JPH01166586A - Semiconductor laser device - Google Patents

Semiconductor laser device

Info

Publication number
JPH01166586A
JPH01166586A JP32398687A JP32398687A JPH01166586A JP H01166586 A JPH01166586 A JP H01166586A JP 32398687 A JP32398687 A JP 32398687A JP 32398687 A JP32398687 A JP 32398687A JP H01166586 A JPH01166586 A JP H01166586A
Authority
JP
Japan
Prior art keywords
reflectance
semiconductor laser
reflection
noise
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32398687A
Other languages
Japanese (ja)
Inventor
Akio Oishi
大石 昭夫
Takashi Kajimura
梶村 俊
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP32398687A priority Critical patent/JPH01166586A/en
Publication of JPH01166586A publication Critical patent/JPH01166586A/en
Pending legal-status Critical Current

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  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To reduce returning light to the inside of a semiconductor laser and noises caused thereby by applying a reflection coating of a specified reflection factor to the front of a laser and a reflection coating of a reflection factor higher than that of the front to the rear. CONSTITUTION:Coating of two layers and four layer of SiO2, amorphous Si is applied to the front of a laser chip 1 of pulsation semiconductor laser as a front reflection film 2, controlling the reflection factor to be 40-70%. Similarly, coating of SiO2, amorphous Si four layer is applied to the rear of the chip 1 to form a rear reflection film 3 making the reflection factor of 90% higher than the front reflection factor. In this way, returning light into the chip 1 and noises caused thereby are reduced.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体レーザに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to semiconductor lasers.

〔従来の技術〕[Conventional technology]

従来、情報読み出し用光源として半導体レーザを用いる
場合、レーザ端面の反射率は次の4つの場合が用いられ
ていた。
Conventionally, when using a semiconductor laser as a light source for reading information, the following four cases have been used for the reflectance of the laser end face.

l)両面とも〜30%の反射率。l) ~30% reflectance on both sides.

2)前面を〜10%l後面全l後〜100%の反射率。2) ~10% reflectance on the front surface and ~100% reflectance on the entire rear surface.

3)両面とも270%の反射率。3) 270% reflectance on both sides.

4)前面を〜lO%、後面〜30−の反射率。4) Reflectance of ~10% on the front side and ~30-30 on the back side.

3)の両端面高反射率化については、縦単一モードレー
ザ以外には試みられていなかった。
3) Increasing the reflectance of both end faces has not been attempted for anything other than longitudinal single mode lasers.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来技術は、パルセーション半導体レーザについて
、その雑音をより低減するための端面処理について配慮
がなされておらず、レーザへの戻り光が数チ以上となる
場合、大きな雑音が発生するという問題があった。
The above-mentioned conventional technology does not take into consideration the end face treatment for further reducing the noise of the pulsation semiconductor laser, and there is a problem that large noise is generated when the number of lights returned to the laser is several inches or more. there were.

本発明の目的は、パルセーション半導体レーザをよシ低
雑音にすることにある。
An object of the present invention is to provide a pulsation semiconductor laser with lower noise.

〔問題点を解決するための手段〕[Means for solving problems]

パルセーション半導体レーザは比較的戻り元に対して雑
音が増大しない。しかし、0.5%を越える大きな戻シ
光が存在する場合には大きな雑音が発生する。この雑音
を低減筋せるためには、半導体レーザ内部への戻9光を
、レーザ端面の反射率を大きくすることにより、減らす
ことにより達成される。
The pulsation semiconductor laser has relatively no increase in noise relative to the return source. However, if there is a large amount of returned light exceeding 0.5%, large noise will occur. In order to reduce this noise, the amount of light returning into the semiconductor laser can be reduced by increasing the reflectance of the laser end face.

〔作用〕[Effect]

前面に施された反射コーティングはレーザ外部からの戻
り光を減少させ、雑音を低減させる。この時、前面への
光の取シ出し効率を上げるため。
A reflective coating on the front side reduces light returning from outside the laser, reducing noise. At this time, to increase the efficiency of light extraction to the front.

後面へ前面より高い反射率のコーティングを施す必要が
ある。単純に雑音を低減させるためには。
It is necessary to apply a coating with higher reflectivity to the rear surface than to the front surface. To simply reduce noise.

前面の反射率は高い程効果は大きい。しかし、前面の反
射率を70%以上とした場合、パルセーションが生じな
くなる。このため、前面の反射率は70%以下とするこ
とが必要である。
The higher the reflectance of the front surface, the greater the effect. However, when the reflectance of the front surface is set to 70% or more, pulsation does not occur. Therefore, the reflectance of the front surface needs to be 70% or less.

