JPH01179452U - - Google Patents
Info
- Publication number
- JPH01179452U JPH01179452U JP1988076525U JP7652588U JPH01179452U JP H01179452 U JPH01179452 U JP H01179452U JP 1988076525 U JP1988076525 U JP 1988076525U JP 7652588 U JP7652588 U JP 7652588U JP H01179452 U JPH01179452 U JP H01179452U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- wiring material
- semiconductor chip
- wiring
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/50—
-
- H10W72/07551—
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- H10W72/536—
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- H10W72/5363—
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- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076525U JPH01179452U (enExample) | 1988-06-09 | 1988-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988076525U JPH01179452U (enExample) | 1988-06-09 | 1988-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01179452U true JPH01179452U (enExample) | 1989-12-22 |
Family
ID=31301546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988076525U Pending JPH01179452U (enExample) | 1988-06-09 | 1988-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01179452U (enExample) |
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1988
- 1988-06-09 JP JP1988076525U patent/JPH01179452U/ja active Pending