedthrough three-terminal capacitor. Referring to FIG. 21, a feedthrough three-terminal capacitor 600 includes a multilayer body 601, signal external electrodes 602 and 603, and a ground external electrode 604.

  The signal external electrode 602 is provided on one end surface portion of the multilayer body 601, and the signal external electrode 603 is provided on the other end surface portion of the multilayer body 601. The grounding external electrode 604 is provided on the side surface of the laminate 601 in a bellows shape. The signal external electrodes 602 and 603 and the ground external electrode 604 are sheet-like electrodes formed by applying and baking a conductive paste on the laminate 601.

  FIG. 22 is a cross-sectional view of feedthrough three-terminal capacitor 600 between line XXII and XXII shown in FIG. Referring to FIG. 22, laminated body 601 includes a signal internal electrode 605, a grounding internal electrode 606, and a dielectric 607. The signal internal electrodes 605 and the ground internal electrodes 606 are alternately stacked with dielectrics 607 interposed therebetween. The signal internal electrode 605 has one end connected to the signal external electrode 602 and the other end connected to the signal external electrode 603.

  When the feedthrough three-terminal capacitor 600 is mounted on the substrate, the lower surface portions 602A and 603A of the signal external electrodes 602 and 603 and the lower surface portion 604A of the ground external electrode 604 are connected to the wiring on the substrate (printed substrate). The

  FIG. 23 is a cross-sectional view of feedthrough three-terminal capacitor 600 in a plane including one signal internal electrode 605 shown in FIG. FIG. 24 is a cross-sectional view of feedthrough three-terminal capacitor 600 in a plane including one grounding internal electrode 606 shown in FIG.

  Referring to FIG. 23, signal internal electrode 605 has a rectangular planar shape, is not connected to ground external electrode 604, has one end connected to signal external electrode 602, and the other end to 603. Connected. The signal internal electrode 605 has a rectangular short side connected to the signal external electrodes 602 and 603.

Referring to FIG. 24, grounding internal electrode 606 is not connected to signal external electrodes 602 and 603 but is connected to grounding external electrode 604.
Japanese Patent Laid-Open No. 2003-22932

However, in the conventional feedthrough three-terminal capacitor, the signal internal electrode has a rectangular short side.
As a result, the connection area between the signal internal electrode and the signal external electrode is reduced.

  Further, since the signal internal electrode is made of nickel or the like as a component of the conductive paste, the resistance component becomes large, and there is a problem of heat generation when a large current is passed.

  Further, in the vicinity of the junction between the grounding internal electrode and the grounding external electrode, a narrowed portion is formed to connect the wide part of the grounding internal electrode to the grounding external electrode, Since the narrowed portions are orthogonal, there is no component that reverses the current flow of the signal internal electrode, and there is no magnetic field canceling action.

  Furthermore, the conventional feedthrough three-terminal capacitor is formed by laminating a dielectric layer and a conductor layer, and is fired at a high temperature of 1000 ° C. or more. Therefore, the warp is caused by the difference in thermal expansion coefficient between the dielectric layer and the conductor layer. Occurs.

Therefore, the present invention has been made to solve such a problem, and its purpose is as follows.
It is an object of the present invention to provide an electric element capable of increasing the contact area between a signal internal electrode and a signal external electrode, reducing high frequency noise, suppressing heat generation, and preventing warpage.

A first invention of the present application includes a plurality of signal inner conductor layers, a plurality of ground inner conductor layers, and a plurality of dielectric layers interposed between the signal inner conductor layers and the ground inner conductor layers. It has a rectangular parallelepiped shape,
A first signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on one of the first side surfaces perpendicular to the bottom surface of the rectangular parallelepiped shape;
A second signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on the other of the first side surfaces;
In a second side surface perpendicular to the bottom surface and the first side surface and facing each other, a position close to the first signal external electrode away from the center of the second side surface in the direction in which the first side surface opposes A first grounding external electrode in which the plurality of grounding internal conductor layers are connected in parallel;
The second side surface that is perpendicular to the bottom surface and the first side surface and faces each other, and a position that is away from the center of the second side surface and close to the second signal external electrode with respect to the direction in which the first side surface opposes A second grounding outer electrode in which the plurality of grounding inner conductor layers are connected in parallel;
A third bottom electrode having a strip shape connecting the first grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface;
An electric element comprising a fourth bottom electrode in a strip shape connecting the second grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface,
The grounding inner conductor layer includes a pair of protruding third connection parts and fourth connection parts that connect the first grounding external electrode and the second grounding external electrode, and The protruding shape of the 3 connecting portion and the fourth connecting portion is a trapezoidal shape with a wide base on the inner side of the rectangular parallelepiped shape,
The plurality of signal inner conductor layers each have a first flat plate portion and first and second lead portions having a width wider than the first flat plate portion,
Each of the plurality of grounding inner conductor layers has a second flat plate portion and third and fourth lead portions, and the first signal outer electrode and the second signal outer electrode are arranged. With respect to the direction perpendicular to the direction, the width between the outer edge portion of the third lead portion and the outer edge portion of the fourth lead portion is wider than the width of the second flat plate portion.

Preferably, in the substantially trapezoidal third connection part and the fourth connection part of the electric element, the trapezoidal vertical side is inclined to be a parallelogram shape.
A second invention of the present application includes a plurality of signal inner conductor layers, a plurality of ground inner conductor layers, and a plurality of dielectric layers interposed between the signal inner conductor layers and the ground inner conductor layers. It has a rectangular parallelepiped shape,
A first signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on one of the first side surfaces perpendicular to the bottom surface of the rectangular parallelepiped shape;
A second signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on the other of the first side surfaces;
In a second side surface perpendicular to the bottom surface and the first side surface and facing each other, a position close to the first signal external electrode away from the center of the second side surface in the direction in which the first side surface opposes A first grounding external electrode in which the plurality of grounding internal conductor layers are connected in parallel;
The second side surface that is perpendicular to the bottom surface and the first side surface and faces each other, and a position that is away from the center of the second side surface and close to the second signal external electrode with respect to the direction in which the first side surface opposes A second grounding outer electrode in which the plurality of grounding inner conductor layers are connected in parallel;
A third bottom electrode having a strip shape connecting the first grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface;
An electric element comprising a fourth bottom electrode in a strip shape connecting the second grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface,
The grounding inner conductor layer includes a pair of protruding third connection parts and fourth connection parts that connect the first grounding external electrode and the second grounding external electrode, and The protruding shape of the 3 connecting portion and the fourth connecting portion is a trapezoidal shape with a wide base on the inner side of the rectangular parallelepiped shape,
The plurality of signal inner conductor layers each have a first flat plate portion and first and second lead portions having a width wider than the first flat plate portion,
Each of the plurality of grounding inner conductor layers has a second flat plate portion and third and fourth lead portions, and the first signal outer electrode and the second signal outer electrode are arranged. With respect to the direction perpendicular to the direction, the width between the outer edge portion of the third lead portion and the outer edge portion of the fourth lead portion is wider than the width of the second flat plate portion,
In the electric element comprising a conductor plate covering the uppermost surface of the electric element and the other end of the first side surface from one end of the first side surface of the rectangular parallelepiped shape of the electric element,
The first grounding external electrode and the second grounding external electrode are formed from the lower end of the second side surface to the middle not reaching the upper end.
Preferably, the signal inner conductor layer and the ground inner conductor layer are arranged at the same position parallel to the major axis direction of the signal inner conductor layer and the ground inner conductor layer, and the signal inner conductor layer and the ground It has the 1st division | segmentation groove | channel which divided | segmented the part except the both ends of the internal conductor layer for use, or divided | segmented from one end to the other end.

Preferably, the signal internal conductor layer and the ground internal conductor layer, in the same position in the axial direction central portion of the inner conductor layers and ground internal conductor layer said signal, for the major axis direction shorter 12. The electric element according to claim 11, further comprising at least one second dividing groove that is inclined in the axial direction and that divides a part of the short axis.

  Preferably, the second dividing groove is connected to the first divided groove parallel to the major axis direction of the signal inner conductor layer and the signal inner conductor layer.

In the electric element according to the present invention, each of the n signal internal electrodes is formed by the first flat plate portion.
The first and second lead portions having a wider width are connected to the signal external electrode.

  Therefore, the contact area between the n signal internal electrodes and the signal external electrode can be increased.

  In addition, since both ends of the grounding inner conductor layer are connected to the third and second grounding external electrodes via the trapezoidal third connection part and the fourth connection part, there is no portion connected at right angles, so In the current flowing in the conductor layer, a component opposite to the direction of the current flowing in the signal inner conductor layer appears, and the magnetic field is canceled to reduce the inductance.

Also, by connecting a conductor plate to the electric element and making the resistance component smaller than that of the first and grounding inner conductor layers, heat generation can be suppressed even when a large current flows.
In the present invention, since the signal inner conductor layer and the ground inner conductor layer are divided by the dividing grooves in the major axis direction and the minor axis direction, warpage due to the difference in thermal expansion coefficient between the dielectric layer and the conductor layer. Can be reduced.