〔実施例〕〔Example〕

本発明の一実施例を第1図により説明する。半導体レー
ザl(半導体レーザチップ部を示す)の前方にS lO
z 、アモルファスSiの2層、4層コーティングを用
いその反射率を40〜90%の間に制御した。後方3は
、同様にS 10 z eアモルファスSi4層コーテ
ィングによりその反射率を9096とした。この素子を
用い1通常光ディスク等の読み出し時に使用される出力
2〜6mWで半導体レーザを駆動し、戻り光5チの条件
下で雑音の最悪値を求め友。第2図に、雑音の最悪値と
前方反射率の関係を示す。反射コーティングを施さない
場合の反射率は〜32%で、反射コーティングを用い前
方反射率t40%以上にすることにより、雑音を5dB
以上低減することができる。−方、前方反射率を変化さ
せた時、2〜6mWの出力領域でパルセーションを生じ
る素子の割合を第3図に示す。反射率70%以上では、
パルセーションを生じる確率は急激に減少する。パルセ
ーションを生じない素子は縦シングルモードで発振し、
その雑音は10−”H2以上となる。以上の点よシ、前
方反射率を70%以上にすることは実用的でない。対し
て、前方反射率を40〜80%とした場合、パルセーシ
ョンを生じる割合の低下は小さく、かつ雑音t−5dB
以上低減することができる。なお、本実施例においては
後方の反射率を90%と前方反射率よりも大きくしてい
る。これは前方のみを高反射率にすると、後方への出射
光が大きくなシ、出力効率が悪化するため、前方に較べ
後方の反射率を高くすることによシ、出力効率の劣化を
抑えている。本実施例においては、後方反射率t−90
%としたが、これは、上記の点より、前方反射率よシ高
ければ良い。
An embodiment of the present invention will be explained with reference to FIG. In front of the semiconductor laser l (semiconductor laser chip part shown)
z, two-layer and four-layer coatings of amorphous Si were used to control the reflectance between 40 and 90%. The rear part 3 was similarly coated with four layers of S 10 ze amorphous Si to give a reflectance of 9096. Using this element, we drove a semiconductor laser with an output of 2 to 6 mW, which is normally used when reading optical discs, etc., and found the worst value of noise under the condition of 5 inches of returned light. FIG. 2 shows the relationship between the worst value of noise and the forward reflectance. The reflectance without reflective coating is ~32%, and by using reflective coating and increasing the forward reflectance t to 40% or more, the noise can be reduced to 5 dB.
It is possible to reduce the amount by more than 100%. On the other hand, FIG. 3 shows the percentage of elements that produce pulsation in the output range of 2 to 6 mW when the forward reflectance is varied. At reflectance of 70% or more,
The probability of producing a pulsation decreases rapidly. Elements that do not produce pulsation oscillate in a single longitudinal mode,
The noise will be 10-"H2 or more. Considering the above points, it is not practical to increase the forward reflectance to 70% or more. On the other hand, if the forward reflectance is set to 40 to 80%, the pulsation will be reduced. The resulting rate decrease is small and the noise t-5dB
It is possible to reduce the amount by more than 100%. In this embodiment, the rear reflectance is 90%, which is greater than the front reflectance. This is because if only the front side has a high reflectance, the amount of light emitted to the rear will be large and the output efficiency will deteriorate, so by increasing the reflectance at the rear compared to the front, it is possible to suppress the deterioration in output efficiency. There is. In this example, the rear reflectance t-90
%, but this should be higher than the forward reflectance from the above point.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、パルセーション半導体レーザの雑音を
5〜20dB改善することができる。
According to the present invention, the noise of a pulsation semiconductor laser can be improved by 5 to 20 dB.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は半導体レーザの概観断面図である。第2図は前
方反射率とレーザ雑音の関係を示す図。 第3図は前方反射率とパルセーションを起こす素子の割
合(確率)の関係を示す図である。 ヤへ 貰・酢9
FIG. 1 is a schematic cross-sectional view of a semiconductor laser. FIG. 2 is a diagram showing the relationship between forward reflectance and laser noise. FIG. 3 is a diagram showing the relationship between the forward reflectance and the proportion (probability) of elements that cause pulsation. Yahegeta・Vinegar 9

Claims (1)

【特許請求の範囲】[Claims] 1、直流で動作させた時にパルス状の発生をするパルセ
ーシヨン半導体レーザにおいて、その前面に40〜70
%の反射率となる反射コーティングを、後面に前面より
高い反射率となる反射コーティングを施したことを特徴
とする半導体レーザ装置。
1. In a pulsation semiconductor laser that generates pulses when operated with direct current, there are 40 to 70
1. A semiconductor laser device characterized by having a reflective coating on the rear surface with a reflectance of 1.5% and a reflective coating on the rear surface with a higher reflectance than the front surface.
JP32398687A 1987-12-23 1987-12-23 Semiconductor laser device Pending JPH01166586A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32398687A JPH01166586A (en) 1987-12-23 1987-12-23 Semiconductor laser device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32398687A JPH01166586A (en) 1987-12-23 1987-12-23 Semiconductor laser device

Publications (1)

Publication Number Publication Date
JPH01166586A true JPH01166586A (en) 1989-06-30

Family

ID=18160845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32398687A Pending JPH01166586A (en) 1987-12-23 1987-12-23 Semiconductor laser device

Country Status (1)

Country Link
JP (1) JPH01166586A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04329687A (en) * 1991-05-01 1992-11-18 Sharp Corp Semiconductor laser device
JPH0964460A (en) * 1995-08-30 1997-03-07 Nec Corp Distributed feedback semiconductor laser
JP2008047692A (en) * 2006-08-16 2008-02-28 Sony Corp Self-induced oscillating semiconductor laser and manufacturing method therefor

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04329687A (en) * 1991-05-01 1992-11-18 Sharp Corp Semiconductor laser device
JPH0964460A (en) * 1995-08-30 1997-03-07 Nec Corp Distributed feedback semiconductor laser
JP2008047692A (en) * 2006-08-16 2008-02-28 Sony Corp Self-induced oscillating semiconductor laser and manufacturing method therefor

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