JPH0766077A - Laminated electronic component - Google Patents

Abstract

PURPOSE:To provide laminated electronic components of a structure able to prevent crosstalk between inner electrodes for signaling and deterioration in characteristics in a laminated through-type ceramic capacitor or the like having a plurality of inner electrodes for signaling of channels. CONSTITUTION:Dielectric 7 having a lower dielectric constant than dielectric 2 between an inner electrode 3 for ground and the inner electrodes 4, 5 for signaling is provided between the respective inner electrodes 4, 5 for signaling. Further, the inner electrode for ground is admitted inside the dielectric 7 having a low dielectric constant.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component such as a multilayer through-type ceramic capacitor which is used as a noise filter or the like and has a plurality of channels of signal electrodes built therein, and more particularly to a crosstalk preventing structure thereof.

[0002]

2. Description of the Related Art A multilayer feedthrough type ceramic capacitor has a signal internal electrode and a ground internal electrode stacked and fired.
A signal external electrode and a ground external electrode are formed on the side surface. Since such a multilayer feedthrough capacitor has a high resonance frequency, it can meet the recent demand for higher frequencies.
As such a multilayer feedthrough capacitor, a capacitor having signal internal electrodes for a plurality of channels formed therein is proposed in, for example, Japanese Patent Publication No. 4-37567.

[0003]

However, in the multilayer feedthrough capacitor having such a conventional structure, if the distance between the signal internal electrodes of different channels is narrowed in order to reduce the size of the capacitor, the signal internal electrodes will be separated from each other. However, there is a problem that crosstalk occurs and the characteristics are deteriorated.

In view of the above situation, the present invention provides a multilayer electronic component such as a multilayer feedthrough ceramic capacitor having a plurality of channels of signal internal electrodes, a crosstalk between the signal internal electrodes, and characteristics. It is an object of the present invention to provide a laminated electronic component having a structure capable of preventing deterioration of the device and achieving miniaturization.

[0005]

In order to achieve the above-mentioned object, the present invention has a dielectric constant lower than that of a dielectric between a ground internal electrode and a signal internal electrode between each signal internal electrode. A feature is that a dielectric is provided. Further, the present invention is
The internal electrode for ground is passed through the low dielectric constant dielectric body.

[0006]

In the present invention, the dielectric material having a low dielectric constant between the signal internal electrodes weakens the capacitive coupling between the signal internal electrodes and prevents crosstalk. In the case where a grounding internal electrode is passed through a dielectric having a low dielectric constant, the internal electrode also has a shielding effect and improves the crosstalk preventing effect.

[0007]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1A is a perspective view showing a multilayer feedthrough capacitor which is an embodiment of a multilayer electronic component according to the present invention, and FIG. 1B is an equivalent circuit diagram thereof. 2A is a cross-sectional view taken along line XX of FIG. 1A, and FIG. 2B is Y of FIG.
It is a -Y sectional view. As shown in these figures, the multilayer feedthrough capacitor 1 according to the present embodiment is provided with a dielectric 2 made of ceramic, and two upper and lower ground layers made of a conductor such as silver or silver-palladium penetrating the dielectric 2. Internal electrodes 3 and 3, and first and second signal internal electrodes 4 made of the same material as the ground internal electrode 3 sandwiched between the ground internal electrodes 3 and 3 via a dielectric 2. 5 and. In this embodiment, a dielectric 7 having a lower dielectric constant than the dielectric 2 is provided between the first signal internal electrode 4 and the second signal internal electrode 5, and the ground internal electrodes 3 and 3 are laminated. It has formed over the course of. The external electrodes A to F are formed on the outer surfaces of the dielectrics 1 and 7 by connecting to the exposed ends of the respective internal electrodes. It should be noted that, as the main dielectric 2, for example, titanium oxide-based, calcium titanate-based, strontium titanate-based, barium titanate-based, and others having a relative dielectric constant of 10 or more are used, and the low dielectric constant dielectric 7 is used. Can be made of alumina or magnesium silicate having a relative dielectric constant of 10 or less.

Next, one manufacturing process of the multilayer feedthrough capacitor of this embodiment will be described with reference to FIG. First,
Dielectric sheet 2 such as ceramic sheet or printed by printing
a is formed (a), and the grounding internal electrode 3 made of a conductor paste is printed thereon (b). In this case, the grounding internal electrode 3 is formed over the entire length of the dielectric 2a. Next, the steps (c) and (d) in which the main dielectric 2b and the dielectric 7a having a lower dielectric constant are arranged side by side or simultaneously by sheet or printing are carried out. Repeat until the thickness is equivalent to the distance from 5.

Next, the first and second signal internal electrodes 4, 5 are laminated on these dielectrics 2b (e). afterwards,
Similar to the steps (c) and (d), the step (f) of stacking the low dielectric constant dielectric 7b and the main dielectric 2c,
(G) is repeated as many times as the number of steps of (c) and (d). Next, the internal electrodes 3 for ground are stacked on the dielectrics 2c and 7b.
Is formed (h), and the dielectric 2d for covering the upper surface is laminated thereon (i).