Embodiments of the present invention will be described in detail with reference to the drawings. In the figure, the same or
Corresponding portions are denoted by the same reference numerals, and the description thereof will not be repeated.

FIG. 1 is a perspective view showing a configuration of an electric element according to an embodiment of the present invention. See Figure 1
The electric element 100 according to the embodiment of the present invention includes the laminate 110, the signal external electrodes 120 and 130, and the ground external electrodes 140 and 150.

  The stacked body 110 has a substantially rectangular parallelepiped shape. The signal external electrode 120 is formed at one end of the multilayer body 110 on the end face 110A, the side faces 110B and 110C, the bottom face 110D and the top face 110E. The signal external electrode 130 is formed on the other end of the multilayer body 110 on the end face 110F, a part of the side faces 110B and 110C, a part of the bottom face 110D, and a part of the top face 110E.

  The grounding external electrode 140 is formed on a part of the side surfaces 110B and 110C, the bottom surface 110D, and the top surface 110E of the multilayer body 110 on the signal external electrode 120 side. The grounding external electrode 150 is formed on a part of the side surfaces 110B and 110C, the bottom surface 110D, and the top surface 110E of the multilayer body 110 on the signal external electrode 130 side.

  FIG. 2 is a perspective view of the laminate 110 shown in FIG. Referring to FIG. 2, laminated body 110 includes dielectric layers 1 to 10, signal internal electrodes 11 to 14, and ground internal electrodes 21 to 25.

  The dielectric layers 1 to 10 are sequentially stacked in the vertical direction DR3 that is the normal direction of the substrate. The signal internal electrodes 11 to 14 are arranged between the dielectric layers 2 and 3, between the dielectric layers 4 and 5, between the dielectric layers 6 and 7, and between the dielectric layers 8 and 9, respectively, and are grounded internal electrodes 21 to 25 are disposed between the dielectric layers 1 and 2, between the dielectric layers 3 and 4, between the dielectric layers 5 and 6, between the dielectric layers 7 and 8, and between the dielectric layers 9 and 10, respectively. . As a result, the dielectric layers 2, 4, 6, and 8 support the signal internal electrodes 11 to 14, respectively, and the dielectric layers 1, 3, 5, 7, and 9 respectively include the ground internal electrodes 21 to Support 25.

  Each of the signal internal electrodes 11 to 14 has one end connected to the signal external electrode 120 and the other end connected to the signal external electrode 130. Each of the grounding inner electrodes 21 to 25 is connected to the grounding outer electrodes 140 and 150.

  Thus, the electric element 100 has a structure in which the signal internal electrodes 11 to 14 and the ground internal electrodes 21 to 25 are alternately arranged with the dielectric layers 1 to 10 interposed therebetween, and the two signal external electrodes 120 and 130, and two grounding external electrodes 140 and 150.

  Each of the dielectric layers 1 to 10 is made of, for example, barium titanate (BaTiO3), the signal external electrodes 120 and 130, the signal internal electrodes 11 to 14, the ground internal electrodes 21 to 25, and the ground external electrodes Each of 140 and 150 is made of nickel (Ni), for example.

FIG. 3 is a diagram for explaining the dimensions of the dielectric layer 2 and the signal internal electrode 11 shown in FIG.
is there. Referring to FIG. 3, the dielectric layer 2 has a substantially flat plate shape, and the length direction DR2 (= signal use)
The internal electrode 11 has a length Ll in the direction of current flow) and a width Wl in the width direction DR1 orthogonal to the length direction DR2. The length L1 is set to 15 mm, for example, and the width Wl is set to 13 mm, for example. The dielectric layer 2 has a thickness of 25 μm, for example.

The signal internal electrode 11 has a substantially flat plate shape and includes a flat plate portion 111 and lead portions 112 and 113. The flat plate portion 111 has a rectangular shape. The lead-out portion 112 is provided in contact with one end of the flat plate portion 111, and has a shape in which the width increases from the connecting portion with the flat plate portion 111 in the direction opposite to the flat plate portion 111. The lead-out portion 113 is provided in contact with the other end of the flat plate portion 111 and has a shape in which the width increases from the connecting portion with the flat plate portion 111 in the direction opposite to the flat plate portion 111.
The flat plate portion 111 has a length L3 and a width W2. Each of the leading portions 112 and 113 has a length L2. The lead-out portion 112 has a width W2 at the connection portion with the flat plate portion 111, and has a width W1 at the end opposite to the flat plate portion 111. The lead portion 113 has a width W2 at the connection portion with the flat plate portion 111, and has a width W1 at the end opposite to the flat plate portion 111. Each of the lead portions 112 and 113 is wide at the end opposite to the flat plate portion 111 by (Wl−W2) = 2 × W3.

  The width W2 is narrower than the width W1, and is set to 11 mm, for example. The length L2 is set to 4 mm, for example. Furthermore, the signal internal electrode 11 has a thickness in the range of 10 μm to 20 μm, for example.

  Each of the signal internal electrodes 12 to 14 has the same shape and the same dimensions as the signal internal electrode 11 shown in FIG.

FIG. 4 is a diagram for explaining the dimensions of the other dielectric layer 1 and the grounding internal electrode 21 shown in FIG.
FIG. Referring to FIG. 4, dielectric layer 1 is substantially flat and has the same length as dielectric layer 2.
L1 and has the same width W1. The dielectric layer 1 has a thickness of 25 μm, for example.

  The grounding internal electrode 21 has a substantially flat plate shape and includes a flat plate portion 211 and lead portions 212 to 215. The flat plate part 211 has a rectangular shape. The flat plate portion 211 has a length L4 shorter than the length L1 and a width W2. The length L4 is set to 13 mm, for example. The grounding internal electrode 21 has a thickness in the range of 10 μm to 20 μm, for example.

  The lead-out portion 212 is provided on the end face 21A side of the grounding internal electrode 21. The lead portion 212 has a length L2 and a width W3, and is provided at a distance L5 from the one end 21a of the grounding internal electrode 21.

  The lead-out portion 213 is provided on the end surface 21B side of the grounding internal electrode 21. The lead portion 213 has a length L2 and a width W3, and is provided at a distance L5 from the one end 21a of the grounding internal electrode 21.

  Furthermore, the lead-out portion 214 is provided on the end face 21A side of the grounding internal electrode 21. The lead-out portion 214 has a length L2 and a width W3, and is provided at a distance L5 from the other end 21b of the grounding internal electrode 21.

  Furthermore, the lead portion 215 is provided on the end face 21B side of the grounding internal electrode 21. The lead portion 215 has a length L2 and a width W3, and is provided at a distance L5 from the other end 21b of the grounding internal electrode 21.

As a result, the interval between the drawing portion 212 and the drawing portion 214 and the interval between the drawing portion 213 and the drawing portion 215 are set to L6. The distance L5 is set to 1.5 mm, for example.
Each of the grounding internal electrodes 22 to 25 has the same dimensions as the grounding internal electrode 21 shown in FIG. Each of dielectric layers 3 to 10 has the same shape and the same dimensions as dielectric layer 2 shown in FIG. 3 and dielectric layer 1 shown in FIG.

FIG. 5 is a plan view of adjacent signal internal electrodes and ground internal electrodes. Refer to Figure 5
When the signal internal electrode 11 and the ground internal electrode 21 are projected onto one plane, the signal internal electrode 11 and the ground internal electrode 21 have an overlapping portion 20. The overlapping portion 20 between the signal internal electrode 11 and the ground internal electrode 21 has a length L4 and a width W2. Overlapping part of signal internal electrode 11 and grounding internal electrode 22, overlapping part of signal internal electrode 12 and grounding internal electrode 22, overlapping part of signal internal electrode 12 and grounding internal electrode 23, for signal Overlapping portion of internal electrode 13 and grounding internal electrode 23, overlapping portion of signal internal electrode 13 and grounding internal electrode 24, overlapping portion of signal internal electrode 14 and grounding internal electrode 24, and signal internal The overlapping portion between the electrode 14 and the grounding internal electrode 25 also has the same length L4 and the same width W2 as the overlapping portion 20. In Embodiment 1, length L4 and width W2 are set so that W2 ≦ L4.

  FIG. 6 is a conceptual diagram for explaining a method of connecting the signal internal electrodes 11 to 14 and the signal external electrodes 120 and 130 of the electric element 100. Referring to FIG. 6, signal external electrode 130 has a substantially box shape and includes side surface portions 131 to 134 and a bottom surface portion 135. The lead portions 113 of the signal internal electrodes 11 and 12 are connected to the bottom surface portion 135 of the signal external electrode 130.

  The signal external electrode 120 has the same shape as the signal external electrode 130 shown in FIG. 6, and the lead portions 111 of the signal internal electrodes 11 and 12 are connected to the bottom surface of the signal external electrode 120.

  Although not shown in FIG. 6, the lead-out portions 112 and 113 of the signal internal electrodes 13 and 14 are also in the same manner as the lead-out portions 112 and 113 of the signal internal electrodes 11 and 12, respectively. Connected to 120 and 130.

