JPH01169937A - Appearance inspection equipment for semiconductor pellet - Google Patents

Abstract

PURPOSE:To prevent the exfoliation of a semiconductor pellet, and enable eliminating stably unacceptable pellets in a short time, by making a pushing-up rod ascend in the state where a vacuum suction stand is made to ascend while an adhesive sheet is sucked on the suction stand as it is. CONSTITUTION:A semiconductor pellet 2 on a suction surface 15 is subjected to appearance inspection, and a pellet collecting pipe 1 is positioned on a suction stand 4. By driving a cylinder 12, the suction stand 4 is made to ascend by a specified distance. A cam 11 is rotated at the same time as a driving signal of the cylinder 12, and a pushing-up rod 6 is made to ascend so as to protrude from the suction surface 15. The pellet 2 is sucked by vacuum, and gathered in the pellet collecting pipe 1. The pushing-up rod 6 and the suction stand 4 are made to descend and return to the initial positions. An adhesive sheet 3 is moved, and the next semiconductor pellet 2 is inspected. Thereby the exfoliation of pellet 2 is prevented, and the stable elimination of unacceptable pellets in a short time is enabled.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an appearance inspection device for semiconductor pellets, and particularly relates to a device for inspecting the appearance of semiconductor pellets.
The present invention relates to a semiconductor pellet appearance inspection apparatus having a defective pellet removing device for removing and collecting defective pellets from an adhesive sheet to which defective pellets are stuck among semiconductor pellets separated into individual semiconductor pellets.

[Conventional technology]

Conventionally, this type of defective pellet removal device removes the adhesive by pushing up the pellet 2 stuck to the adhesive sheet 3 from below the adhesive sheet 3 with a push-up rod 6, as shown in FIGS. 3 and 4. The trap was such that the pellets 2 were peeled off from the sheet 3, and the peeled pellets 2 were vacuum-suctioned with the pellet collection tube 1 and discharged.

Next, how to use the conventional example will be explained.

FIGS. 5(a) to 5(d) are cross-sectional views showing the positional relationship between the uplifting rod 8 and the adhesive sheet 3 in order of operation.

As shown in FIG. 5(a), the semiconductor pellet 2 on the adhesive sheet 3 is placed on the guide 7. After observing the semiconductor pellet 2 in this state with a microscope (not shown), if it is judged to be defective, the pellet collection tube 1 is moved from the standby position 14 to just above the semiconductor pellet 2, and the cam 11
Start. FIG. 5(b) shows a state in which the semiconductor pellet is pushed up together with the adhesive sheet 3 by the push-up rod 8 by the cam IIK. FIG. 5(C) shows a state in which the adhesive sheet 3 is about to separate from the semiconductor pellet 2. Thereafter, as shown in FIG. 5(d), the semiconductor pellets 2 are sucked up into the pellet collecting tube l. Next, the protruding rod moves downward. Move the adhesive sheet and bring the next semiconductor pellet onto the guide. Move the pellet collection tube to the standby position for the next test. These series of operations may be performed manually or automatically using appropriate electrical signals.

[Problem that the invention seeks to solve]

The above-mentioned conventional defective pellet removal apparatus has the disadvantage that when the size of the semiconductor pellet becomes large, it takes time to peel it off from the adhesive sheet, resulting in poor efficiency. or,
If the rising amount of the protruding rod is increased to make it easier for the semiconductor to peel off from the adhesive sheet, the adhesive sheet may be torn by the tip of the protruding rod, or a good pellet adjacent to a defective pellet to be removed may come into contact with the pellet collection tube l. It has the disadvantage of damaging good pellets and making them defective.

[Means for solving problems]

The appearance inspection apparatus for semiconductor pellets of the present invention includes a suction table equipped with a suction surface that vacuum-sucks an adhesive sheet on which a semiconductor pellet is attached, and a predetermined drive signal that synchronizes an up-and-down movement of the suction rod with the vertical movement of the suction table. The present invention has a defective pellet removing device including a second drive mechanism for raising and lowering the suction table, and a pellet collecting pipe provided above the suction table.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a sectional view showing the main parts of an embodiment of the present invention.