The laminate thus obtained is pressure bonded,
In case of taking a large number of pieces, cut into pieces and fire.
Further, as shown in FIG. 1A, the external electrodes A to G are formed by baking, plating, or the like. That is, the signal external electrodes A and B are formed by connecting to the exposed ends of the first signal internal electrode 4, respectively, and are connected to the exposed ends of the second signal internal electrode 5 respectively. The electrodes C and D are formed and are connected to the exposed ends 3a and 3a of the internal electrode 3 for ground to form electrodes E and F, respectively.

In the multilayer feedthrough capacitor thus manufactured, the first signal inner electrode 4 and the ground inner electrodes 3 and 3 which are vertically opposed to the first signal inner electrode 4 are connected to each other as shown in FIG.
The feedthrough capacitor C1 shown in the equivalent circuit diagram of
A feedthrough capacitor C2 is formed between the second signal internal electrode 5 and the ground internal electrodes 3 and 3 which are vertically opposed to the second signal internal electrode 5. Further, a dielectric 7 having a low dielectric constant is interposed between the first signal inner electrode 4 and the second signal inner electrode 5.

As described above, the adjacent signal internal electrodes 4,
By interposing the dielectric 7 having a low dielectric constant between 5 and 5, the coupling due to the capacitance between these signal internal electrodes 4 and 5 is substantially eliminated, and crosstalk between them is prevented.
In addition, it is possible to prevent deterioration of characteristics due to the action between the internal electrodes 4 and 5.

FIG. 4A is a perspective view showing a multilayer feedthrough capacitor which is another embodiment of the multilayer electronic component according to the present invention,
(B) is an equivalent circuit diagram thereof. 5A is a WW cross-sectional view of FIG. 4A, and FIG. 5B is a ZZ cross-sectional view of FIG. 5A. In this embodiment, the horizontal internal electrodes 6 are provided between the signal internal electrodes 4 and 5 through the low dielectric constant dielectric 7. Both ends of the ground internal electrode 6 are connected to the ground internal electrode 3 via the external electrodes G and H.

In this embodiment, in the process chart of FIG.
As shown in (e), it is manufactured by simultaneously forming the grounding internal electrode 6 in the process of forming the signal internal electrodes 4 and 5 in the process of FIG. Further, the ground internal electrode 3 is formed with a protrusion 3b for connecting to the external electrodes G and H.

In the present embodiment, as shown in FIG. 4B, capacitors C3 and C4 are formed between the signal inner electrodes 4 and 5 and the ground inner electrode 6, which further increases the capacitance. The crosstalk prevention effect between the signal internal electrodes 4 and 5 is enhanced.

In the above embodiment, the case where the number of signal internal electrodes is two (two channels) is shown, but when the number of channels is increased by forming three or more signal internal electrodes in the same layer. In this case, the ground inner electrode may be formed between the respective signal inner electrodes. Further, by repeating the steps (b) to (g) in the manufacturing process of FIG. 3 or the manufacturing process of FIG. 6, a multilayer feedthrough capacitor having a larger number of channels can be manufactured.

The present invention can be applied to a combination of inductors and the like in a laminated structure, and a board on which an electronic component such as an IC is mounted. Further, the ground electrode 3 does not necessarily have to be embedded in the dielectric 2, but may have a structure in which the ground electrode 3 is protected by a resin layer, for example.

[0018]

According to the first aspect of the present invention, even if the distance between the signal internal electrodes becomes narrower due to the miniaturization, the signal dielectric is interposed by the low dielectric constant dielectrics interposed between the adjacent signal internal electrodes. It is possible to prevent crosstalk between the internal electrodes and prevent deterioration of characteristics. In addition, it is possible to contribute to miniaturization of the laminated electronic component. According to the second aspect, in addition to the dielectric having a low dielectric constant, the ground internal electrode is interposed between the signal internal electrodes, so that the crosstalk prevention effect is further enhanced.

[Brief description of drawings]

FIG. 1A is a perspective view of the embodiment, and FIG. 1B is an equivalent circuit diagram thereof.

2A is a sectional view taken along line XX of FIG. 1A, and FIG. 2B is a sectional view taken along line YY of FIG. 2A.

FIG. 3 is a diagram showing a manufacturing process of the present embodiment.

4A is a perspective view of the embodiment, and FIG. 4B is an equivalent circuit diagram thereof.

5A is a WW sectional view of FIG. 4A, and FIG. 5B is a ZZ sectional view of FIG. 5A.

FIG. 6 is a diagram showing a manufacturing process of the embodiment shown in FIGS. 4 and 5;

[Explanation of symbols]

 1 Through Type Capacitor 2 Dielectric 3 Internal Electrode for Ground 4, 5 Internal Electrode for Signal 6 Internal Electrode for Ground 7 Dielectric with Lower Permittivity than Dielectric 2 A to H External Electrodes C1 to C4 Capacitors

Claims (2)

[Claims] 1. A laminated electronic component having a plurality of channels of signal internal electrodes, a dielectric, and a ground electrode facing the signal internal electrodes with a dielectric interposed between the signal internal electrodes. A laminated electronic component characterized in that a dielectric having a dielectric constant lower than that of the dielectric between the ground internal electrode and the signal internal electrode is provided. 2. The laminated electronic component according to claim 1, wherein an internal electrode for ground is passed through the dielectric having a low dielectric constant.