  FIG. 7 is a conceptual diagram for explaining a method of connecting the grounding internal electrodes 21 to 25 and the grounding external electrodes 140 and 150 of the electric element 100. FIG. Referring to FIG. 7, grounding external electrodes 140 and 150 are arranged in a strip shape in width direction DR1 and vertical direction DR3. The five lead portions 212 and 213 of the five grounding inner electrodes 21 to 25 are connected to the grounding outer electrode 140 at both ends in the width direction DR1, and five of the five grounding inner electrodes 21 to 25 are connected. The lead portions 214 and 215 are connected to the grounding external electrode 150.

  The signal internal electrodes 11 to 14 are connected to the signal external electrodes 120 and 130 in the manner shown in FIG. 6, and the ground internal electrodes 21 to 25 are connected to the ground external electrodes 140 and 150 in the manner shown in FIG. Is done. As a result, grounding external electrode 21 / dielectric layer 2 / signal internal electrode 11, signal internal electrode 11 / dielectric layer 3 / grounding external electrode 22, grounding external electrode 22 / dielectric layer 4 / signaling Internal electrode 12, signal internal electrode 12 / dielectric layer 5 / ground external electrode 23, ground external electrode 23 / dielectric layer 6 / signal internal electrode 13, signal internal electrode 13 / dielectric layer 7 / ground External electrode 24, ground external electrode 24 / dielectric layer 8 / signal internal electrode 14, and signal internal electrode 14 / dielectric layer 9 / ground external electrode 25 are grounded with signal internal electrodes 120 and 130. Eight capacitors connected in parallel between the external electrodes 140 and 150 are formed.

In this case, the electrode area of each capacitor is equal to the adjacent signal internal electrode and ground internal electrode.
It is equal to the area of the overlapping portion 20 (see FIG. 5).

The electric element 100 shown in FIG. 1 is manufactured by the following method. Length L1 and width W1
Ni paste is applied on the surface of the green sheet to be the dielectric layer 1 (BaTiO ₃ ) having a length L4 and a width W2 by screen printing, and the surface of the dielectric layer 1 is made of Ni for grounding The internal electrode 21 is formed.

In the same manner, dielectric layers 3, 5, 7, and 9 made of BaTiO ₃ were produced, and grounding internal electrodes 22 to 25 made of Ni were respectively formed on the produced dielectric layers 3, 5, 7, and 9. Form.

Subsequently, Ni paste was applied by screen printing to the area having the length L2 and the width W2 on the surface of the green sheet to be the dielectric layer 2 (BaTiO ₃ ) having the length L1 and the width W1, and the dielectric layer The signal internal electrode 11 made of Ni is formed on the surface of 2.

In the same manner, dielectric layers 4, 6, and 8 made of BaTiO ₃ are produced, and signal internal electrodes 12 to 14 made of Ni are formed on the produced dielectric layers 4, 6, and 8.

Further, a green sheet to be the dielectric layer 10 (BaTiO ₃ ) is produced.

Thereafter, the grounding internal electrode 21, the signal internal electrode 11, the grounding internal electrode 22, the signal internal electrode 12, the grounding internal electrode 23, the signal internal electrode 13, the grounding internal electrode 24, the signal internal electrode 14 and The green sheets of the dielectric layers 1 to 9 on which the grounding internal electrodes 25 are respectively formed and the green sheet of the dielectric layer 10 are sequentially laminated in the vertical direction DR3. Thus, the signal internal electrodes 11 to 14 connected to the signal external electrodes 120 and 130 and the ground internal electrodes 21 to 25 connected to the ground external electrodes 140 and 150 are alternately stacked.
Further, Ni paste is applied by screen printing to form the signal external electrodes 120 and 130 and the ground external electrodes 140 and 150. Thereafter, firing at a firing temperature of 1350 ° C. completes the electric element 100.

  In the production of the electric element 100, a green sheet is not used, a dielectric paste is printed and dried, a conductor is printed thereon, and further, a dielectric paste is printed and the same process is performed. There is also a method of laminating and laminating.

  FIG. 8 is a perspective view for explaining the function of the electric element 100 shown in FIG. Referring to FIG. 8, when a current is passed through electric element 100, grounding external electrodes 140 and 150 are connected to the ground potential, and a current flowing through signal internal electrodes 11-14 flows through grounding internal electrodes 21-25. A current is passed through the electric element 100 so as to be opposite to the current.

  For example, the current is passed through the electric element 100 so that the current flows from the signal external electrode 120 toward the signal external electrode 130. Then, the current flows from the signal external electrode 120 to the signal internal electrode 11 via the lead-out portion 112, flows through the signal internal electrode 11 in the direction of the arrow 70, and further passes through the lead-out portion 113 to the signal external electrode. Flow to 130.

  The return current of the current flowing through the signal internal electrode 11 flows from the ground external electrode 150 to the ground internal electrode 21 through the lead-out portions 214 and 215, and the ground internal electrode 21 is in the direction opposite to the arrow 70. It flows in the direction of the arrow 80, and further flows to the grounding external electrode 140 through the lead portions 212 and 213.

  The current flows in each of the signal internal electrodes 12 to 14 in the same manner as the signal internal electrode 11, and also in each of the ground internal electrodes 22 to 25 in the same manner as the ground internal electrode 21.

  Then, the current Il flowing through the signal internal electrodes 11 to 14 and the current I2 flowing through the grounding internal electrodes 21 to 25 are equal in magnitude and reverse in direction.

FIG. 9 is a diagram for explaining the magnetic flux density generated by the current flowing through the conducting wire.
FIG. 10 is a diagram for explaining the effective inductance when magnetic interference occurs between two conductors.

Referring to FIG. 9, when current I is flowing through an infinitely long straight conductor, the distance a from the conductor
The magnetic flux density B generated at the point P existing in the

Represented by Where μ ₀ is the vacuum permeability.

  In addition, when there are two conductors shown in FIG. 9 and magnetic interference occurs, the self-inductance of the two conductors is L11 and L22, respectively, and the coupling coefficient is k (0 <k <1). If the mutual inductance of the two conductive wires is L12, the mutual inductance L12 is expressed by the following equation.

Here, when L11 = L22, the mutual inductance L12 is expressed by the following equation.

Referring to FIG. 10, assuming that conductor A and conductor B are connected by lead C, the currents are equal in magnitude, and the opposite directions flow through conductors A and B, the effect of conductor A is effective. The inductance L11e ffec tiv e is expressed by the following equation.

Thus, when magnetic interference occurs between the two conductors A and B, the effective inductor of the conductor A
The capacitance L11e ffec tiv e is smaller than the self-inductance L11 of the conductor A due to the mutual inductance L12 between the conductor L and the conductor L11. This is because the direction of the magnetic flux ¢ A generated by the current I flowing through the conductor A is opposite to the direction of the magnetic flux ¢ B generated by the current -I flowing through the conductor B, and the current I flowing through the conductor A is generated effectively. This is because the magnetic flux density becomes small.

  In the electric element 100, as described above, the signal internal electrode 11 is disposed at a position of 25 μm from the ground internal electrodes 21, 22 and the signal internal electrode 12 is disposed from the ground internal electrodes 22, 23 to 25 μm. The signal internal electrode 13 is disposed at a position of 25 μm from the ground internal electrodes 23, 24, and the signal internal electrode 14 is disposed at a position of 25 μm from the ground internal electrodes 24, 25. Between the signal internal electrode 11 and the ground internal electrodes 21 and 22, between the signal internal electrode 12 and the ground internal electrodes 22 and 23, between the signal internal electrode 13 and the ground internal electrodes 23 and 24, The magnetic interference occurs between the internal electrode 14 for signal and the grounding internal electrodes 24, 25, and the current I1 flowing through the internal electrodes 11-14 for reliability is the current I2 flowing through the internal electrodes 21-25 for grounding. Since the sizes are equal and the directions are opposite, the effective inductance of the signal internal electrodes 11 to 14 is It is smaller than the self-inductance of the signal internal electrodes 11 to 14 11 to 14 and by the mutual inductance between the ground internal electrodes 21 to 25.

  When the effective capacitance of the entire electric element 100 is C, the impedance Z s of the electric element 100 is expressed by the following equation.

  In the electric element 100, as described above, since eight capacitors connected in parallel are formed, the effective capacitance C is larger than that in the case where one capacitor is formed.

  Therefore, in the electric element 100, in the low frequency region where the capacitance is dominant, the effective capacitance C is increased to decrease the impedance Z s, and in the high frequency region where the inductance is dominant, the effective inductance L described above. Impedance Z s decreases due to the decrease in.

As a result, the electrical element 100 has a relatively low impedance over a wide frequency range.
Has Z s.

