JPH01181549A - Mounting structure of integrated circuit - Google Patents
Mounting structure of integrated circuitInfo
- Publication number
- JPH01181549A JPH01181549A JP412288A JP412288A JPH01181549A JP H01181549 A JPH01181549 A JP H01181549A JP 412288 A JP412288 A JP 412288A JP 412288 A JP412288 A JP 412288A JP H01181549 A JPH01181549 A JP H01181549A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- ceramic package
- cap
- recess
- dent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 32
- 229910000679 solder Inorganic materials 0.000 claims abstract description 11
- 239000000463 material Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 229920002379 silicone rubber Polymers 0.000 abstract description 3
- 230000002542 deteriorative effect Effects 0.000 abstract 1
- 229920006332 epoxy adhesive Polymers 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004945 silicone rubber Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
Abstract
Description
【発明の詳細な説明】
、 〔産業上の利用分野〕
本発明は集積回路の実装構造に関し、特にテープキャリ
ア方式の集積回路の実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an integrated circuit mounting structure, and particularly to a tape carrier type integrated circuit mounting structure.
従来、この種の集積回路の実装構造は第２図に示すよう
に、リードクレームから切シ離した集積回路５２と、集
積回路５２ｔ−シリコンゴム等の緩衝材５６を介して中
央部に実装しうるセラミックパッケージ５１と、セラミ
ックパッケージ５１に搭載され九集槓回路５２ｉ収容し
開口部をセラミックパッケージ５１で施蓋するキャップ
５４とからなり、集積回路５２の端子５２ａはセラきツ
クパッケージ５１の外部接続用端子５１ａに熱圧着等の
工法で接続され、 またキャップ５４とセラミックパッ
ケージ５１の開口縁との間にエポキシ系接着剤又は高温
はんだ５５ｇ流し込み、キャップ５４及びセラミックパ
ッケージ５１によシ集積回路５２を気密封止してい九〇
〔発明が解決しようとする問題点〕
上述した従来のエポキシ系接着剤による封止では接着剤
の密着力の信頼性及び気密性に問題がめシ、ま全高温は
んだを使用する方法ではリフロー時の高温はんだが集積
回路へ流れ込み集積回路５２の隣接する端子同士をショ
ートさせてしまうとい島
う譲れがあっ九。Conventionally, the mounting structure of this type of integrated circuit is as shown in FIG. 2, in which the integrated circuit 52 is separated from the lead claim, and the integrated circuit 52t is mounted in the center via a cushioning material 56 such as silicone rubber. It consists of a transparent ceramic package 51 and a cap 54 mounted on the ceramic package 51 to accommodate a nine-piece circuit 52i and whose opening is covered with the ceramic package 51. 55 g of epoxy adhesive or high-temperature solder is poured between the cap 54 and the opening edge of the ceramic package 51, and the integrated circuit 52 is connected to the terminal 51a by thermocompression bonding or the like. [Problems to be solved by the invention] The above-mentioned conventional sealing using an epoxy adhesive has problems with the reliability of the adhesive's adhesion and airtightness. The method used has the disadvantage that the high temperature solder during reflow flows into the integrated circuit and shorts out adjacent terminals of the integrated circuit 52.
本発明の目的は高温はんだを用いて品質を低下させるこ
となく集積回路の気密封止を可能ならしめる集積回路の
実装構造を提供することにある。SUMMARY OF THE INVENTION An object of the present invention is to provide an integrated circuit mounting structure that enables hermetically sealing an integrated circuit using high-temperature solder without degrading quality.
本発明による集積回路の実装構造は、リードクレームか
ら切シ離し九テープキャリア万式の集積回路と、前記集
積回路を緩衝材を介して中央部に搭載し周辺部にくぼみ
を持ち裏面に外部接続用端子を設けたセラミックパッケ
ージと、前記セラミックパッケージに搭載した集積回路
を覆い開口縁を前記セラミックパッケージの周辺部のく
ぼみに嵌合させるキャップとを有し、前記くぼみに高温
はんだを冗填して前記キャップの開口縁をセラミックパ
ッケージに接合し前記集積回路を気密封止するようにし
て構成される。The integrated circuit mounting structure according to the present invention includes an integrated circuit with nine tape carriers that are separated from the lead claim, and the integrated circuit is mounted in the center via a cushioning material, has a recess in the periphery, and is connected to the outside on the back side. a ceramic package provided with terminals for use in the ceramic package, and a cap that covers an integrated circuit mounted on the ceramic package and whose opening edge fits into a recess at the periphery of the ceramic package, the recess being redundantly filled with high-temperature solder. The opening edge of the cap is bonded to a ceramic package to hermetically seal the integrated circuit.
以下、本発明について図面を参照しながら説明する。 Hereinafter, the present invention will be explained with reference to the drawings.
、Ｊ１図は本発明の一′＃、施例を示す断面図である。, J1 are sectional views showing the first embodiment of the present invention.
同図において集積回路の実装構造は、リードフレームか
ら切り離したテープキャリア方式の集積回路２と、裏面
に外部接続用端子１ａを持ち周辺部にくぼみ３を設けた
セラミックパッケージ１と、果槓回＊２ｔ−覆うキャッ
プ４とを有する。In the figure, the integrated circuit mounting structure includes a tape carrier-type integrated circuit 2 separated from a lead frame, a ceramic package 1 having an external connection terminal 1a on the back side and a recess 3 around the periphery, 2t-covering cap 4.
