JP5042892B2 - Feedthrough capacitor - Google Patents

Description

  The present invention relates to a feedthrough capacitor.

A feedthrough capacitor is known that includes a capacitor element body in which dielectric layers and internal electrodes are alternately stacked, and a terminal electrode formed on the surface of the capacitor element body (for example, Patent Document 1). reference).
Japanese Patent Laid-Open No. 01-206615

  Incidentally, in order to reduce the impedance of such a feedthrough capacitor, it is necessary to lower the equivalent series inductance (ESL). In particular, to achieve high frequency operation, it is necessary to keep ESL sufficiently low. However, the feedthrough capacitor described in Patent Document 1 has not been studied for lowering the ESL.

  In recent years, products have been miniaturized, and accordingly, an increase in wiring density on a circuit board is desired. However, in the feedthrough capacitor described in Patent Document 1, when it is mounted on a circuit board, the wiring space is reduced accordingly. Therefore, the wiring density is reduced.

  Therefore, an object is to provide a feedthrough capacitor capable of suppressing a decrease in wiring density when mounted on a circuit board and capable of reducing an ESL.

  A feedthrough capacitor according to the present invention includes a substantially rectangular parallelepiped capacitor body formed by laminating a plurality of insulator layers, a signal internal electrode and a ground internal electrode that are disposed in the capacitor body and face each other, and a capacitor body. Any of the signal terminal electrodes provided on the first and second end faces in the longitudinal direction of the capacitor and connected to the signal internal electrodes, and the first to fourth side faces extending along the longitudinal direction of the capacitor body A grounding terminal electrode provided on at least one side surface and connected to the grounding internal electrode, and the grounding terminal electrode is provided on at least one of the first end surface and the second end surface. It is characterized by.

  According to the feedthrough capacitor of the present invention, the signal terminal electrodes are provided on the first and second end faces of the capacitor body, and the ground terminal electrodes are provided on the first to fourth side faces of the capacitor body. Since the ground terminal electrode is provided near the first end face or the second end face, the positions of the ground terminal electrode and the signal terminal electrode can be brought close to each other. Therefore, the ESL of the feedthrough capacitor can be reduced. Moreover, the center part of the 1st-4th side surface becomes an area | region in which a terminal electrode is not formed. Therefore, when the feedthrough capacitor is mounted on the circuit board, the space below the center portion of the feedthrough capacitor can be used as a wiring space, and a decrease in wiring density that can occur when the feedthrough capacitor C1 is mounted can be suppressed.

  Preferably, at least one of the first to fourth side surfaces is provided with a grounding terminal electrode near the first end surface and the second end surface, respectively, and the grounding terminal electrode is near the first end surface. And when viewed from the direction perpendicular to the side surface provided near the second end surface, the distance between the ground terminal electrodes provided on the side surface is equal to the ground terminal electrode provided near the first end surface. Longer than the distance between the first end face and the distance between the ground terminal electrode provided near the second end face and the second end face.

  In this case, since the grounding terminal electrode and the signal terminal electrode can be brought closer to each other, the ESL of the feedthrough capacitor can be further reduced. Since the distance between the grounding terminal electrode provided near the first end face and the grounding terminal electrode provided near the second end face can be increased, the region where the terminal electrode is not formed in the central portion of the feedthrough capacitor It can be wider. Therefore, when this feedthrough capacitor is mounted on the circuit board, a wider wiring space can be secured under the feedthrough capacitor, and more wiring can be passed under the feedthrough capacitor.

  Preferably, a ground terminal electrode is provided near the first end surface on the first side surface, and a ground terminal electrode is provided near the second end surface on the second side surface opposite to the first side surface. And the grounding terminal electrode provided near the first end surface on the first side surface and the grounding terminal electrode provided near the second end surface on the second side surface when viewed from the opposing direction of the second side surface. Between the ground terminal electrode provided near the first end face on the first side surface and the first end face, and on the second side face near the second end face. Longer than the distance between the grounded terminal electrode and the second end face.

  In this case, since the ground terminal electrode and the signal terminal electrode can be brought close to each other, the ESL of the feedthrough capacitor can be further reduced. Since the distance between the grounding terminal electrode provided near the first end face and the grounding terminal electrode provided near the second end face can be increased, the region where the terminal electrode is not formed in the central portion of the feedthrough capacitor It can be wider. Therefore, when this feedthrough capacitor is mounted on the circuit board, a wider wiring space can be secured under the feedthrough capacitor, and a reduction in wiring density can be more reliably suppressed.

  Preferably, a plurality of grounding internal electrodes and grounding terminal electrodes are provided, and at least two of the grounding internal electrodes are connected to different grounding terminal electrodes.

  In this case, at least two capacitance component forming regions connected in parallel are provided, and these regions are in a parallel connection relationship. By designing so that the capacitance values of these regions are different, it is possible to obtain a feedthrough capacitor having a low impedance over a wide band.

  Preferably, a plurality of signal internal electrodes are provided, and at least one of the plurality of signal internal electrodes and at least one of the plurality of ground internal electrodes are formed in the same layer in the stacking direction.

  In this case, since the signal internal electrode and the ground internal electrode are formed in the same layer, the number of stacked layers can be reduced correspondingly, and the feedthrough capacitor can be reduced in size.