  FIG. 11 is a perspective view of a substrate on which the electric element 100 shown in FIG. 1 is arranged. Referring to FIG. 11, substrate 200 includes a dielectric 201, conductor plates 202 to 205, and via holes 206 and 207. The dielectric 201 has a substantially plate shape. The conductor plates 202 and 203 have the same thickness, and are arranged on the surface 201A of the dielectric 201 with a predetermined interval. The conductor plates 204 and 205 have the same thickness and are arranged on the back surface 201B of the dielectric 201 with a predetermined interval.

  The via hole 206 is rearranged near the conductor plate 202. The via hole 206 passes through the dielectric 201, one end is connected to the conductor plate 204, and the other end is substantially the same as the surface 202B of the conductor plate 202, and the other end is the surface of the dielectric 201. Projecting from 201A. The via hole 207 is disposed in the vicinity of the conductor plate 203. The via hole 207 penetrates the dielectric 201, one end is connected to the conductor plate 205, and the other end is substantially the same as the surface 203A of the conductor plate 203, and the other end is the surface of the dielectric 201. Projecting from 201A.

  FIG. 12 is a conceptual diagram showing a state in which the electric element 100 shown in FIG. The electric element 100 is disposed on the substrate 200. In this case, the signal external electrode 120 is connected to the conductor plate 202, the signal external electrode 130 is connected to the conductor plate 203, and the ground external electrode 140 is connected to the conductor plate 204 via the via hole 206, The grounding external electrode 150 is connected to the conductor plate 205 via the via hole 207.

  FIG. 13 is a conceptual diagram showing a usage state of the electric element 100 shown in FIG. Referring to FIG. 13, electric element 100 is connected between a power supply 160 and a CPU (Central Processing Unit) 170. The power supply 160 has a positive terminal 161 and a negative terminal 162. The CPU 170 has a positive terminal 171 and a negative terminal 172.

  The conductor plate 202 (signal line) has one end connected to the positive terminal 161 of the power source 160 and the other end connected to the signal external electrode 120 of the electric element 100. The conductor plate 204 has one end connected to the negative terminal 162 of the power supply 160 via the via hole 208 and the other end connected to the grounding external electrode 140 of the electric element 100 via the via hole 206.

  The conductor plate 203 (signal line) has one end connected to the signal external electrode 130 of the electric element 100 and the other end connected to the positive terminal 171 of the CPU 170. The conductor plate 205 has one end connected to the grounding external electrode 150 of the electric element 100 via the via hole 207 and the other end connected to the negative terminal 172 of the CPU 170 via the via hole 209.

  Then, the current I output from the positive electrode terminal 161 of the power supply 160 flows to the signal external electrode 120 of the electric element 100 via the conductor plate 202 (signal line), and the inside of the electric element 100 is connected to the extraction unit 112 and the signal. The internal electrodes 11 to 14, the lead portion 113, and the signal external electrode 130 flow in this order. The current I flows from the signal external electrode 130 to the CPU 170 via the conductor plate 203 (signal line) and the positive terminal 171.

  As a result, the current I is supplied to the CPU 170 as a power supply current. Then, the CPU 170 is driven by the current I, and outputs a return current Ir having the same magnitude as the current I from the negative terminal 172.

  Then, the return current Ir flows to the conductor plate 205 via the via hole 209, and flows from the conductor plate 205 to the grounding internal electrodes 21 to 25 of the electric element 100 via the via hole 207 and the grounding external electrode 150. The return current Ir flows from the grounding external electrode 140 to the conductor plate 204 through the via hole 206, and flows from the conductor plate 204 to the power source 160 through the via hole 208 and the negative terminal 162.

  As a result, in the electrical element 100, the current I flows through the signal internal electrodes 11 to 14 from the power supply 160 side to the CPU 170 side, and the return current Ir flows through the grounding internal electrodes 21 to 25 from the CPU 170 side to the power supply 160 side. The effective inductance L of the electric element 100 is relatively greatly reduced as described above. Further, since the electric element 100 includes eight capacitors connected in parallel, the effective capacitance C of the electric element 100 is increased. Therefore, the impedance Z s of the electric element 100 is reduced.

  The CPU 170 is driven by the current I supplied from the power source 160 via the electric element 100, and generates an unnecessary high-frequency current. The unnecessary high-frequency current leaks to the electric element 100 through the via hole 209, the conductor plate 205, and the via hole 207. However, since the electric element 100 has a low impedance Zs as described above, the unnecessary high-frequency current is A circuit composed of the element 100 and the CPU 170 flows, and leakage from the electric element 100 to the power source 160 is suppressed.

  The operating frequency of CPU 170 tends to shift to the higher frequency side, and operation at about 1 GHz is also assumed. In such a high operating frequency region, the impedance Zs of the electric element 100 is mainly determined by the effective inductance L, and the effective inductance L relatively decreases as described above. It functions as a noise filter that traps unnecessary high-frequency current generated by the CPU 170 operating at a high operating frequency in the vicinity of the CPU 170.

 As described above, the electrical element 100 is connected between the power supply 160 and the CPU 170, and functions as a noise filter that traps unnecessary high-frequency current generated by the CPU 170 in the vicinity of the CPU 170. When the electric element 100 is connected between the power supply 160 and the CPU 170, the signal internal electrodes 11 to 14 and the ground internal electrodes 21 to 25 are connected as transmission lines. That is, a capacitor constituted by the signal internal electrodes 11 to 14 connected to the signal external electrodes 120 and 130 and the ground internal electrodes 21 to 25 connected to the ground external electrodes 140 and 150 is terminals. The signal internal electrodes 11 to 14 and the ground internal electrodes 21 to 25 are connected as a part of the transmission line.

  Therefore, the signal internal electrodes 11 to 14 are conductors for the current I output from the power supply 160 to flow from the power supply 160 side to the CPU 170 side, and the grounding internal electrodes 21 to 25 have the return current Ir from the CPU 170 side. It is a conductor for flowing to the power supply 160 side. As a result, the equivalent series inductance can be eliminated as much as possible.

  In the electric element 100, the current flowing through the signal internal electrodes 11 to 14 connected to the signal external electrodes 120 and 130 is transferred to the ground internal electrodes 21 to 25 connected to the ground external electrodes 140 and 150. By setting it in the opposite direction to the flowing current, magnetic interference occurs between the signal internal electrodes 11-14 and the ground internal electrodes 21-25, and the self-inductance of the signal internal electrodes 11-14 is used for signals. It is reduced by the mutual inductance between the internal electrodes 11-14 and the grounding internal electrodes 21-25. As a result, the effective inductance of the electric element 100 is reduced, and the impedance Z s of the electric element 100 is reduced.

  Thus, in the present invention, the first feature is that the signal internal electrodes 11 to 14 and the ground internal electrodes 21 to 25 constituting the capacitor electrode are connected as the flanges of the transmission line. A reverse current is passed through the signal internal electrodes 11 to 14 connected to the electrodes 120 and 130 and the ground internal electrodes 21 to 25 connected to the ground external electrodes 140 and 150 to cause the signal internal electrodes 11 to 14 and the grounding internal electrodes 21 to 25 cause magnetic interference between the signal internal electrodes 11 to 14 to be smaller than the self-inductance of the signal internal electrodes 11 to 14, thereby The second feature is to reduce the impedance Z s of the element 100, and two internal electrodes for grounding (the internal electrodes for grounding 21 and 21), each of which is connected to the ground potential, each of the signal internal electrodes 11 to 14 through which the power supply current flows. 22, Grounding internal electrodes 22, 23, Grounding internal electrode 23 , 24 and the grounding internal electrodes 24, 25) are the third feature.

  Furthermore, the signal internal electrodes 11 to 14 have a fourth feature in that they have leading portions 112 and 113 having a width wider than that of the flat plate portion 111 at both ends.

  The second feature is realized by adopting a configuration in which the return current Ir from the CPU 170 is passed through the grounding internal electrodes 21 to 25 disposed inside the electric element 100.

The first feature can eliminate the equivalent series inductance as much as possible, and the second feature
Thus, unnecessary high frequency current can be confined in the vicinity of the CPU 170. In addition, the third feature can suppress the noise of the electric element 100 from being emitted to the outside, and can suppress the electric element 100 from being affected by noise from the outside. Further, according to the fourth feature, the contact area between the signal internal electrodes 11 to 14 and the signal external electrodes 120 and 130 can be increased.

  As a result, the contact resistance between the signal internal electrodes 11 to 14 and the signal external electrodes 120 and 130 can be reduced, and more current can flow through the signal internal electrodes 11 to 14. Further, the heat generated in the signal internal electrodes 11 to 14 can be easily transmitted to the signal external electrodes 120 and 130, and the temperature rise of the electric element 100 can be suppressed.

  FIG. 14 is a schematic diagram showing another example of the signal internal electrodes used in the electric element 100 shown in FIG. The laminate 110 shown in FIG. 2 may include a signal internal electrode 11A shown in FIG. 14 instead of the signal internal electrodes 11-14.

  Referring to FIG. 14, signal internal electrode 11A has a substantially plate shape having a length L1 and a width W4, and includes a flat plate portion 111A and lead portions 112A and 113A. The flat plate portion 111A has a rectangular shape. The flat plate portion 111A has a length L3 and a width W4. The width W4 is set to 12 mm, for example.

