JPH01162245U - - Google Patents
Info
- Publication number
- JPH01162245U JPH01162245U JP5579988U JP5579988U JPH01162245U JP H01162245 U JPH01162245 U JP H01162245U JP 5579988 U JP5579988 U JP 5579988U JP 5579988 U JP5579988 U JP 5579988U JP H01162245 U JPH01162245 U JP H01162245U
- Authority
- JP
- Japan
- Prior art keywords
- glass
- lid
- insulating base
- glass layer
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011521 glass Substances 0.000 claims description 6
- 238000007789 sealing Methods 0.000 description 3
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5579988U JPH01162245U (enEXAMPLES) | 1988-04-25 | 1988-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5579988U JPH01162245U (enEXAMPLES) | 1988-04-25 | 1988-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01162245U true JPH01162245U (enEXAMPLES) | 1989-11-10 |
Family
ID=31281700
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5579988U Pending JPH01162245U (enEXAMPLES) | 1988-04-25 | 1988-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01162245U (enEXAMPLES) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59124146A (ja) * | 1982-12-29 | 1984-07-18 | Nec Corp | 硝子封止半導体装置の製造方法 |
-
1988
- 1988-04-25 JP JP5579988U patent/JPH01162245U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59124146A (ja) * | 1982-12-29 | 1984-07-18 | Nec Corp | 硝子封止半導体装置の製造方法 |
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