  A feedthrough capacitor mounting structure according to the present invention includes the feedthrough capacitor described above and a circuit board having a conductor wiring formed on the surface thereof, and the feedthrough capacitor has a longitudinal direction intersecting with a direction in which the conductor wiring extends. It is arranged on the conductor wiring.

  When the feedthrough capacitor is mounted on a circuit board so that the longitudinal direction intersects the direction in which the conductor wiring extends, a short circuit should occur between the signal terminal electrode and ground terminal electrode of the feedthrough capacitor and the conductor wiring. Therefore, it is possible to place the conductor wiring under the feedthrough capacitor. Therefore, the installation space of the feedthrough capacitor can be used as a wiring space, and a reduction in the wiring density due to mounting of the feedthrough capacitor can be suppressed.

  Preferably, the region between the ground terminal electrode provided near the first end face and the ground terminal electrode provided near the second end face in the feedthrough capacitor when viewed from the stacking direction is a conductor wiring. Placed on top.

  In this case, the probability of occurrence of a short circuit between the signal terminal electrode and ground terminal electrode of the feedthrough capacitor and the conductor wiring can be further reduced.

  According to the present invention, it is possible to provide a feedthrough capacitor capable of suppressing a decrease in wiring density when mounted on a circuit board and capable of reducing an ESL.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.
(First embodiment)

  FIG. 1 is a perspective view of the feedthrough capacitor according to the first embodiment. FIG. 2 is an exploded perspective view of the capacitor body included in the feedthrough capacitor according to the first embodiment. FIG. 3 is a cross-sectional view of the feedthrough capacitor according to the first embodiment. FIG. 4 is a top view of the feedthrough capacitor according to the first embodiment and the circuit board on which the feedthrough capacitor is mounted. In FIG. 4, in order to make the drawing easy to see, the description of the soldered portion between the feedthrough capacitor and the circuit board is omitted.

  As shown in FIG. 1, the feedthrough capacitor C <b> 1 according to this embodiment includes a capacitor body 1, first and second signal terminal electrodes 11 and 12, and first to fourth ground terminal electrodes 13. ~ 16.

  The capacitor body 1 has a substantially rectangular parallelepiped shape, and extends between the first and second end faces 2 and 3 that are orthogonal to the longitudinal direction and face each other, and extends between the first and second end faces 2 and 3 in the longitudinal direction. And the first and second side surfaces 4 and 5 facing each other, and the third and fourth side surfaces 6 and 7 extending in the longitudinal direction and connecting the first and second end surfaces 2 and 3 and facing each other. And have. The third side surface 6 or the fourth side surface 7 is a main surface of the capacitor body 1 and is a mounting surface for other components (for example, a circuit board, an electronic component, etc.).

As shown in FIG. 2, the capacitor body 1 has a plurality of insulator layers 9. The capacitor body 1 is configured by laminating a plurality of insulator layers 9 in a direction in which the third and fourth side surfaces 6 and 7 face each other, and has dielectric characteristics. Each insulator layer 9 is a sintered body of a ceramic green sheet containing, for example, a dielectric ceramic (dielectric ceramic such as BaTiO ₃ series, Ba (Ti, Zr) O ₃ series, or (Ba, Ca) TiO ₃ series). Consists of In the actual feedthrough capacitor C1, the insulator layers 9 are integrated so that the boundary between them cannot be visually recognized.

  The first signal terminal electrode 11 is disposed on the first end face 2 of the capacitor body 1. The first signal terminal electrode 11 is formed over the end portions (end portions on the first end surface 2 side) of the first to fourth side surfaces 4 to 7 so as to cover the entire surface of the first end surface 2. Has been. The second signal terminal electrode 12 is disposed on the second end face 3 of the capacitor body 1. The second signal terminal electrode 12 is formed over the end portions (end portions on the second end surface 3 side) of the first to fourth side surfaces 4 to 7 so as to cover the entire surface of the second end surface 3. Has been. The first signal terminal electrode 11 and the second signal terminal electrode 12 are opposed to each other in the facing direction (longitudinal direction) of the first and second end faces 2 and 3.

  The first ground terminal electrode 13 is disposed on the first side surface 4 of the capacitor body 1. The first ground terminal electrode 13 is formed on the third and fourth side surfaces 6 and 7 so as to cover a part of the first side surface 4 along the opposing direction of the third and fourth side surfaces 6 and 7. It is formed over. The first ground terminal electrode 13 is located closer to the first end face 2 on the first side face 4.

  The second ground terminal electrode 14 is disposed on the first side surface 4 of the capacitor body 1. The second ground terminal electrode 14 is formed on the third and fourth side surfaces 6 and 7 so as to cover a part of the first side surface 4 along the opposing direction of the third and fourth side surfaces 6 and 7. It is formed over. The second ground terminal electrode 14 is located closer to the second end face 3 on the first side face 4.

  The third ground terminal electrode 15 is disposed on the second side surface 5 of the capacitor body 1. The third ground terminal electrode 15 is formed on the third and fourth side surfaces 6 and 7 so as to cover a part of the second side surface 5 along the opposing direction of the third and fourth side surfaces 6 and 7. It is formed over. The third ground terminal electrode 15 is located closer to the first end face 2 on the second side face 5. The third ground terminal electrode 15 is opposed to the first ground terminal electrode 13 in the facing direction of the first and second side surfaces 4 and 5.