  The lead portion 112A has a rectangular shape and is provided in contact with one end of the flat plate portion 111A. In this case, the lead-out portion 112A protrudes to one side of the flat plate portion 111A in the width direction DR2. The lead portion 112A has a length L2 and a width W1.

  The lead portion 113A has a rectangular shape and is provided in contact with the other end of the flat plate portion 111A. In this case, the lead portion 113A protrudes to one side of the flat plate portion 111A in the width direction DR2 in the same manner as the lead portion 112A. The lead portion 113A has a length L2 and a width W1.

  Thus, the signal internal electrode 11A has the two lead portions 112A and 113A protruding to the same side of the flat plate portion 111A. And the length which the drawer | drawing-out part 112A, 113A protrudes from the flat plate part 111A is W3 = W1-W4.

  The electric element 100 may include four signal internal electrodes each including the signal internal electrode 11A instead of the signal internal electrodes 11-14. In this case, the lead portions 112A and 113A of the signal internal electrode 11A are connected to the side surface portions 132 and 134 and the bottom surface portion 135 of the signal external electrode 120 and 130, respectively. As a result, the contact resistance between the signal internal electrodes 11 (11A) to 14 (11A) and the signal external electrodes 120 and 130 can be further reduced, and a larger amount of current can be supplied to the signal internal electrodes 11 (11A) to 14 (11A ). Further, the heat generated in the signal internal electrodes 11 (11A) to 14 (11A) can be easily transmitted to the signal external electrodes 120 and 130, and the temperature rise of the electric element 100 can be further suppressed.

  FIG. 15 is a schematic diagram showing still another example of the signal internal electrode used in the electric element 100 shown in FIG. The laminate 110 shown in FIG. 2 may include a signal internal electrode 11B shown in FIG. 15 instead of the signal internal electrodes 11-14.

  Referring to FIG. 15, signal internal electrode 11B has a substantially plate shape having a length Ll and a width W5, and includes a flat plate portion 111B and lead portions 112B and 113B. The flat plate portion 111B has a rectangular shape. The flat plate portion 111B has a length L3 and a width W5. The width W5 is set to 11 mm, for example.

  The lead portion 112B has a rectangular shape and is provided in contact with one end of the flat plate portion 111B. In this case, the lead-out portion 112B protrudes to both sides of the flat plate portion 111B in the width direction DR2. The lead portion 112B has a length L2 and a width W1.

  The lead portion 113B has a rectangular shape and is provided in contact with the other end of the flat plate portion 111B. In this case, the lead-out part 113B protrudes to both sides of the flat plate part 111B in the width direction DR2 similarly to the lead-out part 112B. The lead portion 113B has a length L2 and a width W1.

  Thus, the signal internal electrode 11B has the two lead portions 112B and 113B protruding to both sides of the flat plate portion 111B. And the length which the drawer | drawing-out parts 112B and 113B protrude from the flat plate part 111B is 2 * W3 = W1-W5.

  The electric element 100 may include four signal internal electrodes each including the signal internal electrode 11B instead of the signal internal electrodes 11-14. In this case, each of the lead portions 112B and 113B of the signal internal electrode 11B is connected to the side surface portions 132 and 134 and the bottom surface portion 135 of the signal external electrode 120 and 130. As a result, the contact resistance between the signal internal electrodes 11 (11B) to 14 (11B) and the signal external electrodes 120 and 130 can be further reduced as compared with the case where the signal internal electrode 11 is used, and more current is signaled. Can flow through the internal electrodes 11 (11B) to 14 (11B). In addition, the heat generated in the signal internal electrodes 11 (11B) to 14 (11B) is more easily transferred to the signal external electrodes 120 and 130 than when the signal internal electrode 11 is used, and the temperature of the electric element 100 increases. Can be further suppressed.

  FIG. 16 is a schematic view showing still another example of the signal internal electrode used in the electric element 100 shown in FIG. The laminate 110 shown in FIG. 2 may include a signal internal electrode 11C shown in FIG. 16 instead of the signal internal electrodes 11-14.

  Referring to FIG. 16, signal internal electrode 11C has a substantially plate shape having a length Ll and a width W5, and includes a flat plate portion 111C and lead portions 112C and 113C. The flat plate portion 111C has a rectangular shape. The flat plate portion 111C has a length L3 and a width W5.

  The lead portion 112C has a rectangular shape and is provided in contact with one end of the flat plate portion 111C. In this case, the lead-out part 112C protrudes to one side (left side in FIG. 16) of the flat plate part 111C in the width direction DR2. The lead portion 112C has a length L2 and a width W3 + W5.

The lead portion 113C has a rectangular shape and is provided in contact with the other end of the flat plate portion 111C. In this case, the lead portion 113C protrudes to the other side (right side in FIG. 16) of the flat plate portion 111C, which is the opposite direction to the protrusion direction of the lead portion 112C in the width direction DR2. The lead portion 113C has a length L2 and a width W3 + W5.
Thus, the signal internal electrode 11C has the two lead portions 112C and 113C protruding to the opposite side of the flat plate portion 111C. And the length which the drawer | drawing-out part 112C, 113C protrudes from the flat plate part 111C is W3 = (W1-W5) / 2.
The electric element 100 may include four signal internal electrodes each formed of the signal internal electrode 11C instead of the signal internal electrodes 11-14. In this case, the lead portion 112C of the signal internal electrode 11C is connected to the side surface portion 132 and the bottom surface portion 135 of the signal external electrode 120, and the lead portion 113C is connected to the side surface portion 134 and the bottom surface portion 135 of the signal external electrode 130. Connected. As a result, the contact resistance between the signal internal electrodes 11 (11C) to 14 (11C) and the signal external electrodes 120 and 130 can be further reduced as compared with the case where the signal internal electrode 11 is used, and more current is signaled. Can flow through the internal electrodes 11 (11C) to 14 (11C). In addition, the heat generated in the signal internal electrodes 11 (11C) to 14 (11C) is more easily transferred to the signal external electrodes 120 and 130 than when the signal internal electrode 11 is used, and the temperature of the electric element 100 increases. Can be further suppressed.

  FIG. 17 is a schematic view showing still another example of signal internal electrodes used in the electric element 100 shown in FIG. The laminated body 110 shown in FIG. 2 may include a signal internal electrode 11D shown in FIG. 17 instead of the signal internal electrodes 11-14.

  Referring to FIG. 17, signal internal electrode 11D has a substantially plate shape having a length Ll and a width W5, and includes a flat horizontal portion 111D and lead portions 112D and 113D. The flat plate portion 111D has a rectangular shape. The flat plate portion 111D has a length L3 and a width W5.

  The lead portion 112D has a rectangular shape and is provided in contact with one end of the flat plate portion 111D. In this case, the lead-out part 112D protrudes to one side (right side in FIG. 17) of the flat plate part 111D in the width direction DR2. The lead portion 112D has a length L2 and a width W3 + W5.

The lead portion 113D has a rectangular shape and is provided in contact with the other end of the flat plate portion 111D. In this case, the lead portion 113D protrudes to the other side (left side in FIG. 17) of the flat plate portion 111D, which is the direction opposite to the protrusion direction of the lead portion 112D in the width direction DR2. The lead portion 113D has a length L2 and a width W3 + W5.
Thus, the signal internal electrode 11D has the two lead portions 112D and 113D protruding to the opposite side of the flat plate portion 111D. The length by which the leading portions 112D and 113D protrude from the flat plate portion 111D is W3 = (W1−W5) / 2.

  The electric element 100 may include four signal internal electrodes each formed of the signal internal electrode 11D in place of the signal internal electrodes 11-14. In this case, the lead portion 112D of the signal internal electrode 11D is connected to the side surface portion 134 and the bottom surface portion 135 of the signal external electrode 120, and the lead portion 113D is connected to the side surface portion 132 and the bottom surface portion 135 of the signal external electrode 130. The As a result, the contact resistance between the signal internal electrodes 11 (11D) to 14 (11D) and the signal external electrodes 120 and 130 can be further reduced as compared with the case where the signal internal electrode 11 is used, and more current is signaled. Can flow through the internal electrodes 11 (11D) to 14 (11D). In addition, the heat generated in the signal internal electrodes 11 (11D) to 14 (11D) is more easily transferred to the signal external electrodes 120 and 130 than when the signal internal electrode 11 is used, and the temperature of the electric element 100 increases. Can be further suppressed.

  FIG. 18 is a perspective view of another electrical element according to the embodiment of the present invention. The electric element according to the present invention may be an electric element 100A shown in FIG. Referring to FIG. 18, an electric element 100A is obtained by replacing the laminate 110 of the electric element 100 shown in FIG. 1 with a laminate 180 and replacing the signal external electrodes 120 and 130 with signal external electrodes 120A and 130A, respectively. Others are the same as those of the electric element 100.