集積回路２はシリコンゴム等の緩衝材６を介しセラミッ
クパッケージ１の中央部に搭載し、集積回路２の端子２
ａはセラミックパッケージ１の接続用端子１ａに熱圧着
等の工法で接続する。The integrated circuit 2 is mounted in the center of the ceramic package 1 via a cushioning material 6 such as silicone rubber, and the terminals 2 of the integrated circuit 2 are
A is connected to the connection terminal 1a of the ceramic package 1 by a method such as thermocompression bonding.
キャップ４は集積回路２ｔ−覆い、その開口縁４ａがセ
ラミックパッケージ・１のくぼみ３に嵌合し、キャップ
４の開口部はセラミックパッケージ１を施蓋する。まｔ
１キャップ４は集積回路２の裏面を良熱伝導性の接着剤
で接着する。The cap 4 covers the integrated circuit 2t, its opening edge 4a fits into the recess 3 of the ceramic package 1, and the opening of the cap 4 covers the ceramic package 1. Yes
1. The cap 4 is bonded to the back surface of the integrated circuit 2 with an adhesive having good thermal conductivity.
セラミックパッケージ１のくぼみ３にはシート状の高温
はんだ５ｆ：供給し、次にボンディング用加熱ヒータ（
−示しないンによって加熱リフローすることによシキャ
ップ４ｆｔセラＺ ツタパッケージｌに接曾し、集積回
路２を気密封止する。A sheet of high-temperature solder 5f is supplied to the recess 3 of the ceramic package 1, and then a bonding heater (
- The integrated circuit 2 is hermetically sealed by attaching the cap to the 4ft Cera Z ivy package l by heating and reflowing using a cap not shown.
以上説明し九ように本発明は、セラミックパッケージの
周辺部にくぼみを設け、そのくぼみに嵌合するようにキ
ャップを実装し、このくぼみ全高温はんだで満してキャ
ップとセラミックパッケージとを接会し、キャップの開
口部をセラミックパッケージで施蓋するようにし九ので
、高温はんだがセラミックパッケージのくぼみに収容さ
れて中ヤップ内に流れ込むことがなく、集積回路ｔ”保
護して品質を一定に維持できる。しかも、す７０−ボン
ディング法による加熱方式を採用することによシ、工数
及びリードタイムの短縮が図られ自動化の道も開かれる
という効果がある。As explained above, the present invention provides a recess in the periphery of a ceramic package, mounts a cap so as to fit into the recess, and fills the recess with high-temperature solder to join the cap and the ceramic package. Since the opening of the cap is covered with a ceramic package, the high-temperature solder is accommodated in the recess of the ceramic package and does not flow into the inside, protecting the integrated circuit and maintaining constant quality. Moreover, by adopting the heating method using the 70-bonding method, the number of man-hours and lead time can be shortened, and the possibility of automation is also opened.
第１図は本発明の一実施例の断面図、第２図は従来例の
断面図である。
１・・・・・・セラミックパッケージ、２・・・・・・
集積回路。
３・・・・・・くぼみ、４・・・・・・キャップ、５・
・・・・・高温はんだ、６・・・・・・緩衝材。
代理人 弁理士 内 原 音FIG. 1 is a sectional view of one embodiment of the present invention, and FIG. 2 is a sectional view of a conventional example. 1...Ceramic package, 2...
integrated circuit. 3...Indentation, 4...Cap, 5.
...High temperature solder, 6...Buffer material. Agent Patent Attorney Oto Uchihara
Claims (1)
集積回路と、前記集積回路を緩衝材を介して中央部に搭
載し周辺部にくぼみを持ち裏面に外部接続用端子を設け
たセラミックパッケージと、前記セラミックパッケージ
に搭載した集積回路を覆い開口縁を前記セラミックパッ
ケージの周辺部のくぼみに嵌合させるキャップとを有し
、前記くぼみに高温はんだを充填して前記キャップの開
口縁をセラミックパッケージに接合し前記集積回路を気
密封止することを特徴とする集積回路の実装構造。A tape carrier-type integrated circuit separated from a lead frame, a ceramic package in which the integrated circuit is mounted in the center via a buffer material, has a recess in the periphery and has external connection terminals on the back side, and the ceramic package a cap that covers the mounted integrated circuit and whose opening edge fits into a recess at the periphery of the ceramic package; the recess is filled with high-temperature solder to join the opening edge of the cap to the ceramic package; An integrated circuit mounting structure that is hermetically sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP412288A JPH01181549A (en) | 1988-01-11 | 1988-01-11 | Mounting structure of integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP412288A JPH01181549A (en) | 1988-01-11 | 1988-01-11 | Mounting structure of integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01181549A true JPH01181549A (en) | 1989-07-19 |
Family
ID=11575983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP412288A Pending JPH01181549A (en) | 1988-01-11 | 1988-01-11 | Mounting structure of integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01181549A (en) |
-
1988
- 1988-01-11 JP JP412288A patent/JPH01181549A/en active Pending
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