  The fourth ground terminal electrode 16 is disposed on the second side surface 5 of the capacitor body 1. The fourth ground terminal electrode 16 is formed on the third and fourth side surfaces 6 and 7 so as to cover a part of the second side surface 5 along the opposing direction of the third and fourth side surfaces 6 and 7. It is formed over. The fourth ground terminal electrode 16 is located closer to the second end face 3 on the second side face 5. The fourth grounding terminal electrode 16 is opposed to the second terminal electrode 14 in the facing direction of the first and second side surfaces 4 and 5.

  As can be seen from FIG. 4, the distance between the first grounding terminal electrode 13 and the second grounding terminal electrode 14 is between the first grounding terminal electrode 13 and the first end face 2. Longer than the distance. The distance between the first ground terminal electrode 13 and the second ground terminal electrode 14 is longer than the distance between the second ground terminal electrode 14 and the second end face 3. The distance between the third ground terminal electrode 15 and the fourth ground terminal electrode 16 is longer than the distance between the third ground terminal electrode 15 and the first end face 2. The distance between the third ground terminal electrode 15 and the fourth ground terminal electrode 16 is longer than the distance between the fourth ground terminal electrode 16 and the second end face 3.

  The first and second signal terminal electrodes 11 and 12 and the first to fourth ground terminal electrodes 13 to 16 are made of, for example, a conductive paste containing conductive metal powder and glass frit outside the capacitor body 1. It is formed by applying to the surface and baking. If necessary, a plating layer may be formed on the baked first and second signal terminal electrodes 11, 12 and the first to fourth ground terminal electrodes 13-16.

  As shown in FIGS. 2 and 3, the feedthrough capacitor C1 includes a plurality (two in the present embodiment) of signal internal electrodes 20 and a plurality (two in the present embodiment) of grounding internal electrodes 24. ing. The signal internal electrode 20 and the ground internal electrode 24 are disposed at different positions (layers) in the facing direction of the third and fourth side surfaces 6 and 7. That is, the signal internal electrode 20 and the ground internal electrode 24 are arranged in the order of the signal internal electrode 20, the ground internal electrode 24, the signal internal electrode 20, and the ground internal electrode 24 in the capacitor body 1. The third and fourth side surfaces 6 and 7 are arranged with an interval in the facing direction. The signal internal electrode 20 and the ground internal electrode 24 are arranged in the capacitor body 1.

  The signal internal electrode 20 and the ground internal electrode 24 are made of a conductive material (for example, Ni, which is a base metal) that is normally used as an internal electrode of a laminated electrical element. The signal internal electrode 20 and the ground internal electrode 24 are configured as a sintered body of a conductive paste containing the conductive material.

  The signal internal electrode 20 has a substantially rectangular shape and includes a main electrode portion 21 and lead portions 22 and 23. The main electrode portion 21 and the lead portions 22 and 23 are integrally formed. The lead portion 22 extends from the edge of the main electrode portion 21 on the first end face 2 side so that the end is exposed to the first end face 2. The lead portion 23 extends from the edge of the main electrode portion 21 on the second end face 3 side so that the end is exposed on the second end face 3 of the main electrode portion 21.

  The first signal terminal electrode 11 described above is formed so as to cover all the portions exposed to the first end face 2 of the lead portion 22, and the lead portion 22 is physically attached to the first signal terminal electrode 11. And electrically connected. Further, the second signal terminal electrode 12 is formed so as to cover all the portion exposed to the second end face 3 of the lead portion 23, and the lead portion 23 is physically connected to the second signal terminal electrode 12. And electrically connected. As a result, the signal internal electrode 20 is connected to the first and second signal terminal electrodes 11 and 12.

  The grounding internal electrode 24 has a substantially rectangular main electrode portion 25 and lead portions 26 to 29. The main electrode portion 25 and the lead portions 26 to 29 are integrally formed. The lead portions 26 and 27 extend from the edge of the main electrode portion 25 on the first side surface 4 side so that the end is exposed on the first side surface 4. The lead portion 26 is located near the first end surface 2, and the lead portion 27 is located near the second end surface 3. The lead portions 28 and 29 extend from the edge of the main electrode portion 25 on the second side surface 5 side so that the end is exposed on the second side surface 5. The lead portion 28 is located near the first end surface 2, and the lead portion 29 is located near the second end surface 3.

  The first ground terminal electrode 13 described above is formed so as to cover all the exposed portions of the first side surface 4 of the lead portion 26, and the lead portion 26 is physically connected to the first ground terminal electrode 13. And electrically connected. The second ground terminal electrode 14 is formed so as to cover all of the exposed portion of the first side surface 4 of the lead portion 27, and the lead portion 27 is physically and electrically connected to the second ground terminal electrode 14. Connected. The third ground terminal electrode 15 is formed so as to cover all of the exposed portion of the second side surface 5 of the lead portion 28, and the lead portion 28 is physically and electrically connected to the third ground terminal electrode 15. Connected to. The fourth ground terminal electrode 16 is formed so as to cover all of the exposed portion of the second side surface 5 of the lead portion 29, and the lead portion 29 is physically and electrically connected to the fourth ground terminal electrode 16. Connected. As a result, the grounding internal electrode 24 is connected to the first to fourth grounding terminal electrodes 13 to 16.