The laminated body 180 has a substantially rectangular parallelepiped shape. The laminate 180 is the same as the laminate 110 except that the signal internal electrodes 11 to 14 are replaced with other signal internal electrodes described later in the laminate 110.
The signal external electrode 120A is formed at one end of the multilayer body 180 on the end face 180A, part of the side faces 180B and 180C, part of the bottom face 180D, and part of the top face 180E. The signal external electrode 130A is formed at the other end of the multilayer body 180 on the end face 180F, part of the side faces 180B and 180C, part of the bottom face 180D, and part of the top face 180E. Of the signal external electrodes 120A and 130A, the portions formed on the side surfaces 180B and 180C of the multilayer body 180 gradually increase in width from the bottom surface 180D to the top surface 180E of the multilayer body 180.

  The grounding external electrode 140 is formed on a part of the side surfaces 180B and 180C, the bottom surface 180D, and the top surface 180E of the multilayer body 180 on the signal external electrode 120A side. The grounding external electrode 150 is formed on a part of the side surfaces 180B and 180C, the bottom surface 180D, and the top surface 180E of the multilayer body 180 on the signal external electrode 130A side.

  FIG. 19 is a perspective view of a signal internal electrode provided in the laminate 180 shown in FIG. Referring to FIG. 19, laminated body 180 includes signal internal electrodes 31 to 34 instead of signal internal electrodes 11 to 14.

  The signal internal electrode 31 includes a flat plate portion 311 and lead portions 312 and 313. The signal internal electrode 32 includes a flat plate portion 321 and lead portions 322 and 323. The signal internal electrode 34 includes a flat plate portion 341 and lead portions 342 and 343. In FIG. 19, the signal internal electrode 33 is not shown, but the signal internal electrode 33 also includes a flat plate portion and two lead portions.

  The signal internal electrodes 31 to 34 have the same shape as the signal internal electrode 11A shown in FIG. Therefore, the drawer portions 312, 321, and 341 correspond to the drawer portion 112 A, and the drawer portions 313, 323, and 343 correspond to the drawer portion 113 A. The signal internal electrodes 31 to 34 have the same dimensions as the signal internal electrode 11A, and the lengths of the lead portions 312, 322, 342, 313, 323, 343 are the length L2 of the lead portions 112A, 113A. It is only different.

  The lead portions 312, 322, and 342 have lengths L 7, L 8, and L 10, respectively, and the lead portions 313, 323, and 343 have lengths L 7, L 8, and L 10, respectively. A relationship of L7 <L8 <L10 is established between L7, L8, and L10.

  As described above, the laminate 180 includes the signal internal electrodes 31 to 34 in which the length of the lead portion is gradually increased.

  FIG. 20 is a perspective view showing a connection state between the signal internal electrodes 31 to 34 and the signal external electrodes 120A and 130A in the laminate 180 shown in FIG. In FIG. 20, only three side portions of the signal external electrodes 120A and 130A are shown.

  Referring to FIG. 20, the signal internal electrodes 31 to 34 are sequentially stacked in the vertical direction DR3. Each of the signal external electrodes 120A and 130A includes side portions 121 and 122. Each of the side surfaces 121 and 122 gradually increases in width from the signal internal electrode 31 toward the signal internal electrode 34 in the vertical direction DR3.

  The lead portions 312, 322, 332, and 342 of the signal internal electrodes 31 to 34 are connected to the side surface portions 121 and 122. In this case, the side surfaces 121 and 122 are gradually widened from the signal internal electrode 31 toward the signal internal electrode 34, and the lead portions 312, 322, 332, and 342 are signal internal electrodes. The length gradually increases from 31 toward the signal internal electrode 34. Accordingly, the lead portions 312, 322, 332, and 342 are connected to the side surface portions 121 and 122 with the full width of the side surface portions 121 and 122 of the signal external electrode 120A.

  Similarly, the lead portions 313, 323, 333, and 343 of the signal internal electrodes 31 to 34 are connected to the side surface portions 121 and 122 with the full width of the side surface portions 121 and 122 of the signal external electrode 130A.

  Therefore, in the electric element 100A, the contact area between the signal internal electrodes 31 to 34 and the signal external electrodes 120A and 130A increases in the vertical direction DR3 (= from the signal internal electrode 31 to the signal internal electrode 34). As you go in the direction of

  When the electric element 100A is mounted on the substrate and current is supplied from the bottom surface 180D side of the laminate 180 to the signal external electrode 120A, the distance from the point where the current is supplied to the signal internal electrodes 31 to 34 is different. The resistance when the current is supplied to the signal internal electrode 34 is larger than the resistance when the current is supplied to the signal internal electrode 31.

  However, as described above, the contact area between the signal internal electrodes 31 to 54 and the signal external electrodes 120A and 130A increases in the vertical direction DR3 (= from the signal internal electrode 31 to the signal internal electrode 34). Therefore, the resistance when the current is supplied to the signal internal electrodes 31 to 34 can be made substantially equal between the signal internal electrodes 31 to 34.

As a result, the current that can flow through each of the signal internal electrodes 31 to 34 can be equalized, and if the current that flows through one signal internal electrode is determined, the current that flows through the entire signal internal electrodes 31 to 34 can be easily determined. it can.
Preferably, the side surface portions 121, 122 of the signal external electrodes 120A, 130A are such that the resistance when current is supplied to the signal internal electrodes 31-34 is substantially equal between the signal internal electrodes 31-34. Determine the width of.

  FIG. 25 is a schematic view showing still another example of the signal internal electrode used in the electric element 100 shown in FIG. The laminate 110 shown in FIG. 2 may include a signal internal electrode 11E shown in FIG. 25 instead of the signal internal electrodes 11-14.

  Referring to FIG. 25, signal internal electrode 11E, ground internal electrode 21B, a third bottom surface electrode 2000, a fourth bottom surface electrode 2001, a ground internal electrode 21B and a ground external electrode 140 in a strip shape on a substantially rectangular parallelepiped bottom surface And third connecting portions 212A and 213A for connecting to the ground, and fourth connecting portions 214A and 215A for connecting the grounding internal electrode 21B and the grounding external electrode 150 to each other.

  The third and fourth connection portions are formed in a trapezoidal shape, and as shown in FIGS. 26 (a), (b), and (c), the third connection portion 212A that is trapezoidal at both ends of the grounding internal electrode 21B. , 213A and the fourth connection portions 214A, 215A, the current component flowing in the opposite direction to the current flowing in the signal internal electrode 11E appears, and the magnetic field cancels and the inductance decreases.

  On the other hand, FIG. 27 (a) and FIG. 27 (b) show current flows in the internal electrodes of FIG. 23 and FIG. Since the flow of the portion connecting the grounding internal electrode 606 and the grounding external electrode 604 is substantially perpendicular to the current flow of the signal internal electrode 605, the magnetic field is not canceled and the inductance cannot be reduced. It was.

  FIG. 28 is a schematic diagram showing still another example of the signal internal electrode used in the electric element 100 shown in FIG. The laminated body 110 shown in FIG. 2 includes the signal internal electrode 11E and the grounding internal electrode 21B shown in FIGS. 28A, 28B, 28C, and 28D instead of the signal internal electrodes 11-14. You may have.

  Referring to FIGS. 28 (a), (b), and (c), the third connecting portions 212A and 213A and the fourth connecting portions 214A and 215A in FIG. 25 (e) are changed from a trapezoidal shape to a substantially parallelogram shape. It is a thing.

  The trapezoidal vertical part is eliminated from the above, and the current component flowing through the third connection part 212A, 213A and the fourth connection part 214A, 215A is divided because it is inclined. A component in the direction opposite to the current flowing through the electrode 11E and the grounding internal electrode 21B appears, and the magnetic field cancels out and the inductance can be reduced.

  In the case of FIG. 28 (d), the ground external electrodes 140 and 150, which are external electrodes to which the ground internal electrode 21B is connected, are connected to the signal internal electrode 11E, respectively. The external electrodes 120 and 130 are formed on the same surface. In this case, the flow of current at the connecting portion between the signal internal electrode 11E, the signal external electrodes 120 and 130, and the ground internal electrode 21B and the ground external electrodes 140 and 150 is reversed and magnetic field cancellation occurs. Therefore, inductance can be reduced.

    FIG. 29 is a schematic view showing still another example of the signal internal electrode used in the electric element 100 shown in FIG. A laminated body 110 shown in FIG. 2 includes a signal internal electrode 11F, a ground internal electrode as shown in FIGS. 29 (a), (b), (c), and (d) instead of the signal internal electrodes 11-14. The first dividing groove 1200 and the second dividing groove 1201 may be provided in 21C.

  With reference to FIG. 29A, a method of improving the warp of the electric element 100 shown in FIG. 1 will be described.

  By dividing the signal internal electrode 11F and the grounding internal electrode 21C into two in the long axis direction, the extension of the signal internal electrode 11F and the grounding internal electrode 21C is divided and relaxed in the short axis direction. . Conventionally, since firing was performed at 1350 ° C, cracks, cracks, peeling, etc. caused by warpage due to differences in the coefficient of thermal expansion between the conductor layer and the dielectric layer were reduced by dividing the conductor layer and reducing the elongation. Can be made. The effect of FIG. 29 (b) is the same as that of FIG. 29 (a).

