JPH0385639U - - Google Patents
Info
- Publication number
- JPH0385639U JPH0385639U JP1989148029U JP14802989U JPH0385639U JP H0385639 U JPH0385639 U JP H0385639U JP 1989148029 U JP1989148029 U JP 1989148029U JP 14802989 U JP14802989 U JP 14802989U JP H0385639 U JPH0385639 U JP H0385639U
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- chip
- package
- semiconductor device
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W72/50—
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- H10W72/5445—
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- H10W72/5449—
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- H10W72/5475—
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- H10W72/926—
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- H10W72/932—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989148029U JPH0385639U (enExample) | 1989-12-21 | 1989-12-21 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989148029U JPH0385639U (enExample) | 1989-12-21 | 1989-12-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0385639U true JPH0385639U (enExample) | 1991-08-29 |
Family
ID=31694497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989148029U Pending JPH0385639U (enExample) | 1989-12-21 | 1989-12-21 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0385639U (enExample) |
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1989
- 1989-12-21 JP JP1989148029U patent/JPH0385639U/ja active Pending