  The main electrode portion 21 of the signal internal electrode 20 and the main electrode portion 25 of the ground internal electrode 24 are formed by laminating the insulating layer 9 with at least one insulating layer 9 as a part of the capacitor body 1 interposed therebetween. It includes regions that oppose each other in the direction. That is, the signal internal electrode 20 and the ground internal electrode 24 have regions that overlap each other when viewed from the opposing direction of the third and fourth side surfaces 6 and 7. Therefore, a portion of the insulator layer 9 that overlaps the main electrode portion 21 of the signal internal electrode 20 and the main electrode portion 25 of the ground internal electrode 24 is a region that substantially generates a capacitance component.

  The feedthrough capacitor C1 having the above-described configuration is mounted on a circuit board B1 as shown in FIG. The circuit board B1 is a circuit board having conductor wirings 30 to 37 formed on the surface, and semiconductor elements E1 to E3 are mounted in addition to the feedthrough capacitor C1. The semiconductor elements E1, E2 are connected by a conductor wiring 30, and the semiconductor elements E2, E3 are connected by a conductor wiring 31-33. The semiconductor element E1 and the first signal terminal electrode 11 of the feedthrough capacitor C1 are connected by a conductor wiring 34, and the semiconductor element E3 and the second signal terminal electrode 12 of the feedthrough capacitor C1 are connected by a conductor wiring 35. Yes. The first and third grounding terminal electrodes 13 and 15 of the feedthrough capacitor C1 are connected to the conductor wiring 36, and the second and fourth grounding terminal electrodes 14 and 16 of the feedthrough capacitor C1 are connected to the conductor wiring 37. Yes. The conductor wirings 30, 34, and 35 are power supply lines, and the conductor wirings 36 and 37 are ground lines. The conductor wirings 31 to 33 are signal transmission lines between the semiconductor elements E1 and E2, and are adjacent to each other and partially extend in the same direction.

  The feedthrough capacitor C1 is disposed on the conductor wirings 31 to 33 so that the opposing direction (longitudinal direction) of the first and second end faces 2 and 3 intersects the direction in which the conductor wirings 35 to 37 extend. When viewed from the opposing direction of the third and fourth side surfaces 6 and 7, the conductor wirings 31 to 33 pass between the first and second grounding terminal electrodes 13 and 14 of the feedthrough capacitor C1 and pass through the capacitor. It passes between the third and fourth ground terminal electrodes 15 and 16 of C1.

  As described above, according to this embodiment, the first and second signal terminal electrodes 11 and 12 are provided on the first and second end faces 2 and 3 of the capacitor body 1, and the capacitor body 1 First to fourth ground terminal electrodes 13 to 16 are provided on the first to fourth side surfaces 4 to 7. Since the first to fourth ground terminal electrodes 13 to 16 are provided near the first end face 2 or the second end face 3, the first to fourth ground terminal electrodes 13 to 16 and the first end face electrodes 13 to 16 are provided. And the position is close to the second signal terminal electrodes 11 and 12. Therefore, the ESL of the feedthrough capacitor C1 can be reduced. Moreover, the center part of the 1st-4th side surfaces 4-7 becomes an area | region in which the terminal electrode for grounding is not formed. Therefore, when the feedthrough capacitor C1 is mounted on the circuit board B1, the lower portion of the center of the feedthrough capacitor C1 can be used as a wiring space, and a reduction in wiring density that can occur when the feedthrough capacitor C1 is mounted can be suppressed.

Further, according to the present embodiment, the distance between the first ground terminal electrode 13 and the second ground terminal electrode 14 is between the first ground terminal electrode 13 and the first end face 2. And the distance between the second ground terminal electrode 14 and the second end face 3 is longer. The distance between the third ground terminal electrode 15 and the fourth ground terminal electrode 16 is the distance between the third ground terminal electrode 15 and the first end face 2 and the fourth ground. This is longer than the distance between the terminal electrode 16 for use and the second end face 3. In this case, since the first to fourth ground terminal electrodes 13 to 16 and the first and second signal terminal electrodes 11 and 12 can be brought closer to each other, the ESL of the feedthrough capacitor C1 can be further reduced. it can. Since the distance between the first ground terminal electrode 13 and the second ground terminal electrode 14 and the distance between the third ground terminal electrode 15 and the fourth ground terminal electrode 16 are widened, the feedthrough capacitor C1 A region where the ground terminal electrode is not formed in the central portion of the substrate can be made wider. Therefore, when this feedthrough capacitor C1 is mounted on the circuit board B1, a wider wiring space can be secured under the feedthrough capacitor C1, and more wires can be routed under the feedthrough capacitor C1.
(Second Embodiment)

  Next, the feedthrough capacitor according to the second embodiment will be described. The feedthrough capacitor according to the second embodiment is different from the feedthrough capacitor C1 according to the first embodiment in the shape and arrangement of the signal terminal electrode and the ground terminal electrode. FIG. 5 is an exploded perspective view of the capacitor body included in the feedthrough capacitor according to the second embodiment.

  Although the illustration of the feedthrough capacitor according to the second embodiment is omitted, like the feedthrough capacitor C1 according to the first embodiment, the capacitor body 1, the first and second signal terminal electrodes 11, 12, 1 to 4 grounding terminal electrodes 13 to 16. Similarly to the feedthrough capacitor C1 according to the first embodiment, the feedthrough capacitor according to the second embodiment can be mounted on the circuit board B1 shown in FIG.