FIG. 29 (c) shows that the signal internal electrode 11F and the grounding internal electrode 21C are arranged in the major axis direction by dividing the signal inner electrode 11F and the grounding inner electrode 21C in the minor axis direction. Since it is divided into about two minutes, the elongation of the conductor layer is relaxed, and the warp due to the difference in the thermal expansion coefficient between the conductor layer and the dielectric layer can be reduced, which has the same effect as in FIG.
FIG. 29 (d) is a combination of the first and second dividing grooves of FIGS. 29 (a) and 29 (c), and has the same effects as those of FIGS. 29 (a) and 29 (c). Become.

FIG. 30 is a schematic diagram in which a conductor plate 400 made of copper is connected to the electric element 100 shown in FIG.
Referring to FIGS. 30 (a), 30 (b), and 30 (c), apply cream solder to a part of the signal external electrodes 120 and 130, cover the electric element 100, and put it in a reflow furnace for soldering. To do. At this time, the grounding external electrodes 140A and 150A are substantially perpendicular to the bottom surface of the rectangular parallelepiped shape of the electric element 100 and are opposed to each other at a second position substantially perpendicular to the bottom surface and the first side surface. It forms from the lower end of the side to the place where it does not reach the upper end. By doing so, a short circuit between the conductor plate 400 and the grounding external electrodes 140A and 150A can be prevented.

  However, since the conductor plate 400 in the case of FIG. 29C is provided with a recess in the portion where the grounding external electrodes 140 and 150 protrude, the grounding external electrodes 140 and 150 are connected to the side surface of the electric element 100. Even if it reaches from the lower end to the upper end of the second side surface, no short circuit occurs.

  Although it has been described that the conductor plate is made of copper, the present invention is not limited thereto, and the conductor plate may be made of a metal bulk such as silver, gold, or aluminum.

  As described above, by attaching the conductor plate 400, the conductor plate 400 with less resistance component reduces heat generation, and the conductor plate 400 also has a heat dissipation effect, so there is little heat generation and a large current flows. I can do it. As a result, the mounting substrate and surrounding components are not adversely affected by heat or the like.

  FIG. 31 shows data obtained by measuring the number of layers and the allowable current for the electrical element with and without the copper conductor plate 400 added. Even if the electrical element to which the copper conductor plate 400 is added has the same number of layers, a large current can flow.

In the above description, the dielectric layers 1 to 10, 1A, and 2A are all configured of the same dielectric material (BaTiO ₃ ). However, in the present invention, the dielectric layers 1 to 10 are not limited thereto. 1A and 2A may be made of different dielectric materials, may be made of two types of dielectric materials, and is generally made of one or more types of dielectric materials. Just do it. In this case, each dielectric material constituting the dielectric layers 1 to 5 preferably has a relative dielectric constant of 3000 or more.
Then, as the dielectric material other than _{BaTi O 3, Ba (Ti,} Sn) O 3, Bi4Ti 3 O 12, (Ba, S r, Ca) Ti O 3, (Ba, Ca) (Z r, Ti) O ₃ , (a, Sr, Ca) (Zr, Ti) O ₃ , SrTiO ₃ , CaTiO ₃ , PbTi O ₃ , b (Zn, Nb) O ₃ , Pb (Fe, W) O ₃ , Pb (Fe, Nb) O ₃ , Pb (Mg, Nb) O ₃ , Pb (Ni, W) O ₃ , Pb (Mg, W) O ₃ , Pb (Zr, Ti) Pb (Li, Fe, W) _{O 3, Pb 5 Ge 3 O} 11 and Ca Z r O ₃ or the like can be used.

  In the above, signal external electrodes 120, 130, 120A, 130A, signal internal electrodes 11-14, 11A, 11B, 11C, 11D, 31-34, ground internal electrodes 21-25 and ground external electrodes In the present invention, the signal external electrodes 120, 130, 120A, 130A, the signal internal electrodes 11-14, 11A, 11B, 11C have been described as being made of nickel (Ni). 11D, 11E, 11F, 31-34, grounding internal electrodes 21-25, 21B, 21C and grounding external electrodes 140, 150 are silver (Ag), palladium (Pd), silver palladium alloy (Ag-Pd) , Platinum (Pt), gold (Au), copper (Cu), rubidium (Ru), and tungsten (W).

  Further, in the above, the number of signal internal electrodes connected to the signal external electrodes 120, 130, 120A, 130A is four (signal internal electrodes 11-14, 31-34), and the ground external The number of grounding internal electrodes connected to the electrodes 140 and 150 has been described as five (grounding internal electrodes 21 to 25). However, in the present invention, the electrical elements 100 and 100A are not limited thereto. , N (n is a positive integer) number of signal internal electrodes connected to the signal external electrodes 120, 130, 120A, 130A and m (m is a positive integer) connected to the ground external electrodes 140, 150 ) Individual internal electrodes for grounding. In this case, the electric elements 100 and 100A include j (j = m + n) dielectric layers. If at least one signal internal electrode connected to the signal external electrode 120, 130, 120A, 130A and ground internal electrode connected to the ground external electrode 140, 150 are provided, magnetic interference is prevented. This is because the effective inductance can be reduced.

  In the present invention, as the current flowing through the electrical elements 100 and 100A increases, the number of signal internal electrodes connected to the signal external electrodes 120, 130, 120A, and 130A and the ground external electrodes 140 and 150 are increased. , 140A, 150A and the number of grounding internal electrodes connected to 150A are increased. Signal internal electrode connected to signal external electrode 120, 130, 120A, 130A and ground internal electrode connected to ground external electrode 140, 150, 140A, 150A are multiple signal internal electrodes / ground internal When consisting of electrodes, multiple signal internal electrodes / ground internal electrodes can be connected between two signal external electrodes (120, 130; 120A, 130A) or two ground external electrodes (140, 150, 140A). 150A) in parallel, the number of signal internal electrodes connected to the signal external electrodes 120, 130, 120A, 130A and the ground external electrodes 140, 150, 140A, 150A are connected. This is because the current flowing through the electric element 100 can be increased by increasing the number of grounding internal electrodes.

  In the present invention, when the impedance of the electrical elements 100 and 100A is relatively lowered, the number of signal internal electrodes connected to the signal external electrodes 120, 130, 120A, and 130A, and the ground external electrode 140 , 150, 140A, and the number of grounding internal electrodes connected to 150A are increased. If the number of signal internal electrodes connected to the signal external electrodes 120, 130, 120A, 130A and the number of ground internal electrodes connected to the ground external electrodes 140, 150, 140A, 150A are increased, This is because the number of capacitors connected in parallel increases, the effective capacitance of the electric elements 100 and 100A increases, and the impedance decreases.

  Furthermore, in the above description, the electric elements 100 and 100A have been described as being used as a noise filter that traps unnecessary high-frequency current generated by the CPU 170 in the vicinity of the CPU 170. However, in the present invention, the electric element 100 is not limited thereto. , 100A is also used as a capacitor. Since the electric elements 100 and 100A include eight capacitors connected in parallel as described above, they can also be used as capacitors.

  More specifically, the electrical elements 100 and 100A are used in notebook computers, CD-RW / DVD devices, game machines, information appliances, digital cameras, automotive electrical equipment, equipment, MPU peripheral circuits, DC / DC converters, and the like. Used. Therefore, it is used as a capacitor in notebook PCs and CD-RW / DVD devices, etc., but it is a noise filter that is used between the power supply 160 and the CPU 170 and traps unnecessary high-frequency current generated by the CPU 170 in the vicinity of the CPU 170. The electric element having a function is included in the electric elements 100 and 100A according to the present invention.

The embodiments disclosed herein are illustrative and non-restrictive in all respects.
Should be. The scope of the present invention is not the description of the embodiments described above, but the scope of the claims.
Includes all modifications within the meaning and scope equivalent to the scope of the claims.
Is intended.

    The present invention is applied to an electric element that can easily determine a direct current that can flow through the entire element.

It is a perspective view which shows the structure of the electric element by embodiment of this invention. FIG. 2 is a perspective view of the laminate shown in FIG. FIG. 3 is a diagram for explaining dimensions of a dielectric layer 2 and signal internal electrodes shown in FIG. FIG. 3 is a diagram for explaining dimensions of another dielectric layer and a grounding internal electrode shown in FIG.

