JPH01173620A - シリコン材料の成形方法 - Google Patents

シリコン材料の成形方法

Info

Publication number
JPH01173620A
JPH01173620A JP28481588A JP28481588A JPH01173620A JP H01173620 A JPH01173620 A JP H01173620A JP 28481588 A JP28481588 A JP 28481588A JP 28481588 A JP28481588 A JP 28481588A JP H01173620 A JPH01173620 A JP H01173620A
Authority
JP
Japan
Prior art keywords
tool
wafer
molding
silicon
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28481588A
Other languages
English (en)
Japanese (ja)
Inventor
Roderick Merritt Giles
ジレス、ロドリック、メリット
Gerald Whiting
ジェラルド、ホワイティング
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Mobility Ltd
Original Assignee
Westinghouse Brake and Signal Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Brake and Signal Co Ltd filed Critical Westinghouse Brake and Signal Co Ltd
Publication of JPH01173620A publication Critical patent/JPH01173620A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/02—Simple or compound lenses with non-spherical faces
    • G02B3/08—Simple or compound lenses with non-spherical faces with discontinuous faces, e.g. Fresnel lens
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP28481588A 1987-12-10 1988-11-10 シリコン材料の成形方法 Pending JPH01173620A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8728879 1987-12-10
GB878728879A GB8728879D0 (en) 1987-12-10 1987-12-10 Shaping silicon semiconductor wafers

Publications (1)

Publication Number Publication Date
JPH01173620A true JPH01173620A (ja) 1989-07-10

Family

ID=10628300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28481588A Pending JPH01173620A (ja) 1987-12-10 1988-11-10 シリコン材料の成形方法

Country Status (4)

Country Link
EP (1) EP0320090A3 (forum.php)
JP (1) JPH01173620A (forum.php)
GB (2) GB8728879D0 (forum.php)
IN (1) IN175302B (forum.php)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7674689B2 (en) * 2007-09-20 2010-03-09 Infineon Technologies Ag Method of making an integrated circuit including singulating a semiconductor wafer
JP6696263B2 (ja) * 2015-09-29 2020-05-20 三星ダイヤモンド工業株式会社 脆性材料基板のスクライブ方法及びスクライブヘッドユニット

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4517769A (en) * 1981-05-20 1985-05-21 Tokyo Shibaura Denki Kabushiki Kaisha Method and apparatus for forming oblique groove in semiconductor device

Also Published As

Publication number Publication date
GB8821124D0 (en) 1988-10-12
GB8728879D0 (en) 1988-01-27
IN175302B (forum.php) 1995-06-10
EP0320090A2 (en) 1989-06-14
EP0320090A3 (en) 1990-01-31
GB2213637A (en) 1989-08-16
GB2213637B (en) 1990-12-19

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