  As shown in FIG. 5, the feedthrough capacitor according to the second embodiment includes a plurality (two in the present embodiment) of first signal internal electrodes 50 and a plurality (two in the present embodiment) of second electrodes. A plurality of (two in the present embodiment) first grounding internal electrodes 54, a plurality (two in the present embodiment) second grounding internal electrodes 57, and a plurality (two in the present embodiment). In the present embodiment, two third internal electrodes for grounding 64 and a plurality of (two in the present embodiment) fourth grounding internal electrodes 67 are provided. The first and second signal internal electrodes 50, 60 and the first to fourth grounding internal electrodes 54, 57, 64, 67 are arranged in the capacitor body 1.

  The first signal internal electrode 50 and the second signal internal electrode 60 are disposed at different positions (layers) in the facing direction of the third and fourth side surfaces 6 and 7. The first signal internal electrode 50 and the first and second grounding internal electrodes 54 and 57 are disposed at the same position (layer) in the opposing direction of the third and fourth side surfaces 6 and 7, respectively. Yes. The second signal internal electrode 60 and the third and fourth grounding internal electrodes 64 and 67 are arranged at the same position (layer) in the opposing direction of the third and fourth side surfaces 6 and 7, respectively. Yes.

  The first and second signal internal electrodes 50 and 60 and the first to fourth grounding internal electrodes 54, 57, 64, and 67 are conductive materials (usually used as internal electrodes of a laminated electric element). For example, Ni is a base metal). The first and second signal internal electrodes 50, 60 and the first to fourth grounding internal electrodes 54, 57, 64, 67 are configured as a sintered body of a conductive paste containing the conductive material. The

  The first signal internal electrode 50 has a crank shape and has a main electrode portion 51 and lead portions 52 and 53. The main electrode portion 51 and the lead portions 52 and 53 are integrally formed. The lead portion 52 extends from the edge of the main electrode portion 51 on the first end face 2 side so that the end is exposed to the first end face 2. The lead portion 53 extends from the edge of the main electrode portion 51 on the second end face 3 side so that the end is exposed to the second end face 3 of the main electrode portion 21.

  The second signal internal electrode 60 has a crank shape and has a main electrode portion 61 and lead portions 62 and 63. The main electrode portion 61 and the lead portions 62 and 63 are integrally formed. The lead portion 62 extends from the edge of the main electrode portion 61 on the first end face 2 side so that the end is exposed to the first end face 2. The lead portion 63 extends from the edge of the main electrode portion 61 on the second end face 3 side so that the end is exposed on the second end face 3 of the main electrode portion 61.

  The first signal terminal electrode 11 is formed so as to cover all portions exposed to the first end face 2 of the lead portions 52 and 62, and the lead portions 52 and 62 are connected to the first signal terminal electrode 11. Connected physically and electrically. The second signal terminal electrode 12 is formed so as to cover all portions exposed to the second end face 3 of the lead portions 53 and 63, and the lead portions 53 and 63 are formed as the second signal terminal electrode. 12 is physically and electrically connected. Thus, the first and second signal internal electrodes 50 and 60 are connected to the first and second signal terminal electrodes 11 and 12.

  The first grounding inner electrode 54 is located between the first signal inner electrode 50 and the first side face 4. The first grounding internal electrode 54 has a substantially rectangular main electrode portion 55 and a lead portion 56. The main electrode portion 55 and the lead portion 56 are integrally formed. The lead portion 56 extends from the edge of the main electrode portion 55 on the first side surface 4 side so that the end is exposed on the first side surface 4. The drawer portion 56 is located closer to the first end face 2.

  The second grounding internal electrode 57 is located between the first signal internal electrode 50 and the second side surface 5. The second grounding internal electrode 57 has a substantially rectangular main electrode portion 58 and a lead portion 59. The main electrode portion 58 and the lead portion 59 are integrally formed. The lead portion 59 extends from the edge of the main electrode portion 58 on the second side surface 5 side so that the end is exposed on the second side surface 5. The lead portion 59 is located closer to the second end surface 3.

  The third grounding internal electrode 64 is located between the second signal internal electrode 60 and the second side surface 5. The third grounding internal electrode 64 has a substantially rectangular main electrode portion 65 and a lead portion 66. The main electrode portion 65 and the lead portion 66 are integrally formed. The lead portion 66 extends from the edge of the main electrode portion 65 on the second side surface 5 side so that the end is exposed on the second side surface 5. The lead portion 66 is located closer to the first end face 2.

  The fourth grounding internal electrode 67 is located between the second signal internal electrode 60 and the first side surface 4. The second grounding internal electrode 67 has a substantially rectangular main electrode portion 68 and a lead portion 69. The main electrode portion 68 and the lead portion 69 are integrally formed. The lead portion 69 extends from the edge of the main electrode portion 68 on the first side surface 4 side so that the end is exposed on the first side surface 4. The lead-out part 69 is located closer to the second end face 3.