FIG. 6 is a plan view of adjacent signal internal electrodes and ground internal electrodes. It is a conceptual diagram for demonstrating the connection method of the signal internal electrode and signal external electrode of an electrical element. It is a conceptual diagram for demonstrating the connection method of the internal electrode for grounding of an electric element, and the external electrode for grounding. FIG. 2 is a perspective view for explaining the function of the electric element shown in FIG. It is a figure for demonstrating the magnetic flux density produced | generated by the electric current which flows through conducting wire. It is a figure for demonstrating the effective inductance when a magnetic interference arises between two conducting wires. FIG. 2 is a perspective view of a substrate on which the electric element shown in FIG. 1 is arranged. FIG. 2 is a conceptual diagram showing a state in which the electric element shown in FIG. 1 is arranged on a substrate. FIG. 2 is a conceptual diagram showing a usage state of the electric element shown in FIG. FIG. 5 is a schematic view showing another example of signal internal electrodes used in the electrical element shown in FIG. FIG. 5 is a schematic view showing still another example of the signal internal electrode used in the electric element shown in FIG. FIG. 5 is a schematic view showing still another example of the signal internal electrode used in the electric element shown in FIG. FIG. 5 is a schematic view showing still another example of the signal internal electrode used in the electric element shown in FIG. It is a perspective view of the other electric element by embodiment of this invention. FIG. 19 is a perspective view of a signal internal electrode provided in the laminate shown in FIG. FIG. 19 is a perspective view showing a connection state between a signal internal electrode and a signal external electrode in the laminate shown in FIG. It is a perspective view of the conventional feedthrough three-terminal capacitor. FIG. 22 is a cross-sectional view of the feedthrough three-terminal capacitor between lines XXII-XXII shown in FIG. FIG. 23 is a cross-sectional view of the feedthrough three-terminal capacitor in a plane including one signal internal electrode shown in FIG. FIG. 23 is a cross-sectional view of a feedthrough three-terminal capacitor in a plane including one grounding internal electrode shown in FIG. FIG. 6 is a schematic view showing still another example of a grounding internal electrode used in the electric element shown in FIG. FIG. 26 is a schematic diagram showing a current flow of a signal internal electrode and a ground internal electrode used in the electrical element shown in FIG. It is the schematic which shows the flow of the electric current of the signal internal electrode of the conventional penetration type | mold 3 terminal capacitor, and the internal electrode for grounding. FIG. 5 is a schematic view showing still another example of the signal internal electrode and the ground internal electrode used in the electrical element shown in FIG. FIG. 2 is a schematic view in which a dividing groove is formed in a signal internal electrode and a ground internal electrode used in the electrical element shown in FIG. FIG. 2 is a schematic diagram showing an arrangement of grounding external electrodes by adding a conductor plate to the electric element shown in FIG. FIG. 2 is a graph of current value measurement with and without a conductor plate added to the electric element shown in FIG.

Explanation of symbols

1-10, 1A, 2A Dielectric layer, 11-14, 11A, 11B, 11C, 11D, 11E, 11F, 31-34 Signal internal electrode, 21-25, 21B, 21C Ground internal electrode, 212A, 213A 3rd connection part, 214A, 215A 4th connection part, 1200 1st dividing groove, 1201 2nd dividing groove, 2000 3rd bottom electrode, 2001 4th facing electrode, 21a one end, 21b other end, 70, 80 arrow, 100, 100A, 100B Electrical element, 110, 180 laminate, 110A, 110F, 180A, 180F end face, 110B, 110C, 180B, 180C side face, 110D, 180D bottom face, 110E, 180E top face, 120, 120A, 130, 130A signal External electrode for 140, 140A, 150, 150A External electrode for grounding, 111, 111A, 111B, 111C, 111D, 211 flat plate part, 112, 112A, 112B, 112C, 112D, 113, 113A, 113B, 113C, 113D, 212-215, 212A-215A, 312, 321, 332, 342, 313, 323, 333, 343 drawer, 121, 122, 131-134 side, 135 bottom, conductor plate 400, 160 power supply, 161, 171 Positive terminal, 162, 172 negative terminal, 170 CPU, 200 substrate, 201 dielectric, 201A surface, 201B back surface, 202-205 Body plate, 202A, 230A top surface, 206-209 via hole, 600 through three-terminal capacitor, 602, 603 signal external electrode, 602A, 603A, 604A bottom surface, 604 ground external electrode, 605 signal internal electrode, 606 ground Internal electrode, 607 dielectric, 201, 2031 first part, 2022, 2032 second part, 2023, 2033 third part

Claims (6)

A rectangular parallelepiped shape including a plurality of signal inner conductor layers, a plurality of ground inner conductor layers, and a plurality of dielectric layers interposed between the signal inner conductor layer and the ground inner conductor layer,
A first signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on one of the first side surfaces perpendicular to the bottom surface of the rectangular parallelepiped shape;
A second signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on the other of the first side surfaces;
In a second side surface perpendicular to the bottom surface and the first side surface and facing each other, a position close to the first signal external electrode away from the center of the second side surface in the direction in which the first side surface opposes A first grounding external electrode in which the plurality of grounding internal conductor layers are connected in parallel;
The second side surface that is perpendicular to the bottom surface and the first side surface and faces each other, and a position that is away from the center of the second side surface and close to the second signal external electrode with respect to the direction in which the first side surface opposes A second grounding outer electrode in which the plurality of grounding inner conductor layers are connected in parallel;
A third bottom electrode having a strip shape connecting the first grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface;
An electric element comprising a fourth bottom electrode in a strip shape connecting the second grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface,
The grounding inner conductor layer includes a pair of protruding third connection parts and fourth connection parts that connect the first grounding external electrode and the second grounding external electrode, and The protruding shape of the 3 connecting portion and the fourth connecting portion is a trapezoidal shape with a wide base on the inner side of the rectangular parallelepiped shape,
The plurality of signal inner conductor layers each have a first flat plate portion and first and second lead portions having a width wider than the first flat plate portion,
Each of the plurality of grounding inner conductor layers has a second flat plate portion and third and fourth lead portions, and the first signal outer electrode and the second signal outer electrode are arranged. The width between the outer edge portion of the third lead portion and the outer edge portion of the fourth lead portion with respect to the direction perpendicular to the direction is wider than the width of the second flat plate portion. element. In the third connection portion and a fourth connection portion trapezoidal in the electrical device, the electrical device according to claim 1 in which the vertical sides of said trapezoidal, characterized in that a parallelogram shape inclined. A rectangular parallelepiped shape including a plurality of signal inner conductor layers, a plurality of ground inner conductor layers, and a plurality of dielectric layers interposed between the signal inner conductor layer and the ground inner conductor layer,
A first signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on one of the first side surfaces perpendicular to the bottom surface of the rectangular parallelepiped shape;
A second signal external electrode in which the plurality of signal internal conductor layers are connected in parallel on the other of the first side surfaces;
In a second side surface perpendicular to the bottom surface and the first side surface and facing each other, a position close to the first signal external electrode away from the center of the second side surface in the direction in which the first side surface opposes A first grounding external electrode in which the plurality of grounding internal conductor layers are connected in parallel;
The second side surface that is perpendicular to the bottom surface and the first side surface and faces each other, and a position that is away from the center of the second side surface and close to the second signal external electrode with respect to the direction in which the first side surface opposes A second grounding outer electrode in which the plurality of grounding inner conductor layers are connected in parallel;
A third bottom electrode having a strip shape connecting the first grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface;
An electric element comprising a fourth bottom electrode in a strip shape connecting the second grounding external electrode on the second side surface in parallel with the first side surface on the rectangular bottom surface,
The grounding inner conductor layer includes a pair of protruding third connection parts and fourth connection parts that connect the first grounding external electrode and the second grounding external electrode, and The protruding shape of the 3 connecting portion and the fourth connecting portion is a trapezoidal shape with a wide base on the inner side of the rectangular parallelepiped shape,
The plurality of signal inner conductor layers each have a first flat plate portion and first and second lead portions having a width wider than the first flat plate portion,
Each of the plurality of grounding inner conductor layers has a second flat plate portion and third and fourth lead portions, and the first signal outer electrode and the second signal outer electrode are arranged. With respect to the direction perpendicular to the direction, the width between the outer edge portion of the third lead portion and the outer edge portion of the fourth lead portion is wider than the width of the second flat plate portion,
In the electric element comprising a conductor plate covering the uppermost surface of the electric element and the other end of the first side surface from one end of the first side surface of the rectangular parallelepiped shape of the electric element,
The electrical element, wherein the first grounding external electrode and the second grounding external electrode are formed from the lower end of the second side surface to the middle not reaching the upper end. The signal inner conductor layer and the ground inner conductor layer are arranged at the same position parallel to the major axis direction of the signal inner conductor layer and the ground inner conductor layer, and the signal inner conductor layer and the ground inner conductor. The electric element according to claim 3 , further comprising a first dividing groove in which a portion excluding both ends of the layer is divided or divided from one end to the other end. The signal inner conductor layer and the ground inner conductor layer are inclined in the minor axis direction with respect to the major axis direction at the same position in the center of the major axis direction of the signal inner conductor layer and the ground inner conductor layer. 5. The electric element according to claim 4 , further comprising at least one second dividing groove obtained by dividing a part of the short axis. 6. The electric element according to claim 5 , wherein the second dividing groove is connected to the first divided groove parallel to the major axis direction of the signal inner conductor layer and the signal inner conductor layer.

Images