JPH01161390U - - Google Patents
Info
- Publication number
- JPH01161390U JPH01161390U JP5775588U JP5775588U JPH01161390U JP H01161390 U JPH01161390 U JP H01161390U JP 5775588 U JP5775588 U JP 5775588U JP 5775588 U JP5775588 U JP 5775588U JP H01161390 U JPH01161390 U JP H01161390U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- aluminum
- applying
- utility
- model registration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 239000007769 metal material Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図はこの考案に係る放熱板の一実施例を示
す正面図、第２図は第１図に示した放熱板のプリ
ント基板への組付説明図である。第３図は従来の
放熱板を示す正面図、第４図は第３図に示した放
熱板のプリント基板への組付説明図である。
５……アルミ放熱板、６……リード部分、７…
…金属被膜、８……プリント基板、９……貫通孔
、１０……半田。
FIG. 1 is a front view showing an embodiment of a heat sink according to the invention, and FIG. 2 is an explanatory diagram of how the heat sink shown in FIG. 1 is assembled to a printed circuit board. FIG. 3 is a front view showing a conventional heat sink, and FIG. 4 is an explanatory diagram of how the heat sink shown in FIG. 3 is assembled to a printed circuit board. 5...Aluminum heat sink, 6...Lead part, 7...
...Metal coating, 8...Printed circuit board, 9...Through hole, 10...Solder.
Claims (1)
材料を被着して金属被膜を形成したことを特徴と
する放熱板。[Claims for Utility Model Registration] A heat sink made of aluminum, characterized in that a metal film is formed by applying a solderable metal material to at least the lead portions of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5775588U JPH01161390U (en) | 1988-04-28 | 1988-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5775588U JPH01161390U (en) | 1988-04-28 | 1988-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01161390U true JPH01161390U (en) | 1989-11-09 |
Family
ID=31283597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5775588U Pending JPH01161390U (en) | 1988-04-28 | 1988-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01161390U (en) |
-
1988
- 1988-04-28 JP JP5775588U patent/JPH01161390U/ja active Pending