  The first ground terminal electrode 13 is formed so as to cover all of the exposed portion of the first side surface 4 of the lead portion 56, and the lead portion 56 is physically and electrically connected to the first ground terminal electrode 13. Connected. The second ground terminal electrode 14 is formed so as to cover all of the exposed portion of the first side surface 4 of the lead portion 69, and the lead portion 69 is physically and electrically connected to the second ground terminal electrode 14. Connected. The third ground terminal electrode 15 is formed so as to cover all of the exposed portion of the second side surface 5 of the lead portion 66, and the lead portion 66 is physically and electrically connected to the third ground terminal electrode 15. Connected. The fourth ground terminal electrode 16 is formed so as to cover all of the exposed portion of the lead portion 59 on the second side surface 5, and the lead portion 59 is physically and electrically connected to the fourth ground terminal electrode 16. Connected. Thus, the first grounding internal electrode 54 is connected to the first grounding terminal electrode 13, the second grounding internal electrode 57 is connected to the fourth grounding terminal electrode 16, and the third grounding internal electrode 64 is connected to the grounding internal electrode 64. The third grounding terminal electrode 15 and the fourth grounding internal electrode 67 are connected to the second grounding terminal electrode 14, respectively.

  The main electrode portion 51 of the first signal internal electrode 50 and the main electrode portions 65 and 68 of the third and fourth grounding internal electrodes 64 and 67 are at least one part of the capacitor body 1. The insulating layer 9 includes regions facing each other in the stacking direction of the insulating layer 9 with the insulating layer 9 interposed therebetween. That is, the first signal internal electrode 50 and the third and fourth grounding internal electrodes 64 and 67 have regions overlapping each other when viewed from the opposing direction of the third and fourth side surfaces 6 and 7. ing. Therefore, a portion of the insulator layer 9 that overlaps the main electrode portion 51 of the first signal internal electrode 50 and the main electrode portion 65 of the third ground internal electrode 64, and the first signal internal electrode The portions overlapping the 50 main electrode portions 51 and the main electrode portion 68 of the fourth grounding internal electrode 67 are regions that substantially generate capacitance components, respectively.

  The main electrode portion 61 of the second signal internal electrode 60 and the main electrode portions 55 and 58 of the first and second grounding internal electrodes 54 and 57 are at least one part of the capacitor body 1. The insulating layer 9 includes regions facing each other in the stacking direction of the insulating layer 9 with the insulating layer 9 interposed therebetween. That is, the second signal internal electrode 60 and the first and second grounding internal electrodes 54 and 57 have regions that overlap each other when viewed from the opposing direction of the third and fourth side surfaces 6 and 7. Yes. Therefore, a portion of the insulator layer 9 that overlaps the main electrode portion 61 of the second signal internal electrode 60 and the main electrode portion 55 of the first grounding internal electrode 54, and the second signal internal electrode The portions overlapping the main electrode portion 61 of 60 and the main electrode portion 58 of the second grounding internal electrode 57 are regions that substantially generate capacitance components, respectively.

  Thus, in the feedthrough capacitor according to the second embodiment, a portion of the insulator layer 9 that overlaps the main electrode portion 51 and the main electrode portion 65, a portion that overlaps the main electrode portion 51 and the main electrode portion 68, A portion that overlaps the electrode portion 61 and the main electrode portion 55 and a portion that overlaps the main electrode portion 61 and the main electrode portion 58 are regions that substantially generate a capacitance component. Therefore, the feedthrough capacitor according to the second embodiment has four types of regions that substantially generate a capacitance component.

  According to the feedthrough capacitor according to the second embodiment having the above configuration, the ESL of the feedthrough capacitor can be reduced for the same reason as that of the feedthrough capacitor C1 of the first embodiment. In addition, it is possible to suppress a decrease in wiring density that may occur when the feedthrough capacitor according to the second embodiment is mounted on the circuit board B1.

In addition, the feedthrough capacitor according to the second embodiment has four types of regions that substantially generate a capacitance component, and these four types of regions are in a parallel connection relationship. Therefore, if the sizes and shapes of these four types of regions are adjusted and the capacitance values are designed to be different, a feedthrough capacitor having a low impedance over a wide band can be obtained.
(Third embodiment)

  Next, a feedthrough capacitor according to a third embodiment will be described. The feedthrough capacitor according to the third embodiment is different from the feedthrough capacitor according to the first and second embodiments in the shape and arrangement of the signal terminal electrode and the ground terminal electrode. FIG. 6 is an exploded perspective view of the capacitor body included in the feedthrough capacitor according to the third embodiment.

  Although the illustration of the feedthrough capacitor according to the third embodiment is omitted, like the feedthrough capacitor C1 according to the first embodiment, the capacitor element body 1, the first and second signal terminal electrodes 11, 12, 1 to 4 grounding terminal electrodes 13 to 16. Similarly to the feedthrough capacitor C1 according to the first embodiment, the feedthrough capacitor according to the third embodiment can be mounted on the circuit board B1 shown in FIG.

  As shown in FIG. 6, the feedthrough capacitor according to the third embodiment includes a plurality (two in this embodiment) of first signal internal electrodes 70 and a plurality (two in this embodiment) of second electrodes. Signal internal electrodes 80, a plurality (two in this embodiment) of first grounding internal electrodes 74, and a plurality (two in this embodiment) of second grounding internal electrodes 84. ing. The first and second signal inner electrodes 70, 80 and the first and second grounding inner electrodes 74, 84 are disposed in the capacitor body 1.

  The first signal internal electrode 70 and the second signal internal electrode 80 are disposed at different positions (layers) in the opposing direction of the third and fourth side surfaces 6 and 7. The first signal internal electrode 70 and the first grounding internal electrode 74 are disposed at the same position (layer) in the opposing direction of the third and fourth side surfaces 6 and 7, respectively. The second signal internal electrode 80 and the second ground internal electrode 84 are disposed at the same position (layer) in the opposing direction of the third and fourth side surfaces 6 and 7, respectively.