This embodiment includes a suction table 5 equipped with a suction surface 15 for vacuum-chucking an adhesive sheet 3 on which a semiconductor pellet 2 is attached, and a first drive mechanism (cylinder cylinder) that moves the suction table 4 up and down in response to a predetermined drive signal. 12), a protruding rod 6 that pushes up the adhesive sheet 3 from the lower part of the suction surface 15, and a second drive mechanism (cam 11) that moves the protruding rod 6 up and down in synchronization with the up and down movement of the suction table 4.
．． The present invention has a defective pellet removing device including a lever 10) and a pellet collecting pipe 1 provided above the suction table 4.

In place of the guide 7 of the conventional example, it is coupled to the cylinder 12,
It is equipped with a suction table 4 that moves up and down in response to a drive signal, but the rest is the same.

Next, the operation of this embodiment will be explained.

FIGS. 2(a) to 2(d) are cross-sectional views arranged in order of operation in order to explain the operation of the embodiment.

First, as shown in FIG. 2(a)K, the appearance of the semiconductor pellets 2 on the suction surface 15 is inspected, and the pellet collection pipe 13 is placed on the suction table 4.

Next, as shown in FIG. 2(b), the cylinder 12 is driven to raise the suction table 4 a certain distance.

Next, as shown in FIG. 2(C), the cam 11 is rotated by a signal that becomes active at the same time as the drive signal for the cylinder 12 or with a slight time delay, so that the protruding rod 6
5. Raise it so that it sticks out.

Then, as shown in FIG. 2(d)K, the semiconductor pellet 2 is sucked into the pellet collection tube 1 through vacuum suction.

Next, the protruding rod 6 and suction table 4 are lowered and returned to the position shown in FIG. 2(a). Move the adhesive sheet and inspect the next semiconductor pellet. Note that when moving the adhesive sheet, vacuum suction by the suction table is not necessarily required.

The adhesive sheet is vacuum-sucked to a suction stand and brought close to the pellet collection tube, and the semiconductor pellets are sucked upward by the pellet collection tube and pushed up by the protruding rod, so that they are easy to peel off and the amount of rise of the protruding rod can be reduced.

〔Effect of the invention〕

As explained above, in the present invention, the defective pellet removal device raises the protruding rod while the vacuum suction table is raised with the adhesive sheet adsorbed on the vacuum suction table. Since it can be made small, the adhesive sheet will not be broken at the tip of the protruding rod, and accidents such as adjacent pellets coming into contact with the pellet collection pipe can also be prevented.

Therefore, according to the present invention, defective pellets can be stably removed in a short period of time, and the semiconductor pellet sorting process can be carried out quickly.

[Brief explanation of the drawing]

FIG. 1 is a sectional view showing the main parts of an embodiment of the present invention, and FIG.
Figures (a) to (d) are cross-sectional views arranged in order of operation to explain the operation of the embodiment, Figure 3 is a top view showing the position of the pellet collection pipe of the conventional example, and Figure 4 is the main part of the conventional example. FIGS. 5(a) to 5(d) are sectional views showing main parts of a conventional example. 1... Pellet collection tube, 2... Semiconductor pellets, 3... Adhesive sheet, 4...
Suction table, 5...Vacuum suction hole, 6...Protrusion bar, 7...Guide, 8...Spring, 9
... Semiconductor pellet, 10 ... Lever, 11 ... Cam, 12 ... Cylinder,
13... Connection pipe, 15-... Adsorption surface. Agent Patent Attorney Shingetsu Uchihara 1 Figure (C) (d) Katana Z Zugetsu 3 Figure 4

Claims (1)

[Claims] a suction table having a suction surface for vacuum-chucking an adhesive sheet on which a semiconductor pellet is attached; a first drive mechanism that moves the suction table up and down in response to a predetermined drive signal; and a suction table that removes the adhesive sheet from below the suction surface. It has a defective pellet removal device including an uplifting rod, a second drive mechanism that moves the uplifting rod up and down in synchronization with the vertical movement of the suction table, and a pellet collection pipe provided above the suction table. A semiconductor pellet appearance inspection device characterized by: