JPH01172590A - 全面メッキ装置 - Google Patents
全面メッキ装置Info
- Publication number
- JPH01172590A JPH01172590A JP33043187A JP33043187A JPH01172590A JP H01172590 A JPH01172590 A JP H01172590A JP 33043187 A JP33043187 A JP 33043187A JP 33043187 A JP33043187 A JP 33043187A JP H01172590 A JPH01172590 A JP H01172590A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating
- anode
- holding jig
- shielding plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007747 plating Methods 0.000 title claims abstract description 97
- 238000000034 method Methods 0.000 title claims description 14
- 239000000463 material Substances 0.000 abstract description 13
- 238000012545 processing Methods 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000009775 high-speed stirring Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33043187A JPH01172590A (ja) | 1987-12-25 | 1987-12-25 | 全面メッキ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33043187A JPH01172590A (ja) | 1987-12-25 | 1987-12-25 | 全面メッキ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01172590A true JPH01172590A (ja) | 1989-07-07 |
| JPH0314911B2 JPH0314911B2 (enrdf_load_stackoverflow) | 1991-02-27 |
Family
ID=18232539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33043187A Granted JPH01172590A (ja) | 1987-12-25 | 1987-12-25 | 全面メッキ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01172590A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06146100A (ja) * | 1992-11-11 | 1994-05-27 | Sumitomo Metal Mining Co Ltd | 部分メッキ剥離装置 |
-
1987
- 1987-12-25 JP JP33043187A patent/JPH01172590A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06146100A (ja) * | 1992-11-11 | 1994-05-27 | Sumitomo Metal Mining Co Ltd | 部分メッキ剥離装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0314911B2 (enrdf_load_stackoverflow) | 1991-02-27 |
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