  The first and second signal inner electrodes 70 and 80 and the first and second grounding inner electrodes 74 and 84 are conductive materials (for example, base metals) that are usually used as the inner electrodes of the laminated electric element. Some Ni). The first and second signal internal electrodes 70 and 80 and the first and second grounding internal electrodes 74 and 84 are configured as a sintered body of a conductive paste containing the conductive material.

  The first signal internal electrode 70 has a substantially rectangular shape and includes a main electrode portion 71 and lead portions 72 and 73. The main electrode portion 71 and the lead portions 72 and 73 are integrally formed. The lead portion 72 extends from the edge of the main electrode portion 71 on the first end face 2 side so that the end is exposed to the first end face 2. The lead-out portion 73 extends from the edge of the main electrode portion 71 on the second end face 3 side so that the end is exposed on the second end face 3 of the main electrode portion 71.

  The second signal internal electrode 80 has a substantially rectangular shape and includes a main electrode portion 81 and lead portions 82 and 83. The main electrode portion 81 and the lead portions 82 and 83 are integrally formed. The lead portion 82 extends from the edge of the main electrode portion 81 on the first end face 2 side so that the end is exposed to the first end face 2. The lead portion 83 extends from the edge on the second end face 3 side of the main electrode portion 81 so that the end is exposed on the second end face 3 of the main electrode portion 81.

  The first signal terminal electrode 11 is formed so as to cover all portions exposed to the first end face 2 of the lead portions 72 and 82, and the lead portions 72 and 82 are connected to the first signal terminal electrode 11. Connected physically and electrically. The second signal terminal electrode 12 is formed so as to cover all portions exposed to the second end face 3 of the lead portions 73 and 83, and the lead portions 73 and 83 are formed as the second signal terminal electrodes. 12 is physically and electrically connected. As a result, the first and second signal internal electrodes 70 and 80 are connected to the first and second signal terminal electrodes 11 and 12.

  The first grounding internal electrode 74 is located between the first signal internal electrode 70 and the first side face 4. The first grounding internal electrode 74 has a substantially rectangular main electrode portion 75 and lead portions 76 and 77. The main electrode portion 75 and the lead portions 76 and 77 are integrally formed. The lead portions 76 and 77 extend from the edge of the main electrode portion 75 on the first side surface 4 side so that the end is exposed on the first side surface 4. The lead portion 76 is located near the first end surface 2, and the lead portion 77 is located near the second end surface 3.

  The second grounding internal electrode 84 is located between the second signal internal electrode 80 and the second side surface 5. The second grounding internal electrode 84 has a substantially rectangular main electrode portion 85 and lead portions 86 and 87. The main electrode portion 85 and the lead portions 86 and 87 are integrally formed. The lead portions 86 and 87 extend from the edge of the main electrode portion 85 on the second side surface 5 side so that the end is exposed on the second side surface 5. The lead portion 86 is located near the first end surface 2, and the lead portion 87 is located near the second end surface 3.

  The first ground terminal electrode 13 is formed so as to cover all of the exposed portion of the first side surface 4 of the lead portion 76, and the lead portion 76 is physically and electrically connected to the first ground terminal electrode 13. Connected. The second ground terminal electrode 14 is formed so as to cover all of the exposed portion of the first side surface 4 of the lead portion 77, and the lead portion 77 is physically and electrically connected to the second ground terminal electrode 14. Connected. The third ground terminal electrode 15 is formed so as to cover all of the exposed portion of the second side surface 5 of the lead portion 86, and the lead portion 86 is physically and electrically connected to the third ground terminal electrode 15. Connected. The fourth ground terminal electrode 16 is formed so as to cover all of the exposed portion of the lead portion 87 on the second side surface 5, and the lead portion 87 is physically and electrically connected to the fourth ground terminal electrode 16. Connected. Accordingly, the first grounding internal electrode 74 is connected to the first and second grounding terminal electrodes 13 and 14, and the second grounding internal electrode 84 is connected to the third and fourth grounding terminal electrodes 15 and 16. , Respectively.

  The main electrode portion 71 of the first signal internal electrode 70 and the main electrode portion 85 of the second grounding internal electrode 84 sandwich at least one insulator layer 9 that is a part of the capacitor body 1. The insulating layer 9 includes regions facing each other in the stacking direction. That is, the first signal internal electrode 70 and the second grounding internal electrode 84 have regions that overlap each other when viewed from the opposing direction of the third and fourth side surfaces 6 and 7. Therefore, portions of the insulator layer 9 that overlap the main electrode portion 71 of the first signal internal electrode 70 and the main electrode portion 85 of the second grounding internal electrode 84 substantially each have a capacitance component. This is the area that is generated.

  The main electrode portion 81 of the second signal internal electrode 80 and the main electrode portion 75 of the first grounding internal electrode 74 sandwich at least one insulator layer 9 that is a part of the capacitor body 1. The insulating layer 9 includes regions facing each other in the stacking direction. That is, the second signal internal electrode 80 and the first grounding internal electrode 74 have regions that overlap each other when viewed from the opposing direction of the third and fourth side surfaces 6 and 7. Therefore, portions of the insulator layer 9 that overlap the main electrode portion 81 of the second signal internal electrode 80 and the main electrode portion 75 of the first grounding internal electrode 74 substantially each have a capacitance component. This is the area that is generated.

  Thus, in the feedthrough capacitor according to the third embodiment, a portion of the insulator layer 9 that overlaps the main electrode portion 71 and the main electrode portion 85 and a portion that overlaps the main electrode portion 81 and the main electrode portion 75. However, this is a region where a capacitance component is substantially generated. Therefore, the feedthrough capacitor according to the third embodiment has two types of regions that substantially generate a capacitance component.

  Further, according to the feedthrough capacitor according to the third embodiment, the ESL of the feedthrough capacitor can be reduced for the same reason as the feedthrough capacitor C1 according to the first embodiment. In addition, it is possible to suppress a decrease in wiring density that may occur when mounted on the feedthrough capacitor according to the second embodiment.

  In addition, the feedthrough capacitor according to the third embodiment has two types of regions that substantially generate capacitance components, and these two types of regions are in a parallel connection relationship. Therefore, if the sizes and shapes of these two types of regions are adjusted and designed so that the capacitance values are different, a feedthrough capacitor having a low impedance over a wide band can be obtained.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  For example, the shape and quantity of various signal internal electrodes and grounding internal electrodes, the positions where the lead portions are formed, and the like are not limited to those of the above embodiment. In the above-described embodiment, the four ground terminal electrodes 13 to 16 are provided. However, the number of ground terminal electrodes is not limited thereto, and at least one of the four ground terminal electrodes 13 to 16 is provided. It may be provided. For example, only the first and second ground terminal electrodes 13 and 14 may be provided, or only the first and fourth ground terminal electrodes 13 and 16 may be provided.

1 is a perspective view of a feedthrough capacitor according to a first embodiment. It is a disassembled perspective view of the capacitor body with which the feedthrough capacitor concerning a 1st embodiment is provided. 1 is a cross-sectional view of a feedthrough capacitor according to a first embodiment. 1 is a top view of a feedthrough capacitor according to a first embodiment and a circuit board on which the feedthrough capacitor is mounted. FIG. It is a disassembled perspective view of the capacitor body with which the feedthrough capacitor concerning a 2nd embodiment is provided. It is a disassembled perspective view of the capacitor body with which the feedthrough capacitor concerning a 3rd embodiment is provided.

Explanation of symbols

  C1: Feedthrough capacitor, B1 ... Circuit board, 33-40 ... Conductor wiring, 13 to 16 ... Terminal electrode for grounding, 1 ... Capacitor body, 2 ... First end face, 3 ... Second end face, 4 ... First Side surface, 5 ... second side surface, 6 ... third side surface, 7 ... fourth side surface, 9 ... insulator layer, 11, 12 ... signal terminal electrode, 13-16 ... ground terminal electrode, 20, 50, 60, 70, 80... Signal internal electrode, 24, 54, 57, 64, 67, 74, 84 .. Ground internal electrode.

Claims (2)

A substantially rectangular parallelepiped capacitor element formed by laminating a plurality of insulator layers;
A signal internal electrode and a ground internal electrode disposed in the capacitor body and facing each other;
A pair of signal terminal electrodes provided on the first and second end faces in the longitudinal direction of the capacitor element body and connected to the signal internal electrode;
A grounding terminal electrode provided on at least one of the first to fourth side surfaces extending in the longitudinal direction of the capacitor element body and connected to the grounding internal electrode;
The grounding terminal electrode is provided near the first end surface and the second end surface on the first side surface and the second side surface facing the first side surface, respectively.
When viewed from the opposing direction of the first and second side surfaces, the distance between the ground terminal electrodes provided on the first and second side surfaces is provided closer to the first end surface. The distance between the grounding terminal electrode and the first end face is longer than the distance between the grounding terminal electrode provided near the second end face and the second end face, and The distance between the ground terminal electrode provided near the first end surface on the first side surface and the ground terminal electrode provided near the second end surface on the second side surface is: The distance between the ground terminal electrode provided near the first end surface on the first side surface and the first end surface, and the second side surface near the second end surface. More than the distance between the grounding terminal electrode and the second end face Ku,
A plurality of the grounding internal electrodes and the grounding terminal electrodes, wherein at least two of the grounding internal electrodes are connected to the grounding terminal electrodes,
A plurality of signal internal electrodes connected to the pair of signal terminal electrodes as the signal internal electrodes , and the plurality of signal internal electrodes are respectively different from the ground internal electrodes among the plurality of ground internal electrodes. Opposing and at least one of the plurality of signal internal electrodes and at least one of the plurality of ground internal electrodes are formed in the same layer in the stacking direction,
Any terminal electrode is provided in a region between the ground terminal electrode provided near the first end face and the ground terminal electrode provided near the second end face in the capacitor body. Feedthrough capacitor, characterized in that it is not. A feedthrough capacitor according to claim 1;
A circuit board having a conductor wiring that is not connected to the signal terminal electrode and the ground terminal electrode formed on the surface;
The grounding capacitor is provided near the first end surface of the feedthrough capacitor when viewed from the stacking direction so that a longitudinal direction of the feedthrough capacitor and a direction in which the conductor wiring extends are crossed. A feedthrough capacitor mounting structure, wherein the region between the terminal electrode for ground and the grounding terminal electrode provided near the second end face is disposed on the conductor wiring.

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